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公开(公告)号：US20210009867A1
公开(公告)日：2021-01-14
申请号：US17040180
申请日：2019-11-01
申请人： LG CHEM, LTD.
发明人： Wanjung KIM , Jong Min JANG , Byung Ju CHOI , Kwang Joo LEE
IPC分类号： C09J133/08 , C09J163/04 , C08K3/22 , C08K5/5419 , C08K9/06 , H01L21/683 , H01L21/78
摘要： The present invention relates to a resin composition for bonding semiconductors including two types of curing catalyst mixtures together with a heat dissipation filler in which a specific functional group is introduced onto the surface, an adhesive film for semiconductor produced therefrom, a dicing die bonding film and a method for dicing a semiconductor wafer.
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公开(公告)号：US20190189304A1
公开(公告)日：2019-06-20
申请号：US16326073
申请日：2018-07-02
申请人： LG CHEM, LTD.
发明人： Woo Jae JEONG , You Jin KYUNG , Byung Ju CHOI , Bo Yun CHOI , Kwang Joo LEE , Min Su JEONG
IPC分类号： H01B3/32 , H01L23/31 , H01L23/532 , H01L23/00
CPC分类号： H01B3/32 , H01B3/30 , H01L23/31 , H01L23/532 , H01L23/5329 , H01L24/07 , H01L2224/04105 , H01L2224/96
摘要： The present invention relates to a method for manufacturing an insulating layer which can minimize the degree of warpage caused by polymer shrinkage at the time of curing and secure the stability of a semiconductor chip located therein, and a method for manufacturing a semiconductor package using an insulating layer obtained from the manufacturing method of the insulating layer.
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3.发明公开公开(公告)号：US20230295388A1
公开(公告)日：2023-09-21
申请号：US18323562
申请日：2023-05-25
申请人： LG CHEM, LTD.
发明人： Minsu JEONG , You Jin KYUNG , Byung Ju CHOI , Woo Jae JEONG , Kwang Joo LEE , Eunbyurl CHO
CPC分类号： C08J5/18 , C08G59/14 , C08K3/36 , H01L23/295 , C08J2363/00 , C08K2201/003
摘要： The present invention relates to an epoxy resin composition for molding a semiconductor having excellent heat resistance and mechanical properties and also having improved visibility while having a low coefficient of thermal expansion and thus exhibiting improved warpage characteristics, and a molding film and a semiconductor package using such an epoxy resin composition for molding a semiconductor.
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公开(公告)号：US20190056658A1
公开(公告)日：2019-02-21
申请号：US15764544
申请日：2017-02-03
申请人： LG CHEM, LTD.
发明人： Byung Ju CHOI , You Jin KYUNG , Woo Jae JEONG , Bo Yun CHOI , Min Su JEONG
IPC分类号： G03F7/004 , G03F7/029 , C08F122/14 , H05K3/28
摘要： The present invention relates to a photo-curable and heat-curable resin composition including: an acid-modified oligomer having a photo-curable functional group having an acrylate group or an unsaturated double bond, and a carboxyl group in the molecule; a photopolymerizable monomer having at least two photo-curable unsaturated functional groups; a heat-curable binder having a heat-curable functional group; a plate-like inorganic filler having an E-modulus of 90 to 120 (Gpa); a dispersant; and a photo-initiator, and a dry film solder resist prepared therefrom.
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5.发明申请公开(公告)号：US20200347194A1
公开(公告)日：2020-11-05
申请号：US16767808
申请日：2019-01-09
申请人： LG CHEM, LTD.
发明人： Minsu JEONG , You Jin KYUNG , Byung Ju CHOI , Woo Jae JEONG , Kwang Joo LEE , Eunbyurl CHO
摘要： The present invention relates to an epoxy resin composition for molding a semiconductor having excellent heat resistance and mechanical properties and also having improved visibility while having a low coefficient of thermal expansion and thus exhibiting improved warpage characteristics, and a molding film and a semiconductor package using such an epoxy resin composition for molding a semiconductor.
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6.发明申请公开(公告)号：US20160116842A1
公开(公告)日：2016-04-28
申请号：US14925389
申请日：2015-10-28
申请人： LG CHEM, LTD.
发明人： Byung Ju CHOI , You Jin KYUNG , Woo Jae JEONG , Bo Yun CHOI , Kwang Joo LEE , Min Su JEONG
IPC分类号： G03F7/032
摘要： Provided are a photocurable and thermocurable resin composition including: an acid-modified oligomer including an iminocarbonate-based compound containing a carboxyl group and a photocurable unsaturated functional group; a photopolymerizable monomer having two or more photocurable unsaturated functional groups; a thermocurable binder having a thermally curable functional group; a functional filler including one or more selected from the group consisting of carbon allotrope particles having a ceramic compound bound to a surface thereof and heat radiating ceramic particles; and a photoinitiator, and a dry film solder resist manufactured therefrom.
摘要翻译： 本发明提供一种光固化性和耐热性树脂组合物，其包含：含有羧基的亚氨基碳酸酯类化合物和光固化性不饱和官能团的酸改性低聚物; 具有两个以上光固化性不饱和官能团的光聚合性单体; 具有热固化性官能团的热固性粘合剂; 功能性填料，其包含选自具有与其表面结合的陶瓷化合物的碳同素异形体颗粒和散热陶瓷颗粒的一种或多种; 和光引发剂，以及由其制造的干膜阻焊剂。
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7.发明申请公开(公告)号：US20150366070A1
公开(公告)日：2015-12-17
申请号：US14763414
申请日：2014-09-22
申请人： LG CHEM, LTD.
发明人： Min Su JEONG , You Jin KYUNG , Byung Ju CHOI , Woo Jae JEONG , Bo Yun CHOI , Kwang Joo LEE , Se Jin KU
CPC分类号： H05K3/027 , G03F7/027 , G03F7/038 , G03F7/09 , G03F7/16 , G03F7/20 , G03F7/327 , G03F7/40 , H01L21/4846 , H05K3/281 , H05K3/3452
摘要： The present invention relates to a preparation method for a dry film solder resist (DFSR) capable of forming the DFSR having fine unevenness on a surface by a more simplified method, and a film laminate used therein. The preparation method for a dry film solder resist includes forming a predetermined photo-curable and heat-curable resin composition on a transparent carrier film having a surface on which a fine unevenness having an average roughness (Ra) of 200 nm to 2 μm is formed; laminating the resin composition on a substrate to form a laminated structure in which the substrate, the resin composition, and the transparent carrier film are sequentially formed; exposing the resin composition and delaminating the transparent carrier film; and alkaline-developing the resin composition in a non-exposure part and performing heat-curing.
摘要翻译： 本发明涉及一种能够通过更简单的方法形成表面上具有微细凹凸的DFSR的干膜阻焊剂（DFSR）的制备方法和其中使用的薄膜层压体。 干膜阻焊剂的制备方法包括在具有表面的透明载体膜上形成预定的光固化和热固化树脂组合物，在该表面上形成平均粗糙度（Ra）为200nm至2μm的微细凹凸 ; 将树脂组合物层叠在基板上，形成依次形成基板，树脂组合物和透明载体膜的层叠结构体; 露出树脂组合物并使透明载体膜分层; 并将该树脂组合物在非曝光部分进行碱显影，进行热固化。
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