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公开(公告)号：US20080130223A1
公开(公告)日：2008-06-05
申请号：US11933690
申请日：2007-11-01
CPC分类号： H05K7/20927 , H01L2224/48137 , H01L2224/48139 , H01L2224/48472 , H01L2224/49111 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H02M7/003 , H01L2924/00
摘要： First and second bases and composing a coolant path structure are arranged at the middle stage of the power converter, and semiconductor modules and a capacitor are arranged on both surfaces of the coolant path structure. Furthermore, through-holes are formed in the first and second bases, and cables of DC and AC circuits are laid via the through-holes.
摘要翻译： 在功率转换器的中间部分设置有第一和第二基座并构成冷却剂路径结构，并且在冷却剂路径结构的两个表面上设置半导体模块和电容器。 此外，在第一和第二基座中形成通孔，并且通过通孔布置直流和交流电路的电缆。
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公开(公告)号：US08411441B2
公开(公告)日：2013-04-02
申请号：US13112138
申请日：2011-05-20
IPC分类号： H05K7/20
CPC分类号： H05K7/2089 , B60L3/003 , B60L11/123 , B60L11/14 , B60L11/1861 , B60L15/007 , B60L15/20 , B60L2210/10 , B60L2210/30 , B60L2210/40 , B60L2220/14 , B60L2220/42 , B60L2240/12 , B60L2240/36 , B60L2240/421 , B60L2240/441 , B60L2240/525 , B60L2260/26 , B60L2260/28 , H02M7/003 , H05K7/20927 , Y02T10/6217 , Y02T10/645 , Y02T10/646 , Y02T10/7005 , Y02T10/7022 , Y02T10/7044 , Y02T10/705 , Y02T10/7077 , Y02T10/7216 , Y02T10/7241 , Y02T10/7275 , Y02T90/16
摘要： A casing houses: semiconductor modules constituting a main circuit for power conversion; a capacitor electrically connected to the main circuit; drive circuits that provide the main circuit with a drive signal used in power conversion operation; a control circuit that provides the drive circuit with a control signal used to prompt the drive circuit to provide the drive signal. Within the casing, a cooling chamber including a coolant passage is formed, and a chamber wall of the cooling chamber is formed with a thermally conductive material. At least the semiconductor modules are housed inside the cooling chamber, and at least the capacitor and the control circuit are disposed outside the cooling chamber.
摘要翻译： 壳体容纳：构成用于电力转换的主电路的半导体模块; 电连接到主电路的电容器; 为主电路提供用于电力转换操作的驱动信号的驱动电路; 为驱动电路提供用于提示驱动电路提供驱动信号的控制信号的控制电路。 在壳体内形成有包括冷却剂通道的冷却室，并且用导热材料形成冷却室的室壁。 至少半导体模块容纳在冷却室内，并且至少电容器和控制电路设置在冷却室的外部。
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公开(公告)号：US20110235270A1
公开(公告)日：2011-09-29
申请号：US13112138
申请日：2011-05-20
IPC分类号： H05K7/20
CPC分类号： H05K7/2089 , B60L3/003 , B60L11/123 , B60L11/14 , B60L11/1861 , B60L15/007 , B60L15/20 , B60L2210/10 , B60L2210/30 , B60L2210/40 , B60L2220/14 , B60L2220/42 , B60L2240/12 , B60L2240/36 , B60L2240/421 , B60L2240/441 , B60L2240/525 , B60L2260/26 , B60L2260/28 , H02M7/003 , H05K7/20927 , Y02T10/6217 , Y02T10/645 , Y02T10/646 , Y02T10/7005 , Y02T10/7022 , Y02T10/7044 , Y02T10/705 , Y02T10/7077 , Y02T10/7216 , Y02T10/7241 , Y02T10/7275 , Y02T90/16
摘要： The object is to provide a power converter which is capable of minimizing an extent to which the power converter components other than the semiconductor module are thermally affected by the heat originating from the semiconductor module.A casing houses: semiconductor modules constituting a main circuit for power conversion; a capacitor electrically connected to the main circuit; drive circuits that provide the main circuit with a drive signal used in power conversion operation; a control circuit that provides the drive circuit with a control signal used to prompt the drive circuit to provide the drive signal. Within the casing, a cooling chamber including a coolant passage is formed, and a chamber wall of the cooling chamber is formed with a thermally conductive material. At least the semiconductor modules are housed inside the cooling chamber, and at least the capacitor and the control circuit are disposed outside the cooling chamber.
摘要翻译： 本发明的目的是提供一种功率转换器，该功率转换器能够最小化半导体模块以外的功率转换器部件受来自半导体模块的热的热影响的程度。 壳体容纳：构成用于电力转换的主电路的半导体模块; 电连接到主电路的电容器; 为主电路提供用于电力转换操作的驱动信号的驱动电路; 为驱动电路提供用于提示驱动电路提供驱动信号的控制信号的控制电路。 在壳体内形成有包括冷却剂通道的冷却室，并且用导热材料形成冷却室的室壁。 至少半导体模块容纳在冷却室内，并且至少电容器和控制电路设置在冷却室的外部。
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公开(公告)号：US07978468B2
公开(公告)日：2011-07-12
申请号：US12715786
申请日：2010-03-02
IPC分类号： H05K7/20
CPC分类号： H05K7/2089 , B60L3/003 , B60L11/123 , B60L11/14 , B60L11/1861 , B60L15/007 , B60L15/20 , B60L2210/10 , B60L2210/30 , B60L2210/40 , B60L2220/14 , B60L2220/42 , B60L2240/12 , B60L2240/36 , B60L2240/421 , B60L2240/441 , B60L2240/525 , B60L2260/26 , B60L2260/28 , H02M7/003 , H05K7/20927 , Y02T10/6217 , Y02T10/645 , Y02T10/646 , Y02T10/7005 , Y02T10/7022 , Y02T10/7044 , Y02T10/705 , Y02T10/7077 , Y02T10/7216 , Y02T10/7241 , Y02T10/7275 , Y02T90/16
摘要： The object is to provide a power converter which is capable of minimizing an extent to which the power converter components other than the semiconductor module are thermally affected by the heat originating from the semiconductor module.A casing houses: semiconductor modules 20, 30 constituting a main circuit for power conversion; a capacitor 50 electrically connected to the main circuit; drive circuits 70, 71 that provide main circuit with a drive signal used in power conversion operation; a control circuit 74 that provides the drive circuit with a control signal used to prompt the drive circuit to provide the drive signal. Within the casing, a cooling chamber including a coolant passage 28 is formed, and a chamber wall of the cooling chamber is formed with a thermally conductive material. At least the semiconductor modules 20, 30 are housed inside the cooling chamber, and at least the capacitor 50 and the control circuit 74 are disposed outside the cooling chamber
摘要翻译： 本发明的目的是提供一种功率转换器，该功率转换器能够最小化半导体模块以外的功率转换器部件受来自半导体模块的热的热影响的程度。 壳体容纳：构成用于电力转换的主电路的半导体模块20,30; 电连接到主电路的电容器50; 为主电路提供用于电力转换操作的驱动信号的驱动电路70,71; 为驱动电路提供用于提示驱动电路提供驱动信号的控制信号的控制电路74。 在壳体内形成有包括冷却剂通道28的冷却室，并且冷却室的室壁形成有导热材料。 至少半导体模块20,30容纳在冷却室内，并且至少电容器50和控制电路74设置在冷却室的外侧
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公开(公告)号：US07969735B2
公开(公告)日：2011-06-28
申请号：US12161151
申请日：2007-01-17
IPC分类号： H05K7/20
CPC分类号： H05K7/2089 , B60L3/003 , B60L11/123 , B60L11/14 , B60L11/1861 , B60L15/007 , B60L15/20 , B60L2210/10 , B60L2210/30 , B60L2210/40 , B60L2220/14 , B60L2220/42 , B60L2240/12 , B60L2240/36 , B60L2240/421 , B60L2240/441 , B60L2240/525 , B60L2260/26 , B60L2260/28 , H02M7/003 , H05K7/20927 , Y02T10/6217 , Y02T10/645 , Y02T10/646 , Y02T10/7005 , Y02T10/7022 , Y02T10/7044 , Y02T10/705 , Y02T10/7077 , Y02T10/7216 , Y02T10/7241 , Y02T10/7275 , Y02T90/16
摘要： The object is to provide a power converter which is capable of minimizing an extent to which the power converter components other than the semiconductor module are thermally affected by the heat originating from the semiconductor module.A casing houses: semiconductor modules 20, 30 constituting a main circuit for power conversion; a capacitor 50 electrically connected to the main circuit; drive circuits 70, 71 that provide the main circuit with a drive signal used in power conversion operation; a control circuit 74 that provides the drive circuit with a control signal used to prompt the drive circuit to provide the drive signal. Within the casing, a cooling chamber including a coolant passage 28 is formed, and a chamber wall of the cooling chamber is formed with a thermally conductive material. At least the semiconductor modules 20, 30 are housed inside the cooling chamber, and at least the capacitor 50 and the control circuit 74 are disposed outside the cooling chamber.
摘要翻译： 本发明的目的是提供一种功率转换器，该功率转换器能够最小化半导体模块以外的功率转换器部件受来自半导体模块的热的热影响的程度。 壳体容纳：构成用于电力转换的主电路的半导体模块20,30; 电连接到主电路的电容器50; 驱动电路70,71，其向主电路提供用于电力转换操作的驱动信号; 为驱动电路提供用于提示驱动电路提供驱动信号的控制信号的控制电路74。 在壳体内形成有包括冷却剂通道28的冷却室，并且冷却室的室壁形成有导热材料。 至少半导体模块20,30容纳在冷却室内，并且至少电容器50和控制电路74设置在冷却室的外部。
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公开(公告)号：US07830689B2
公开(公告)日：2010-11-09
申请号：US11933690
申请日：2007-11-01
IPC分类号： H02M1/00
CPC分类号： H05K7/20927 , H01L2224/48137 , H01L2224/48139 , H01L2224/48472 , H01L2224/49111 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H02M7/003 , H01L2924/00
摘要： First and second bases and composing a coolant path structure are arranged at the middle stage of the power converter, and semiconductor modules and a capacitor are arranged on both surfaces of the coolant path structure. Furthermore, through-holes are formed in the first and second bases, and cables of DC and AC circuits are laid via the through-holes.
摘要翻译： 在功率转换器的中间部分设置有第一和第二基座并构成冷却剂路径结构，并且在冷却剂路径结构的两个表面上设置半导体模块和电容器。 此外，在第一和第二基座中形成通孔，并且通过通孔布置直流和交流电路的电缆。
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公开(公告)号：US20100188814A1
公开(公告)日：2010-07-29
申请号：US12715786
申请日：2010-03-02
IPC分类号： H05K7/20
CPC分类号： H05K7/2089 , B60L3/003 , B60L11/123 , B60L11/14 , B60L11/1861 , B60L15/007 , B60L15/20 , B60L2210/10 , B60L2210/30 , B60L2210/40 , B60L2220/14 , B60L2220/42 , B60L2240/12 , B60L2240/36 , B60L2240/421 , B60L2240/441 , B60L2240/525 , B60L2260/26 , B60L2260/28 , H02M7/003 , H05K7/20927 , Y02T10/6217 , Y02T10/645 , Y02T10/646 , Y02T10/7005 , Y02T10/7022 , Y02T10/7044 , Y02T10/705 , Y02T10/7077 , Y02T10/7216 , Y02T10/7241 , Y02T10/7275 , Y02T90/16
摘要： The object is to provide a power converter which is capable of minimizing an extent to which the power converter components other than the semiconductor module are thermally affected by the heat originating from the semiconductor module.A casing houses: semiconductor modules 20, 30 constituting a main circuit for power conversion; a capacitor 50 electrically connected to the main circuit; drive circuits 70, 71 that provide the main circuit with a drive signal used in power conversion operation; a control circuit 74 that provides the drive circuit with a control signal used to prompt the drive circuit to provide the drive signal. Within the casing, a cooling chamber including a coolant passage 28 is formed, and a chamber wall of the cooling chamber is formed with a thermally conductive material. At least the semiconductor modules 20, 30 are housed inside the cooling chamber, and at least the capacitor 50 and the control circuit 74 are disposed outside the cooling chamber.
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公开(公告)号：US20100188813A1
公开(公告)日：2010-07-29
申请号：US12161151
申请日：2007-01-17
IPC分类号： H05K7/20
CPC分类号： H05K7/2089 , B60L3/003 , B60L11/123 , B60L11/14 , B60L11/1861 , B60L15/007 , B60L15/20 , B60L2210/10 , B60L2210/30 , B60L2210/40 , B60L2220/14 , B60L2220/42 , B60L2240/12 , B60L2240/36 , B60L2240/421 , B60L2240/441 , B60L2240/525 , B60L2260/26 , B60L2260/28 , H02M7/003 , H05K7/20927 , Y02T10/6217 , Y02T10/645 , Y02T10/646 , Y02T10/7005 , Y02T10/7022 , Y02T10/7044 , Y02T10/705 , Y02T10/7077 , Y02T10/7216 , Y02T10/7241 , Y02T10/7275 , Y02T90/16
摘要： The object is to provide a power converter which is capable of minimizing an extent to which the power converter components other than the semiconductor module are thermally affected by the heat originating from the semiconductor module.A casing houses: semiconductor modules 20, 30 constituting a main circuit for power conversion; a capacitor 50 electrically connected to the main circuit; drive circuits 70, 71 that provide the main circuit with a drive signal used in power conversion operation; a control circuit 74 that provides the drive circuit with a control signal used to prompt the drive circuit to provide the drive signal. Within the casing, a cooling chamber including a coolant passage 28 is formed, and a chamber wall of the cooling chamber is formed with a thermally conductive material. At least the semiconductor modules 20, 30 are housed inside the cooling chamber, and at least the capacitor 50 and the control circuit 74 are disposed outside the cooling chamber.
摘要翻译： 本发明的目的是提供一种功率转换器，该功率转换器能够最小化半导体模块以外的功率转换器部件受来自半导体模块的热的热影响的程度。 壳体容纳：构成用于电力转换的主电路的半导体模块20,30; 电连接到主电路的电容器50; 驱动电路70,71，其向主电路提供用于电力转换操作的驱动信号; 为驱动电路提供用于提示驱动电路提供驱动信号的控制信号的控制电路74。 在壳体内形成有包括冷却剂通道28的冷却室，并且冷却室的室壁形成有导热材料。 至少半导体模块20,30容纳在冷却室内，并且至少电容器50和控制电路74设置在冷却室的外部。
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公开(公告)号：US20080198548A1
公开(公告)日：2008-08-21
申请号：US12019142
申请日：2008-01-24
IPC分类号： H05K7/20
CPC分类号： H05K7/20927 , H01L2224/48472 , H01L2224/49111 , H01L2924/19107
摘要： A power converter of the present invention includes at least two power semiconductor modules having a plurality of switching devices, at least two cooling jackets having a coolant path for cooling the plurality of power semiconductor modules and equipped with the power semiconductor modules, a capacitor module interposed between the at least two cooling jackets, and a connector provided in the at least two cooling jackets for connecting the coolant path.
摘要翻译： 本发明的功率转换器包括具有多个开关装置的至少两个功率半导体模块，至少两个具有用于冷却多个功率半导体模块并配备有功率半导体模块的冷却剂路径的冷却夹套， 在所述至少两个冷却套之间，以及设置在所述至少两个冷却套中的连接冷却剂路径的连接器。
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公开(公告)号：US07692923B2
公开(公告)日：2010-04-06
申请号：US12019142
申请日：2008-01-24
IPC分类号： H05K7/20
CPC分类号： H05K7/20927 , H01L2224/48472 , H01L2224/49111 , H01L2924/19107
摘要： A power converter of the present invention includes at least two power semiconductor modules having a plurality of switching devices, at least two cooling jackets having a coolant path for cooling the plurality of power semiconductor modules and equipped with the power semiconductor modules, a capacitor module interposed between the at least two cooling jackets, and a connector provided in the at least two cooling jackets for connecting the coolant path.
摘要翻译： 本发明的功率转换器包括具有多个开关装置的至少两个功率半导体模块，至少两个具有用于冷却多个功率半导体模块并配备有功率半导体模块的冷却剂路径的冷却夹套， 在所述至少两个冷却套之间，以及设置在所述至少两个冷却套中的连接冷却剂路径的连接器。
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