公开(公告)号：US20240332473A1

公开(公告)日：2024-10-03

申请号：US18578185

申请日：2021-07-28

Applicant: LG ELECTRONICS INC.

Inventor： Sunghyun MOON ,  Myoungsoo KIM ,  Yoonchul KIM ,  Jungsub KIM

IPC: H01L33/62 ,  H01L25/16

CPC classification number: H01L33/62 ,  H01L25/167

Abstract: The display device can include a barrier rib disposed on a substrate and having an assembly hole, a conductor in the assembly hole, and a semiconductor light emitting device disposed on the conductor within the assembly hole. The conductor can include a first conductor between the substrate and the semiconductor light emitting device, and a second conductor between the inside of the assembly hole and the outside of the semiconductor light emitting device.

公开(公告)号：US20230127225A1

公开(公告)日：2023-04-27

申请号：US17910275

申请日：2020-03-13

Applicant: LG ELECTRONICS INC.

Inventor： Jungsub KIM ,  Yeonhong JUNG ,  Sunghyun MOON ,  Myoungsoo KIM ,  Yoonchul KIM

IPC: H01L33/60 ,  H01L25/075 ,  H01L33/52

Abstract: The display device according to the present invention comprises: a substrate; semiconductor light-emitting diodes disposed on the substrate; a planarization layer formed so as to cover the semiconductor light-emitting diodes; and wire electrodes electrically connected to the semiconductor light-emitting diodes, wherein the substrate comprises individual pixel areas in which the semiconductor light-emitting diodes are disposed, and the individual pixel areas are each any one of first individual pixel areas, in which the semiconductor light-emitting diodes are disposed and which emit the light output by the semiconductor light-emitting diodes, and second individual pixel areas, in which a repair layer is disposed so as to emit the light output by an adjacent first individual pixel area.

公开(公告)号：US20220416125A1

公开(公告)日：2022-12-29

申请号：US17763050

申请日：2019-09-25

Applicant: LG ELECTRONICS INC.

Inventor： Jina JEON ,  Yongdae KIM ,  Myoungsoo KIM ,  Yoonchul KIM ,  Jungsub KIM ,  Sunghyun MOON ,  Yeonhong JUNG

IPC: H01L33/38 ,  H01L33/00 ,  H01L33/62 ,  H01L25/075

Abstract: Discussed is a manufacturing method of a display apparatus, and the display apparatus. The display includes a substrate, an adhesive layer located on the substrate and including protruding portions, semiconductor light-emitting diodes located on the adhesive layer, an insulating layer located on the semiconductor light-emitting diodes and the adhesive layer, and wiring electrodes electrically connected to the semiconductor light-emitting diodes, wherein the protruding portions of the adhesive layer are positioned at regular intervals to correspond to the shapes of the contact surfaces of the semiconductor light-emitting diodes in contact with the adhesive layer.

公开(公告)号：US20240332475A1

公开(公告)日：2024-10-03

申请号：US18697320

申请日：2021-09-30

Applicant: LG ELECTRONICS INC.

Inventor： Jungsub KIM ,  Changseo PARK ,  Gunho KIM ,  Yongil SHIN ,  Yoonchul KIM

IPC: H01L33/62 ,  H01L25/075

CPC classification number: H01L33/62 ,  H01L25/0753

Abstract: The display device includes a substrate, first assembly wiring, second assembly wiring, a partition, and first to third semiconductor light emitting devices. Each of the plurality of pixels includes first to third sub-pixels. The first to third assembly holes are located in the first to third sub-pixels. The first assembly wiring includes a first bus wiring in a plurality of pixels, and a plurality of first branch wirings branching from the first bus wiring. The second assembly wiring includes a second bus wiring in a plurality of pixels, and a plurality of second branch wirings branching from the second bus wiring. Each of the first to third semiconductor light emitting devices may be disposed in first to third assembly holes between the first bus wiring, the second bus wiring, the first branch wiring, and the second branch wiring.

公开(公告)号：US20240038930A1

公开(公告)日：2024-02-01

申请号：US18266081

申请日：2020-12-09

Applicant: LG ELECTRONICS INC.

Inventor： Jungsub KIM ,  Gunho KIM ,  Yoonchul KIM ,  Jisoo KO

IPC: H01L33/20 ,  H01L25/075 ,  H01L33/00

CPC classification number: H01L33/20 ,  H01L25/0753 ,  H01L33/0093

Abstract: A display device according to the present invention comprises: a wiring board including a plurality of pixel areas; and semiconductor light-emitting devices disposed in the pixel areas, wherein the pixel areas include semiconductor light-emitting devices having different shapes and emitting different colors, and wherein the wiring board has two or more pixel areas having different arrangements of the semiconductor light-emitting devices. The present invention may be used as an align key when manufacturing a display device by varying the arrangement of semiconductor light-emitting devices in some pixel areas.

公开(公告)号：US20220336423A1

公开(公告)日：2022-10-20

申请号：US17633100

申请日：2019-08-07

Applicant: LG ELECTRONICS INC.

Inventor： Jungsub KIM ,  Yongdae KIM ,  Yoonchul KIM ,  Changseo PARK ,  Jina JEON

IPC: H01L25/075 ,  H01L23/00 ,  H01L33/62

Abstract: Disclosed in the present specification are a substrate for transferring, with high reliability, a semiconductor light emitting element, and a method for manufacturing a display device by using same. Particularly, when a semiconductor light emitting element is self-assembled on an assembly substrate by using an electromagnetic field, an assembly groove in which a semiconductor light emitting element for alignment is assembled is formed in the assembly substrate. The semiconductor light emitting element for alignment, assembled in the assembly groove, is used for alignment in a step of being transferred to a final wiring substrate. Unlike conventional alignment keys, the semiconductor light emitting element for alignment reflects an alignment error of semiconductor light emitting elements that occurs during a transfer process after assembly. Therefore, when semiconductor light emitting elements are transferred to a wiring substrate on the basis of the semiconductor light emitting element for alignment, transfer accuracy can be improved.