Light emitting structure, light device and backlight module

    公开(公告)号:US09966505B2

    公开(公告)日:2018-05-08

    申请号:US14887451

    申请日:2015-10-20

    CPC classification number: H01L33/504 G02B6/0003 G02B6/0035 G02B6/0073

    Abstract: The present disclosure provides a light emitting structure including a blue light source, a first fluorescent material layer and a second fluorescent material layer. The blue light source has a light emitting surface. The first fluorescent material layer covers the light emitting surface of the blue light source. The first fluorescent material layer consists of a first fluorescent material. An excitation band of the first fluorescent material is in a blue wave band, and an emission band of the first fluorescent material is in a green wave band. The second fluorescent material layer covers the first fluorescent material layer. The second fluorescent material layer consists of a second fluorescent material. An excitation band of the second fluorescent material is in a green wave band, and an emission band of the second fluorescent material is in a red wave band. A light device and a backlight module are also provided herein.

    Light-emitting package structure
    3.
    发明授权

    公开(公告)号:US11302678B2

    公开(公告)日:2022-04-12

    申请号:US16699091

    申请日:2019-11-28

    Abstract: A light-emitting package structure includes a light transmissive adhesive layer, a substrate, and at least one light-emitting diode chip. The light transmissive adhesive layer includes a first surface and a second surface facing away from the first surface. The substrate is on the first surface of the light transmissive adhesive layer. The light-emitting diode chip is on the second surface of the light transmissive adhesive layer. The light transmissive adhesive layer has a first portion and a second portion on the second surface, the first portion surrounds the second portion, a vertical projection area of the second portion on the substrate at least entirely covers a vertical projection area of the light-emitting diode chip on the substrate, and a thickness of the second portion is smaller than or equal to a thickness of the first portion.

    Light Emitting Structure, Light Device and Backlight Module
    6.
    发明申请
    Light Emitting Structure, Light Device and Backlight Module 有权
    发光结构,灯光装置和背光模块

    公开(公告)号:US20160365491A1

    公开(公告)日:2016-12-15

    申请号:US14887451

    申请日:2015-10-20

    CPC classification number: H01L33/504 G02B6/0003 G02B6/0035 G02B6/0073

    Abstract: The present disclosure provides a light emitting structure including a blue light source, a first fluorescent material layer and a second fluorescent material layer. The blue light source has a light emitting surface. The first fluorescent material layer covers the light emitting surface of the blue light source. The first fluorescent material layer consists of a first fluorescent material. An excitation band of the first fluorescent material is in a blue wave band, and an emission band of the first fluorescent material is in a green wave band. The second fluorescent material layer covers the first fluorescent material layer. The second fluorescent material layer consists of a second fluorescent material. An excitation band of the second fluorescent material is in a green wave band, and an emission band of the second fluorescent material is in a red wave band. A light device and a backlight module are also provided herein.

    Abstract translation: 本公开提供了包括蓝色光源,第一荧光材料层和第二荧光材料层的发光结构。 蓝色光源具有发光面。 第一荧光体层覆盖蓝色光源的发光面。 第一荧光材料层由第一荧光材料构成。 第一荧光体的激发带为蓝色波段,第一荧光体的发光带为绿色波段。 第二荧光材料层覆盖第一荧光材料层。 第二荧光材料层由第二荧光材料构成。 第二荧光体的激发带为绿色波段,第二荧光体的发光带为红色波段。 本文还提供了一种灯装置和背光模块。

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