公开(公告)号：US20240128416A1

公开(公告)日：2024-04-18

申请号：US18487788

申请日：2023-10-16

Applicant: LG Display Co., Ltd.

Inventor： Byonghoo Kim ,  Sangsoon Yoon ,  Juhyuk Kim ,  Hokyeong Son ,  A-Ram Sohn ,  Sumin Lee ,  Eun-Soo Chang

IPC: H01L33/58 ,  H01L25/16 ,  H01L27/12

CPC classification number: H01L33/58 ,  H01L25/167 ,  H01L27/1248

Abstract: A panel substrate includes a base substrate including a plurality of sub-pixel areas; a thin-film transistor disposed over each of the plurality of sub-pixel areas; an interlayer insulating film disposed over the thin-film transistor; a first optical functional layer disposed on the interlayer insulating film so as to prevent transmission and reflection of light; a second optical functional layer disposed on the first optical functional layer, wherein the second optical functional layer has first patterns and second patterns, wherein the first pattern has adhesiveness while the second pattern has less adhesiveness than the first pattern; and a plurality of micro-LEDs respectively disposed on the first patterns of the second optical functional layer.

公开(公告)号：US09085717B2

公开(公告)日：2015-07-21

申请号：US14091552

申请日：2013-11-27

Applicant: LG Display Co., Ltd.

Inventor： Yeo-O Youn ,  Dong-Sik Park ,  Jeong-Beom Park ,  Hye-Sun Song ,  A-Ram Sohn

IPC: B29C71/04 ,  C08F2/46 ,  A61L2/08 ,  A61L24/00 ,  C08G61/04 ,  C09J9/02 ,  H05K7/06 ,  H05K13/00 ,  C09J11/00 ,  H01L23/00 ,  C09J133/04 ,  G02F1/1345 ,  C08K3/00 ,  C08K3/16 ,  C08K7/18 ,  C08K3/08 ,  C08K3/38

CPC classification number: C09J9/02 ,  C08K3/011 ,  C08K3/16 ,  C08K7/18 ,  C08K2003/0806 ,  C08K2003/387 ,  C08K2201/001 ,  C09J11/00 ,  C09J133/04 ,  G02F1/13452 ,  H01L24/83 ,  H01L2224/83192 ,  H01L2924/07811 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/15788 ,  H05K7/06 ,  H05K13/00 ,  H01L2924/00

Abstract: The present invention provides an adhesive layer for an electrical connection. The adhesive layer includes a base resin; an ionic optical-curing agent; an optical curing accelerant; and a conductive particle having a size of several to several tens nanometers, wherein the adhesive layer is cured by a UV light, and the UV light is diffused by the optical curing accelerant.

Abstract translation: 本发明提供一种用于电连接的粘合剂层。 粘合剂层包括基础树脂; 离子光固化剂; 光固化促进剂; 以及尺寸为数几十纳米的导电颗粒，其中粘合剂层通过UV光固化，并且UV光被光固化促进剂扩散。