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公开(公告)号：US07928545B2
公开(公告)日：2011-04-19
申请号：US11416107
申请日：2006-05-03
申请人： Ki-hwan Kwon , Kyu-ho Shin , Soon-cheol Kweon , Chang-youl Moon , Arthur Darbinian , Seung-tae Choi , Su-ho Shin
发明人： Ki-hwan Kwon , Kyu-ho Shin , Soon-cheol Kweon , Chang-youl Moon , Arthur Darbinian , Seung-tae Choi , Su-ho Shin
IPC分类号： H01L23/495
CPC分类号： H01L33/647 , H01L24/97 , H01L33/486 , H01L33/58 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/49109 , H01L2224/73265 , H01L2924/01019 , H01L2924/07802 , H01L2924/12041 , Y10T29/49002 , H01L2924/00014 , H01L2924/00
摘要： An LED package and a fabrication method thereof are provided. The LED package includes an upper metal plate having an LED-receiving hole therein; a lower metal plate disposed under the upper metal plate; and an insulator which the upper metal plate and the lower metal plate from each other. A portion of the lower metal plate is exposed via the LED-receiving hole and an LED is mounted on the exposed portion of the lower metal plate and is electrically connected to both of the upper and lower metal plates. A protective cover encloses and protects exposed surfaces of the upper and lower metal plates.
摘要翻译： 提供一种LED封装及其制造方法。 LED封装包括在其中具有LED接收孔的上金属板; 设置在所述上金属板下方的下金属板; 以及上金属板和下金属板彼此之间的绝缘体。 下部金属板的一部分经由LED接收孔露出，并且LED被安装在下部金属板的暴露部分上并与上部和下部金属板电连接。 保护盖包围并保护上下金属板的暴露表面。
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公开(公告)号：US20070039164A1
公开(公告)日：2007-02-22
申请号：US11416107
申请日：2006-05-03
申请人： Ki-hwan Kwon , Kyu-ho Shin , Soon-cheol Kweon , Chang-youl Moon , Arthur Darbinian , Seung-tae Choi , Su-ho Shin
发明人： Ki-hwan Kwon , Kyu-ho Shin , Soon-cheol Kweon , Chang-youl Moon , Arthur Darbinian , Seung-tae Choi , Su-ho Shin
IPC分类号： H01S4/00
CPC分类号： H01L33/647 , H01L24/97 , H01L33/486 , H01L33/58 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/49109 , H01L2224/73265 , H01L2924/01019 , H01L2924/07802 , H01L2924/12041 , Y10T29/49002 , H01L2924/00014 , H01L2924/00
摘要： An LED package and a fabrication method thereof are provided. The LED package includes an upper metal plate having an LED-receiving hole therein; a lower metal plate disposed under the upper metal plate; and an insulator which the upper metal plate and the lower metal plate from each other. A portion of the lower metal plate is exposed via the LED-receiving hole and an LED is mounted on the exposed portion of the lower metal plate and is electrically connected to both of the upper and lower metal plates. A protective cover encloses and protects exposed surfaces of the upper and lower metal plates.
摘要翻译： 提供一种LED封装及其制造方法。 LED封装包括在其中具有LED接收孔的上金属板; 设置在所述上金属板下方的下金属板; 以及上金属板和下金属板彼此之间的绝缘体。 下部金属板的一部分经由LED接收孔露出，并且LED被安装在下部金属板的暴露部分上并与上部和下部金属板电连接。 保护盖包围并保护上下金属板的暴露表面。
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公开(公告)号：US08334585B2
公开(公告)日：2012-12-18
申请号：US13077186
申请日：2011-03-31
申请人： Ki-hwan Kwon , Kyu-ho Shin , Soon-cheol Kweon , Chang-youl Moon , Arthur Darbinian , Seung-tae Choi , Su-ho Shin
发明人： Ki-hwan Kwon , Kyu-ho Shin , Soon-cheol Kweon , Chang-youl Moon , Arthur Darbinian , Seung-tae Choi , Su-ho Shin
IPC分类号： H01L23/495
CPC分类号： H01L33/647 , H01L24/97 , H01L33/486 , H01L33/58 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/49109 , H01L2224/73265 , H01L2924/01019 , H01L2924/07802 , H01L2924/12041 , Y10T29/49002 , H01L2924/00014 , H01L2924/00
摘要： An LED package and a fabrication method thereof are provided. The LED package includes an upper metal plate having an LED-receiving hole therein; a lower metal plate disposed under the upper metal plate; and an insulator which the upper metal plate and the lower metal plate from each other. A portion of the lower metal plate is exposed via the LED-receiving hole and an LED is mounted on the exposed portion of the lower metal plate and is electrically connected to both of the upper and lower metal plates. A protective cover encloses and protects exposed surfaces of the upper and lower metal plates.
摘要翻译： 提供一种LED封装及其制造方法。 LED封装包括在其中具有LED接收孔的上金属板; 设置在所述上金属板下方的下金属板; 以及上金属板和下金属板彼此之间的绝缘体。 下部金属板的一部分经由LED接收孔露出，并且LED被安装在下部金属板的暴露部分上并与上部和下部金属板电连接。 保护盖包围并保护上下金属板的暴露表面。
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4.发明授权公开(公告)号：US08592231B2
公开(公告)日：2013-11-26
申请号：US12883815
申请日：2010-09-16
申请人： Su-ho Shin , Soon-cheol Kweon , Kyu-ho Shin , Ki-hwan Kwon , Seung-tae Choi , Chang-youl Moon
发明人： Su-ho Shin , Soon-cheol Kweon , Kyu-ho Shin , Ki-hwan Kwon , Seung-tae Choi , Chang-youl Moon
IPC分类号： H01L21/00
CPC分类号： H01L33/647 , H01L25/0753 , H01L33/486 , H01L33/62 , H01L33/642 , H01L2224/32188 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/12041 , H01L2924/00014 , H01L2924/00
摘要： An LED package includes a substrate having an electrically conductive portion and an electrically non-conductive portion composed of an oxide of the conductive portion; an LED mounted on the conductive portion and electrically connected to the conductive portion; a first electrode disposed on the non-conductive portion and electrically connected to the LED by a wire; and a second electrode disposed on the substrate and electrically connected to the LED.
摘要翻译： LED封装包括具有导电部分的基板和由导电部分的氧化物组成的非导电部分; 安装在所述导电部分上并电连接到所述导电部分的LED; 第一电极，设置在非导电部分上，并通过导线与LED电连接; 以及设置在所述基板上并电连接到所述LED的第二电极。
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5.发明申请公开(公告)号：US20110003412A1
公开(公告)日：2011-01-06
申请号：US12883815
申请日：2010-09-16
申请人： Su-ho SHIN , Soon-cheol Kweon , Kyu-ho Shin , Ki-hwan Kwon , Seung-tae Choi , Chang-youl Moon
发明人： Su-ho SHIN , Soon-cheol Kweon , Kyu-ho Shin , Ki-hwan Kwon , Seung-tae Choi , Chang-youl Moon
IPC分类号： H01L33/48
CPC分类号： H01L33/647 , H01L25/0753 , H01L33/486 , H01L33/62 , H01L33/642 , H01L2224/32188 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/12041 , H01L2924/00014 , H01L2924/00
摘要： An LED package includes a substrate having an electrically conductive portion and an electrically non-conductive portion composed of an oxide of the conductive portion; an LED mounted on the conductive portion and electrically connected to the conductive portion; a first electrode disposed on the non-conductive portion and electrically connected to the LED by a wire; and a second electrode disposed on the substrate and electrically connected to the LED.
摘要翻译： LED封装包括具有导电部分的基板和由导电部分的氧化物组成的非导电部分; 安装在所述导电部分上并电连接到所述导电部分的LED; 第一电极，设置在非导电部分上，并通过导线与LED电连接; 以及设置在所述基板上并电连接到所述LED的第二电极。
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6.发明申请公开(公告)号：US20070023893A1
公开(公告)日：2007-02-01
申请号：US11408101
申请日：2006-04-21
申请人： Su-ho Shin , Soon-cheol Kweon , Kyu-ho Shin , Ki-hwan Kwon , Seung-tae Choi , Chang-youl Moon
发明人： Su-ho Shin , Soon-cheol Kweon , Kyu-ho Shin , Ki-hwan Kwon , Seung-tae Choi , Chang-youl Moon
IPC分类号： H01L23/34
CPC分类号： H01L33/647 , H01L25/0753 , H01L33/486 , H01L33/62 , H01L33/642 , H01L2224/32188 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/12041 , H01L2924/00014 , H01L2924/00
摘要： An LED package includes a substrate having an electrically conductive portion and an electrically non-conductive portion composed of an oxide of the conductive portion; an LED mounted on the conductive portion and electrically connected to the conductive portion; a first electrode disposed on the non-conductive portion and electrically connected to the LED by a wire; and a second electrode disposed on the substrate and electrically connected to the LED.
摘要翻译： LED封装包括具有导电部分的基板和由导电部分的氧化物组成的非导电部分; 安装在所述导电部分上并电连接到所述导电部分的LED; 第一电极，设置在非导电部分上，并通过导线与LED电连接; 以及设置在所述基板上并电连接到所述LED的第二电极。
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公开(公告)号：US08002443B2
公开(公告)日：2011-08-23
申请号：US11473188
申请日：2006-06-23
申请人： Su-ho Shin , Chang-youl Moon , Kyu-ho Shin , Soon-cheol Kweon , Seung-tae Choi , Ki-hwan Kwon
发明人： Su-ho Shin , Chang-youl Moon , Kyu-ho Shin , Soon-cheol Kweon , Seung-tae Choi , Ki-hwan Kwon
IPC分类号： F21V29/00
CPC分类号： F21V29/51 , F21K9/00 , F21V29/52 , F21V29/67 , F21V29/677 , F21Y2105/10 , F21Y2115/10 , H01L33/648 , H01L2224/48091 , H01L2224/73265 , H05K1/0203 , H05K1/0272 , H05K2201/10106 , H01L2924/00014
摘要： A light emitting diode (LED) array module includes a plurality of LEDs; and a substrate which mounts the LEDs and has a built-in cooling device for cooling heat generated when the LED is driven. The cooling device includes a heat radiation space formed on the substrate and a minute passage member which is wick- or mesh-structured to form a plurality of minute passages that operate by a heat pipe principle in the heat radiation space. The cooling device operating by the heat pipe principle is integrally formed on the substrate mounted with the LEDs, so heat radiation performance of the LEDs is enhanced, such that the LEDs can operate stably for a long time.
摘要翻译： 发光二极管（LED）阵列模块包括多个LED; 以及安装LED并具有内置冷却装置的基板，用于冷却LED被驱动时产生的热量。 冷却装置包括形成在基板上的散热空间和微通道构件，其是芯或网状构造以形成通过热管原理在热辐射空间中操作的多个微小通道。 通过热管原理操作的冷却装置一体地形成在安装有LED的基板上，因此LED的散热性能得到增强，使得LED可以长时间稳定地工作。
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8.发明授权公开(公告)号：US07821027B2
公开(公告)日：2010-10-26
申请号：US11408101
申请日：2006-04-21
申请人： Su-ho Shin , Soon-cheol Kweon , Kyu-ho Shin , Ki-hwan Kwon , Seung-tae Choi , Chang-youl Moon
发明人： Su-ho Shin , Soon-cheol Kweon , Kyu-ho Shin , Ki-hwan Kwon , Seung-tae Choi , Chang-youl Moon
IPC分类号： H01L29/74
CPC分类号： H01L33/647 , H01L25/0753 , H01L33/486 , H01L33/62 , H01L33/642 , H01L2224/32188 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/12041 , H01L2924/00014 , H01L2924/00
摘要： An LED package includes a substrate having an electrically conductive portion and an electrically non-conductive portion composed of an oxide of the conductive portion; an LED mounted on the conductive portion and electrically connected to the conductive portion; a first electrode disposed on the non-conductive portion and electrically connected to the LED by a wire; and a second electrode disposed on the substrate and electrically connected to the LED.
摘要翻译： LED封装包括具有导电部分的基板和由导电部分的氧化物组成的非导电部分; 安装在所述导电部分上并电连接到所述导电部分的LED; 第一电极，设置在非导电部分上，并通过导线与LED电连接; 以及设置在所述基板上并电连接到所述LED的第二电极。
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公开(公告)号：US20070194336A1
公开(公告)日：2007-08-23
申请号：US11520834
申请日：2006-09-14
申请人： Su-ho Shin , Kyu Ho Shin , Jin-seung Choi , Soon Cheol Kweon , Seung-tae Choi , Ki-hwan Kwon , Chang Youl Moon
发明人： Su-ho Shin , Kyu Ho Shin , Jin-seung Choi , Soon Cheol Kweon , Seung-tae Choi , Ki-hwan Kwon , Chang Youl Moon
CPC分类号： H01L33/483 , H01L33/62 , H01L33/64 , H01L33/641 , H01L2224/73265 , H01L2224/48091 , H01L2924/00014
摘要： A light emitting device package including: a heat dissipating substrate including a cavity; a first conductive pattern formed on the cavity; a light emitting device installed on the first conductive pattern; and a second conductive pattern formed on the heat dissipating substrate at a periphery of the first conductive pattern. The second conductive pattern is electrically separated from the first conductive pattern, and the first and second conductive patterns supply power required for operating the light emitting device.
摘要翻译： 1.一种发光器件封装，包括：散热衬底，其包括空腔; 形成在所述空腔上的第一导电图案; 安装在第一导电图案上的发光器件; 以及形成在第一导电图案的周边的散热基板上的第二导电图案。 第二导电图案与第一导电图案电分离，并且第一和第二导电图案提供操作发光器件所需的功率。
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公开(公告)号：US20070001582A1
公开(公告)日：2007-01-04
申请号：US11473188
申请日：2006-06-23
申请人： Su-ho Shin , Chang-youl Moon , Kyu-ho Shin , Soon-cheol Kweon , Seung-tae Choi , Ki-hwan Kwon
发明人： Su-ho Shin , Chang-youl Moon , Kyu-ho Shin , Soon-cheol Kweon , Seung-tae Choi , Ki-hwan Kwon
IPC分类号： H01J1/62
CPC分类号： F21V29/51 , F21K9/00 , F21V29/52 , F21V29/67 , F21V29/677 , F21Y2105/10 , F21Y2115/10 , H01L33/648 , H01L2224/48091 , H01L2224/73265 , H05K1/0203 , H05K1/0272 , H05K2201/10106 , H01L2924/00014
摘要： A light emitting diode (LED) array module includes a plurality of LEDs; and a substrate which mounts the LEDs and has a built-in cooling device for cooling heat generated when the LED is driven. The cooling device includes a heat radiation space formed on the substrate and a minute passage member which is wick- or mesh-structured to form a plurality of minute passages that operate by a heat pipe principle in the heat radiation space. The cooling device operating by the heat pipe principle is integrally formed on the substrate mounted with the LEDs, so heat radiation performance of the LEDs is enhanced, such that the LEDs can operate stably for a long time.
摘要翻译： 发光二极管（LED）阵列模块包括多个LED; 以及安装LED并具有内置冷却装置的基板，用于冷却LED被驱动时产生的热量。 冷却装置包括形成在基板上的散热空间和微通道构件，其是芯或网状构造以形成通过热管原理在热辐射空间中操作的多个微小通道。 通过热管原理操作的冷却装置一体地形成在安装有LED的基板上，因此LED的散热性能得到增强，使得LED可以长时间稳定地工作。
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