公开(公告)号：US20210359171A1

公开(公告)日：2021-11-18

申请号：US16874529

申请日：2020-05-14

Applicant: LUMILEDS LLC

Inventor： Emma DOHNER ,  Grigoriy BASIN ,  Daniel B. ROITMAN ,  Vernon K. WONG

IPC: H01L33/50 ,  H01L25/075

Abstract: A converter layer bonding device, and methods of making and using the converter layer bonding device are disclosed. A converter layer bonding device as disclosed herein includes a release liner and an adhesive layer coating the release liner, the adhesive layer is solid and non-adhesive at room temperature, and is adhesive at an elevated temperature above room temperature.

公开(公告)号：US20210296541A1

公开(公告)日：2021-09-23

申请号：US17341743

申请日：2021-06-08

Applicant: LUMILEDS LLC

Inventor： Grigoriy BASIN ,  Lex Alan KOSOWSKY ,  Chee Ming THOE ,  Choon Earn CHAN

IPC: H01L33/50 ,  H01L33/60

Abstract: A light emitting device includes an LED having a light emitting top surface and sidewalls. A phosphor structure is attached to the light emitting surface of the LED. The phosphor structure has a light emitting top surface facing away from the LED light emitting surface, and sidewalls. A light reflective material is arranged to cover the sidewalls of the LED and the phosphor structure. A light absorptive region is defined in the light reflective material around a perimeter of the light emitting surface of the phosphor structure. The light absorptive region may be spaced apart from the perimeter of the phosphor structure by a gap. The light absorptive region may be formed by ultraviolet laser illumination of the light reflecting material.

公开(公告)号：US20230317905A1

公开(公告)日：2023-10-05

申请号：US18127974

申请日：2023-03-29

Applicant: LUMILEDS LLC

Inventor： Grigoriy BASIN ,  Chee Ming THOE ,  Chee Teong LIM ,  Chee Jong LOH

IPC: H01L33/50 ,  H01L33/62

CPC classification number: H01L33/62 ,  H01L33/50 ,  H01L24/16 ,  H01L2224/16145

Abstract: A semiconductor device is electrically connected to a power source through an electrical contact and at least one bump disposed on the electrical contact. The semiconductor device may be an LED on a CMOS wafer with the electrical contact spaced apart from it and disposed on the wafer. The semiconductor device and the electrical contact have side coating material disposed to surround them, and the at least one bump may be stacked to reach or nearly reach the top surface of the side coating material. This allows wire bonding of the semiconductor device to an external power source through the easily accessible bump(s), whose top surface is exposed by the side coating material.

公开(公告)号：US20230215992A1

公开(公告)日：2023-07-06

申请号：US18122520

申请日：2023-03-16

Applicant: LUMILEDS LLC

Inventor： Grigoriy BASIN ,  Mooi Guan NG ,  Lex Alan KOSOWSKY ,  Phillip BARTON

IPC: H01L33/50 ,  H01L33/34 ,  H01L27/15

CPC classification number: H01L33/502 ,  H01L33/505 ,  H01L33/346 ,  H01L27/156

Abstract: A wavelength converting layer may have a glass or a silicon porous support structure. The wavelength converting layer may also have a cured portion of wavelength converting particles and a binder laminated onto the porous glass or silicon support structure.

公开(公告)号：US20230154911A1

公开(公告)日：2023-05-18

申请号：US18097939

申请日：2023-01-17

Applicant: Lumileds LLC

Inventor： Tze Yang HIN ,  Erik YOUNG ,  Kentaro SHIMIZU ,  Grigoriy BASIN ,  Emma DOHNER ,  Brendan Jude MORAN

IPC: H01L25/18 ,  H01L27/15 ,  H01L23/538 ,  H01L23/00

CPC classification number: H01L25/18 ,  H01L27/156 ,  H01L23/5384 ,  H01L24/13 ,  H01L24/16 ,  H01L24/08 ,  H01L2224/16225 ,  H01L2224/13147 ,  H01L2224/08238 ,  H01L2224/13139 ,  H01L2224/13111 ,  H01L2924/014 ,  H01L2224/13082 ,  G03B2215/0567 ,  G03B15/05

Abstract: A packaging structure for a light emitter pixel array includes a plurality of pixels, with at least some pixels laterally separated from each other with a pixel light confinement structure. An inorganic substrate having a top redistribution layer is attached to the plurality of pixels and at least one through silicon via containing an electrical conductor is defined to pass through the inorganic substrate and support an electrical coupling with the top redistribution layer.

公开(公告)号：US20200295241A1

公开(公告)日：2020-09-17

申请号：US16890655

申请日：2020-06-02

Applicant: LUMILEDS LLC

Inventor： Grigoriy BASIN ,  Brendan Jude MORAN ,  Hideo KAGEYAMA

IPC: H01L33/50 ,  H01L33/60

Abstract: A lighting structure according to embodiments of the invention includes a semiconductor light emitting device and a flat wavelength converting element attached to the semiconductor light emitting device. The flat wavelength converting element includes a wavelength converting layer for absorbing light emitted by the semiconductor light emitting device and emitting light of a different wavelength. The flat wavelength converting element further includes a transparent layer. The wavelength converting layer is formed on the transparent layer.

公开(公告)号：US20240162274A1

公开(公告)日：2024-05-16

申请号：US17985888

申请日：2022-11-13

Applicant: Lumileds LLC

Inventor： Wouter SOER ,  Grigoriy BASIN ,  Brendan Jude MORAN ,  Willem SILLEVIS-SMITT

IPC: H01L27/15 ,  H01L33/60 ,  H01L33/62

CPC classification number: H01L27/156 ,  H01L33/60 ,  H01L33/62

Abstract: An inventive light source includes a substrate and a set of multiple light-emitting elements. The substrate is transparent or reflective for visible light. The light-emitting elements are positioned on or within the substrate. Each light-emitting element comprises one or more inorganic microLEDs that are arranged to generate and emit visible output light to propagate out-of-plane relative to a corresponding localized area of the substrate around that light-emitting element. Each light-emitting element of the set being sufficiently small in at least one transverse dimension, and the light-emitting elements occupying a sufficiently small fraction of an areal extent of the set, so as to enable visual observation of a scene through or reflected by the substrate along a sight line that passes through the set of light-emitting elements.

公开(公告)号：US20240162198A1

公开(公告)日：2024-05-16

申请号：US17985892

申请日：2022-11-13

Applicant: Lumileds LLC

Inventor： Wouter SOER ,  Grigoriy BASIN ,  Brendan Jude MORAN ,  Willem SILLEVIS-SMITT

IPC: H01L25/075 ,  H01L33/62 ,  H05B45/30

CPC classification number: H01L25/0753 ,  H01L33/62 ,  H05B45/30 ,  H01L33/60

Abstract: An inventive apparatus includes a substrate and a set of multiple electrically conductive traces. The substrate is transparent or reflective for visible light. The electrically conductive traces are sufficiently transparent, or are less than 200 μm wide and occupy less than 25% of an areal extent of the set, so as to enable visual observation of a scene through or reflected by the substrate along a sight line that passes through the set of electrically conductive traces.

公开(公告)号：US20240160017A1

公开(公告)日：2024-05-16

申请号：US17985897

申请日：2022-11-13

Applicant: Lumileds LLC

Inventor： Wouter SOER ,  Grigoriy BASIN ,  Brendan Jude MORAN ,  Willem SILLEVIS-SMITT

IPC: G02B27/01 ,  G02B27/00 ,  H01L25/075

CPC classification number: G02B27/0172 ,  G02B27/0093 ,  H01L25/0753 ,  G02B2027/0112 ,  G02B2027/0145 ,  G02B2027/0178 ,  G02B2027/0196

Abstract: A wearable optical assembly includes a transparent optical element and a set of multiple light-emitting elements positioned on or within the optical element. The optical assembly positions the optical element in a sight line of a user wearing the optical assembly. Each light-emitting element includes one or more inorganic microLEDs that generate and emit infrared output light to propagate out-of-plane away from the optical element toward an eye or face of the user wearing the optical assembly. Each light-emitting element of the set is sufficiently small in at least one transverse dimension, and the light-emitting elements occupy a sufficiently small fraction of an areal extent of the set, so as to enable visual observation of a scene, by the user wearing the optical assembly, through the optical element along the sight line of the user, the sight line passing through the set of light-emitting elements.

公开(公告)号：US20220336522A1

公开(公告)日：2022-10-20

申请号：US17859361

申请日：2022-07-07

Applicant: Lumileds LLC

Inventor： Grigoriy BASIN ,  Kentaro SHIMIZU ,  Brendan MORAN ,  Emma DOHNER ,  Noad SHAPIRO ,  Marcel BOHMER

IPC: H01L27/15

Abstract: Phosphor-converted LED side reflectors disclosed herein comprise pigments that are photochemically stable under illumination by light from the pcLED. The pigments absorb light in at least a portion of the spectrum of light emitted by the first phosphor converted LED. The side reflector may also comprise light scattering particles or air voids. The pigments, light scattering particles, or air voids may be homogeneously distributed in the reflector. Alternatively the side reflector may be layered, with the pigments, light scattering particles, or air voids inhomogeneously distributed in the reflector. The side reflector can include phosphor particles.