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公开(公告)号：US20080130223A1
公开(公告)日：2008-06-05
申请号：US11933690
申请日：2007-11-01
CPC分类号： H05K7/20927 , H01L2224/48137 , H01L2224/48139 , H01L2224/48472 , H01L2224/49111 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H02M7/003 , H01L2924/00
摘要： First and second bases and composing a coolant path structure are arranged at the middle stage of the power converter, and semiconductor modules and a capacitor are arranged on both surfaces of the coolant path structure. Furthermore, through-holes are formed in the first and second bases, and cables of DC and AC circuits are laid via the through-holes.
摘要翻译： 在功率转换器的中间部分设置有第一和第二基座并构成冷却剂路径结构，并且在冷却剂路径结构的两个表面上设置半导体模块和电容器。 此外，在第一和第二基座中形成通孔，并且通过通孔布置直流和交流电路的电缆。
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公开(公告)号：US08411441B2
公开(公告)日：2013-04-02
申请号：US13112138
申请日：2011-05-20
IPC分类号： H05K7/20
CPC分类号： H05K7/2089 , B60L3/003 , B60L11/123 , B60L11/14 , B60L11/1861 , B60L15/007 , B60L15/20 , B60L2210/10 , B60L2210/30 , B60L2210/40 , B60L2220/14 , B60L2220/42 , B60L2240/12 , B60L2240/36 , B60L2240/421 , B60L2240/441 , B60L2240/525 , B60L2260/26 , B60L2260/28 , H02M7/003 , H05K7/20927 , Y02T10/6217 , Y02T10/645 , Y02T10/646 , Y02T10/7005 , Y02T10/7022 , Y02T10/7044 , Y02T10/705 , Y02T10/7077 , Y02T10/7216 , Y02T10/7241 , Y02T10/7275 , Y02T90/16
摘要： A casing houses: semiconductor modules constituting a main circuit for power conversion; a capacitor electrically connected to the main circuit; drive circuits that provide the main circuit with a drive signal used in power conversion operation; a control circuit that provides the drive circuit with a control signal used to prompt the drive circuit to provide the drive signal. Within the casing, a cooling chamber including a coolant passage is formed, and a chamber wall of the cooling chamber is formed with a thermally conductive material. At least the semiconductor modules are housed inside the cooling chamber, and at least the capacitor and the control circuit are disposed outside the cooling chamber.
摘要翻译： 壳体容纳：构成用于电力转换的主电路的半导体模块; 电连接到主电路的电容器; 为主电路提供用于电力转换操作的驱动信号的驱动电路; 为驱动电路提供用于提示驱动电路提供驱动信号的控制信号的控制电路。 在壳体内形成有包括冷却剂通道的冷却室，并且用导热材料形成冷却室的室壁。 至少半导体模块容纳在冷却室内，并且至少电容器和控制电路设置在冷却室的外部。
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公开(公告)号：US20110235270A1
公开(公告)日：2011-09-29
申请号：US13112138
申请日：2011-05-20
IPC分类号： H05K7/20
CPC分类号： H05K7/2089 , B60L3/003 , B60L11/123 , B60L11/14 , B60L11/1861 , B60L15/007 , B60L15/20 , B60L2210/10 , B60L2210/30 , B60L2210/40 , B60L2220/14 , B60L2220/42 , B60L2240/12 , B60L2240/36 , B60L2240/421 , B60L2240/441 , B60L2240/525 , B60L2260/26 , B60L2260/28 , H02M7/003 , H05K7/20927 , Y02T10/6217 , Y02T10/645 , Y02T10/646 , Y02T10/7005 , Y02T10/7022 , Y02T10/7044 , Y02T10/705 , Y02T10/7077 , Y02T10/7216 , Y02T10/7241 , Y02T10/7275 , Y02T90/16
摘要： The object is to provide a power converter which is capable of minimizing an extent to which the power converter components other than the semiconductor module are thermally affected by the heat originating from the semiconductor module.A casing houses: semiconductor modules constituting a main circuit for power conversion; a capacitor electrically connected to the main circuit; drive circuits that provide the main circuit with a drive signal used in power conversion operation; a control circuit that provides the drive circuit with a control signal used to prompt the drive circuit to provide the drive signal. Within the casing, a cooling chamber including a coolant passage is formed, and a chamber wall of the cooling chamber is formed with a thermally conductive material. At least the semiconductor modules are housed inside the cooling chamber, and at least the capacitor and the control circuit are disposed outside the cooling chamber.
摘要翻译： 本发明的目的是提供一种功率转换器，该功率转换器能够最小化半导体模块以外的功率转换器部件受来自半导体模块的热的热影响的程度。 壳体容纳：构成用于电力转换的主电路的半导体模块; 电连接到主电路的电容器; 为主电路提供用于电力转换操作的驱动信号的驱动电路; 为驱动电路提供用于提示驱动电路提供驱动信号的控制信号的控制电路。 在壳体内形成有包括冷却剂通道的冷却室，并且用导热材料形成冷却室的室壁。 至少半导体模块容纳在冷却室内，并且至少电容器和控制电路设置在冷却室的外部。
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公开(公告)号：US07978468B2
公开(公告)日：2011-07-12
申请号：US12715786
申请日：2010-03-02
IPC分类号： H05K7/20
CPC分类号： H05K7/2089 , B60L3/003 , B60L11/123 , B60L11/14 , B60L11/1861 , B60L15/007 , B60L15/20 , B60L2210/10 , B60L2210/30 , B60L2210/40 , B60L2220/14 , B60L2220/42 , B60L2240/12 , B60L2240/36 , B60L2240/421 , B60L2240/441 , B60L2240/525 , B60L2260/26 , B60L2260/28 , H02M7/003 , H05K7/20927 , Y02T10/6217 , Y02T10/645 , Y02T10/646 , Y02T10/7005 , Y02T10/7022 , Y02T10/7044 , Y02T10/705 , Y02T10/7077 , Y02T10/7216 , Y02T10/7241 , Y02T10/7275 , Y02T90/16
摘要： The object is to provide a power converter which is capable of minimizing an extent to which the power converter components other than the semiconductor module are thermally affected by the heat originating from the semiconductor module.A casing houses: semiconductor modules 20, 30 constituting a main circuit for power conversion; a capacitor 50 electrically connected to the main circuit; drive circuits 70, 71 that provide main circuit with a drive signal used in power conversion operation; a control circuit 74 that provides the drive circuit with a control signal used to prompt the drive circuit to provide the drive signal. Within the casing, a cooling chamber including a coolant passage 28 is formed, and a chamber wall of the cooling chamber is formed with a thermally conductive material. At least the semiconductor modules 20, 30 are housed inside the cooling chamber, and at least the capacitor 50 and the control circuit 74 are disposed outside the cooling chamber
摘要翻译： 本发明的目的是提供一种功率转换器，该功率转换器能够最小化半导体模块以外的功率转换器部件受来自半导体模块的热的热影响的程度。 壳体容纳：构成用于电力转换的主电路的半导体模块20,30; 电连接到主电路的电容器50; 为主电路提供用于电力转换操作的驱动信号的驱动电路70,71; 为驱动电路提供用于提示驱动电路提供驱动信号的控制信号的控制电路74。 在壳体内形成有包括冷却剂通道28的冷却室，并且冷却室的室壁形成有导热材料。 至少半导体模块20,30容纳在冷却室内，并且至少电容器50和控制电路74设置在冷却室的外侧
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公开(公告)号：US07969735B2
公开(公告)日：2011-06-28
申请号：US12161151
申请日：2007-01-17
IPC分类号： H05K7/20
CPC分类号： H05K7/2089 , B60L3/003 , B60L11/123 , B60L11/14 , B60L11/1861 , B60L15/007 , B60L15/20 , B60L2210/10 , B60L2210/30 , B60L2210/40 , B60L2220/14 , B60L2220/42 , B60L2240/12 , B60L2240/36 , B60L2240/421 , B60L2240/441 , B60L2240/525 , B60L2260/26 , B60L2260/28 , H02M7/003 , H05K7/20927 , Y02T10/6217 , Y02T10/645 , Y02T10/646 , Y02T10/7005 , Y02T10/7022 , Y02T10/7044 , Y02T10/705 , Y02T10/7077 , Y02T10/7216 , Y02T10/7241 , Y02T10/7275 , Y02T90/16
摘要： The object is to provide a power converter which is capable of minimizing an extent to which the power converter components other than the semiconductor module are thermally affected by the heat originating from the semiconductor module.A casing houses: semiconductor modules 20, 30 constituting a main circuit for power conversion; a capacitor 50 electrically connected to the main circuit; drive circuits 70, 71 that provide the main circuit with a drive signal used in power conversion operation; a control circuit 74 that provides the drive circuit with a control signal used to prompt the drive circuit to provide the drive signal. Within the casing, a cooling chamber including a coolant passage 28 is formed, and a chamber wall of the cooling chamber is formed with a thermally conductive material. At least the semiconductor modules 20, 30 are housed inside the cooling chamber, and at least the capacitor 50 and the control circuit 74 are disposed outside the cooling chamber.
摘要翻译： 本发明的目的是提供一种功率转换器，该功率转换器能够最小化半导体模块以外的功率转换器部件受来自半导体模块的热的热影响的程度。 壳体容纳：构成用于电力转换的主电路的半导体模块20,30; 电连接到主电路的电容器50; 驱动电路70,71，其向主电路提供用于电力转换操作的驱动信号; 为驱动电路提供用于提示驱动电路提供驱动信号的控制信号的控制电路74。 在壳体内形成有包括冷却剂通道28的冷却室，并且冷却室的室壁形成有导热材料。 至少半导体模块20,30容纳在冷却室内，并且至少电容器50和控制电路74设置在冷却室的外部。
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公开(公告)号：US07830689B2
公开(公告)日：2010-11-09
申请号：US11933690
申请日：2007-11-01
IPC分类号： H02M1/00
CPC分类号： H05K7/20927 , H01L2224/48137 , H01L2224/48139 , H01L2224/48472 , H01L2224/49111 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H02M7/003 , H01L2924/00
摘要： First and second bases and composing a coolant path structure are arranged at the middle stage of the power converter, and semiconductor modules and a capacitor are arranged on both surfaces of the coolant path structure. Furthermore, through-holes are formed in the first and second bases, and cables of DC and AC circuits are laid via the through-holes.
摘要翻译： 在功率转换器的中间部分设置有第一和第二基座并构成冷却剂路径结构，并且在冷却剂路径结构的两个表面上设置半导体模块和电容器。 此外，在第一和第二基座中形成通孔，并且通过通孔布置直流和交流电路的电缆。
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公开(公告)号：US20100188814A1
公开(公告)日：2010-07-29
申请号：US12715786
申请日：2010-03-02
IPC分类号： H05K7/20
CPC分类号： H05K7/2089 , B60L3/003 , B60L11/123 , B60L11/14 , B60L11/1861 , B60L15/007 , B60L15/20 , B60L2210/10 , B60L2210/30 , B60L2210/40 , B60L2220/14 , B60L2220/42 , B60L2240/12 , B60L2240/36 , B60L2240/421 , B60L2240/441 , B60L2240/525 , B60L2260/26 , B60L2260/28 , H02M7/003 , H05K7/20927 , Y02T10/6217 , Y02T10/645 , Y02T10/646 , Y02T10/7005 , Y02T10/7022 , Y02T10/7044 , Y02T10/705 , Y02T10/7077 , Y02T10/7216 , Y02T10/7241 , Y02T10/7275 , Y02T90/16
摘要： The object is to provide a power converter which is capable of minimizing an extent to which the power converter components other than the semiconductor module are thermally affected by the heat originating from the semiconductor module.A casing houses: semiconductor modules 20, 30 constituting a main circuit for power conversion; a capacitor 50 electrically connected to the main circuit; drive circuits 70, 71 that provide the main circuit with a drive signal used in power conversion operation; a control circuit 74 that provides the drive circuit with a control signal used to prompt the drive circuit to provide the drive signal. Within the casing, a cooling chamber including a coolant passage 28 is formed, and a chamber wall of the cooling chamber is formed with a thermally conductive material. At least the semiconductor modules 20, 30 are housed inside the cooling chamber, and at least the capacitor 50 and the control circuit 74 are disposed outside the cooling chamber.
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公开(公告)号：US20100188813A1
公开(公告)日：2010-07-29
申请号：US12161151
申请日：2007-01-17
IPC分类号： H05K7/20
CPC分类号： H05K7/2089 , B60L3/003 , B60L11/123 , B60L11/14 , B60L11/1861 , B60L15/007 , B60L15/20 , B60L2210/10 , B60L2210/30 , B60L2210/40 , B60L2220/14 , B60L2220/42 , B60L2240/12 , B60L2240/36 , B60L2240/421 , B60L2240/441 , B60L2240/525 , B60L2260/26 , B60L2260/28 , H02M7/003 , H05K7/20927 , Y02T10/6217 , Y02T10/645 , Y02T10/646 , Y02T10/7005 , Y02T10/7022 , Y02T10/7044 , Y02T10/705 , Y02T10/7077 , Y02T10/7216 , Y02T10/7241 , Y02T10/7275 , Y02T90/16
摘要： The object is to provide a power converter which is capable of minimizing an extent to which the power converter components other than the semiconductor module are thermally affected by the heat originating from the semiconductor module.A casing houses: semiconductor modules 20, 30 constituting a main circuit for power conversion; a capacitor 50 electrically connected to the main circuit; drive circuits 70, 71 that provide the main circuit with a drive signal used in power conversion operation; a control circuit 74 that provides the drive circuit with a control signal used to prompt the drive circuit to provide the drive signal. Within the casing, a cooling chamber including a coolant passage 28 is formed, and a chamber wall of the cooling chamber is formed with a thermally conductive material. At least the semiconductor modules 20, 30 are housed inside the cooling chamber, and at least the capacitor 50 and the control circuit 74 are disposed outside the cooling chamber.
摘要翻译： 本发明的目的是提供一种功率转换器，该功率转换器能够最小化半导体模块以外的功率转换器部件受来自半导体模块的热的热影响的程度。 壳体容纳：构成用于电力转换的主电路的半导体模块20,30; 电连接到主电路的电容器50; 驱动电路70,71，其向主电路提供用于电力转换操作的驱动信号; 为驱动电路提供用于提示驱动电路提供驱动信号的控制信号的控制电路74。 在壳体内形成有包括冷却剂通道28的冷却室，并且冷却室的室壁形成有导热材料。 至少半导体模块20,30容纳在冷却室内，并且至少电容器50和控制电路74设置在冷却室的外部。
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9.发明授权公开(公告)号：US08089291B2
公开(公告)日：2012-01-03
申请号：US12817328
申请日：2010-06-17
申请人： Hiroki Funato , Takashi Suga
发明人： Hiroki Funato , Takashi Suga
IPC分类号： G01R19/00
CPC分类号： G01R29/085 , G01R15/148
摘要： A junction-current probe is provided which can measure a current flowing in a junction port adapted to connect a circuit board or an electronic apparatus to a chassis under the condition that the circuit board or electronic apparatus is packaged to the chassis. Structurally, the current probe has a circular or rectangular insulator having a hole in the center, a coiled conductor wire for converting linkage flux into voltage, an insulating member for preventing the insulator from making electrical contact with surroundings, an extraction lead for connecting opposite ends of the conductor wire to a cable and the cable for connection to a measurement unit. The current probe is reduced in thickness within in a range in which the condition of packaging to the chassis can remain unchanged.
摘要翻译： 提供了一种结流电流探针，其可以在将电路板或电子设备封装到底盘的条件下测量在适于将电路板或电子设备连接到机架的接合端口中流动的电流。 在结构上，电流探头具有在中心具有孔的圆形或矩形绝缘体，用于将链接磁通转换为电压的线圈导线，用于防止绝缘体与周围环境电接触的绝缘构件，用于连接相对端的引出线 的导线连接到电缆和用于连接到测量单元的电缆。 电流探头的厚度在包装到底盘的状态保持不变的范围内。
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10.发明授权公开(公告)号：US08085548B2
公开(公告)日：2011-12-27
申请号：US11847418
申请日：2007-08-30
申请人： Hiroki Funato , Takashi Suga
发明人： Hiroki Funato , Takashi Suga
IPC分类号： H05K1/18
CPC分类号： H05K9/0039 , H05K1/0215 , H05K1/0231 , H05K1/116 , H05K3/325 , H05K3/429 , H05K2201/09345 , H05K2201/0979 , H05K2201/10409
摘要： There is provided a circuit substrate to be mounted in an electronic apparatus, and the circuit substrate has a power supply and a GND. The GND of the circuit substrate is electrically connected to GNDs of other components of the electronic apparatus through connecting parts. The circuit substrate has a part or circuit that implements a low impedance in an intended frequency range between the peripheral conductor of the connecting part opening to be used for the connection and the power supply of the circuit substrate.
摘要翻译： 提供了要安装在电子设备中的电路基板，并且电路基板具有电源和GND。 电路基板的GND通过连接部与电子设备的其他部件的GND电连接。 电路基板具有在要用于连接的连接部分开口的外围导体和电路基板的电源之间的期望频率范围内实现低阻抗的部分或电路。
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