摘要:
To provide a simulation technology of ending multiphysics analysis on heat, vibration, and EMC within a practical time and with a low-price computation process at an early stage of product designing, in a noise analysis designing method for an electric device, such as an inverter for automobile, this electric device includes one or more energy sources, a propagation path through which energy from the energy source propagates, and a noise occurring part where an electromagnetic radiated noise occurs due to the energy coming from the propagation path, the method has a step of estimating the occurring noise, such as a occurring radiated noise, by analyzing a path specified by a user by using a calculator, and the path specified by the user is a path of the energy flowing through the propagation path.
摘要:
A junction-current probe is provided which can measure a current flowing in a junction port adapted to connect a circuit board or an electronic apparatus to a chassis under the condition that the circuit board or electronic apparatus is packaged to the chassis. Structurally, the current probe has a circular or rectangular insulator having a hole in the center, a coiled conductor wire for converting linkage flux into voltage, an insulating member for preventing the insulator from making electrical contact with surroundings, an extraction lead for connecting opposite ends of the conductor wire to a cable and the cable for connection to a measurement unit. The current probe is reduced in thickness within in a range in which the condition of packaging to the chassis can remain unchanged.
摘要:
A method for designing a semiconductor apparatus comprising a semiconductor package in consideration of power integrity for a semiconductor chip included in the semiconductor package is disclosed. A target variable for an adjustment target is calculated on the basis of target information about the adjustment target, wherein the target variable is represented in frequency domain, and the adjustment target includes a part of the semiconductor package. The target variable is compared with a predetermined constraint, which is represented in frequency domain, to identify a problematic section, wherein the problematic section corresponds to a frequency region at which the target variable exceeds the predetermined constraint. Design guidelines are decided to solve the identified problematic section.
摘要:
A method for designing a device that comprises a first semiconductor chip, a second semiconductor chip and an adjustment target is disclosed. The first semiconductor chip comprises an input pad, a first power supply pad and a first ground pad. The second semiconductor chip comprises an output pad coupled to the input pad. The adjustment target is connected to the first and the second semiconductor chips. A main target variable is calculated from an input circuit chip model, an output circuit chip model of the second semiconductor chip in frequency domain and a target impedance model of the adjustment target in frequency domain. The input circuit chip model is created by representing the first semiconductor chip in frequency domain in consideration of a first capacitor model between the input pad and the first power supply pad, a second capacitor model between the input pad and the first ground pad, and a chip internal capacitor model between the first power supply pad and the first ground pad. The main target variable is compared with a predetermined constraint represented in frequency domain to decide design guidelines for the adjustment target.
摘要:
First and second bases and composing a coolant path structure are arranged at the middle stage of the power converter, and semiconductor modules and a capacitor are arranged on both surfaces of the coolant path structure. Furthermore, through-holes are formed in the first and second bases, and cables of DC and AC circuits are laid via the through-holes.
摘要:
A method and apparatus for measuring an electric field distribution according to the present invention calculates a distribution of electric field intensity and its direction at arbitrary positions on the surface of the electronic apparatus or its circumference with use of data of measurement positions and measurement results of a potential distribution on a surface of an electronic apparatus. Further, it clearly indicates a flow of electromagnetic energy on the surface or in the circumference of the electronic apparatus by applying mathematical treatments to a magnetic field distribution at circumferential positions of the electronic apparatus. Thus, a distribution of high-frequency electric field generated from the electronic apparatus is measured with high accuracy.
摘要:
A method for designing a semiconductor apparatus comprising a semiconductor package in consideration of power integrity for a semiconductor chip included in the semiconductor package is disclosed. A target variable for an adjustment target is calculated on the basis of target information about the adjustment target, wherein the target variable is represented in frequency domain, and the adjustment target includes a part of the semiconductor package. The target variable is compared with a predetermined constraint, which is represented in frequency domain, to identify a problematic section, wherein the problematic section corresponds to a frequency region at which the target variable exceeds the predetermined constraint. Design guidelines are decided to solve the identified problematic section.
摘要:
Disclosed is a multichip package or system-in package which the logic chip includes a selector circuit which, by transmitting a test mode select signal or a test mode select command to the logic chip, enables access from a logic signal pin connected to the logic chip, to a memory control signal to each of the “m” number of memory chips; and the memory control signal, when viewed from the logic chip, is connected using a one-for-one wiring scheme or a one-for-up-to-m branch wiring scheme, between the selector circuit and each of the “m” number of memory chips. This multichip package or system-in package is low in noise and high in operational reliability.
摘要:
An electronic apparatus is comprised of a circuit apparatus; and an electromagnetic wave absorbing device arranged in the vicinity of the circuit apparatus in an insulating manner with respect to a circuit of the circuit apparatus, and having a metal loop, a portion of which is made of a high resistor. The metal loop contains a first member having a resistor having a resistance value smaller than, or equal to several ohms; and a second member having a resistor having a resistance value larger than, or equal to several ohms, and connected so as to form an electric loop in combination with the first member. The electromagnetic wave absorbing device containing a first member having a resistor having a resistance value smaller than, or equal to several ohms; and a second member having a resistor having a resistance value larger than, or equal to several ohms, and connected so as to form an electric loop in combination with the first member, is mounted on an adhesive tape and the like in order to be attached to an arbitrary electronic appliance. Also, this electromagnetic wave absorbing device is mounted on a circuit board, and an electronic component such as an IC and an LSI as a portion of this structure. As a result, this electromagnetic wave absorbing device realizes suppressions and reductions of electromagnetic noise such as EMI and higher harmonic waves thereof.
摘要:
Provided is a noise equivalent circuit for completing an EMC analysis in a practical time and through a low-cost calculation process at an upstream stage of system design. The noise equivalent circuit includes one or more energy sources; a propagation path for propagation of energy from the energy source including a conductive path such as a cable and an electromagnetic field coupling path due to the coupling of an electric field and a magnetic field with another electronic device or cable; and a GND port connected to a system, and each port is represented by the noise voltage source or the noise current source and the internal impedance. This noise equivalent circuit can determine an external impedance that is varied depending on a load connected externally or the distance from an external device or a cable, whereby the noise of the system as a whole can be analyzed.