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公开(公告)号：US11476133B2
公开(公告)日：2022-10-18
申请号：US16693400
申请日：2019-11-25
Applicant: Lextar Electronics Corporation
Inventor： Fu-Hsin Chen , Yu-Chun Lee
IPC: H01L21/67
Abstract: A picking apparatus is configured to pick up a plurality of micro elements. The picking apparatus includes an elastic plate, a substrate, a temperature-controlled adhesive layer, at least one heating element and a power source. The elastic plate has a first surface and a second surface opposite to each other. The substrate is disposed on the first surface. The temperature-controlled adhesive layer is disposed on the second surface and configured to adhere the micro elements. The heating element is disposed between the second surface and the temperature-controlled adhesive layer. The power source is electrically connected with the heating element. A viscosity of the temperature-controlled adhesive layer varies with a temperature of the temperature-controlled adhesive layer.
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公开(公告)号：US11294238B1
公开(公告)日：2022-04-05
申请号：US17083328
申请日：2020-10-29
Applicant: Lextar Electronics Corporation
Inventor： Kiet Tuong Ly , Fu-Hsin Chen , Yi-Ting Tsai , Hung-Chia Wang , Chia-Chun Hsieh , Hung-Chun Tong , Yu-Chun Lee , Tzong-Liang Tsai
IPC: H01L33/50 , G02F1/13357
Abstract: A low blue light backlight module configured to emit a white light is provided. The low blue light backlight module includes a first light-emitting element, a second light-emitting element, a third light-emitting element and a fourth light-emitting element. The first light-emitting element is configured to emit a first light having a peak emission wavelength of about 610-660 nm. The second light-emitting element is configured to emit a second light having a peak emission wavelength of about 520-550 nm. The third light-emitting element is configured to emit a third light having a peak emission wavelength of about 480-580 nm. The fourth light-emitting element is configured to emit a fourth light having a peak emission wavelength of about 445-470 nm. The white light has an emission spectrum, and an area ratio of the spectrum under wavelength of 415-455 nm to the spectrum under wavelength of 400-500 nm is below 50%.
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公开(公告)号：US11588078B2
公开(公告)日：2023-02-21
申请号：US16931463
申请日：2020-07-17
Applicant: Lextar Electronics Corporation
Inventor： Shiou-Yi Kuo , Jian-Chin Liang , Yu-Chun Lee , Fu-Hsin Chen , Chih-Hao Lin
Abstract: A light emitting device includes an LED die and a wavelength conversion layer. The LED die has a light emitting top surface and light emitting side surfaces. The wavelength conversion layer contains quantum dots and a photosensitive material, and is located on the light emitting top surface. A light emitting module including multiple light emitting devices is also disclosed.
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公开(公告)号：US11302678B2
公开(公告)日：2022-04-12
申请号：US16699091
申请日：2019-11-28
Applicant: Lextar Electronics Corporation
Inventor： Hung-Chun Tong , Fu-Hsin Chen , Wen-Wan Tai , Yu-Chun Lee , Tzong-Liang Tsai
IPC: H01L25/075 , H01L33/58 , H01L33/52 , H01L33/50
Abstract: A light-emitting package structure includes a light transmissive adhesive layer, a substrate, and at least one light-emitting diode chip. The light transmissive adhesive layer includes a first surface and a second surface facing away from the first surface. The substrate is on the first surface of the light transmissive adhesive layer. The light-emitting diode chip is on the second surface of the light transmissive adhesive layer. The light transmissive adhesive layer has a first portion and a second portion on the second surface, the first portion surrounds the second portion, a vertical projection area of the second portion on the substrate at least entirely covers a vertical projection area of the light-emitting diode chip on the substrate, and a thickness of the second portion is smaller than or equal to a thickness of the first portion.
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Patent Agency Ranking
公开(公告)号：US10720555B2
公开(公告)日：2020-07-21
申请号：US16203568
申请日：2018-11-28
Applicant: Lextar Electronics Corporation
Inventor： Hung-Chun Tong , Chang-Zhi Zhong , Fu-Hsin Chen , Yu-Chun Lee
Abstract: A light emitting diode device includes a light emitting diode chip, a wavelength conversion layer including a bottom surface facing a top surface of the light emitting diode chip, and an interlayer having a first portion between the light emitting diode chip and a part of the bottom surface of the wavelength conversion layer, and a second portion extending from the first portion and connected between a remaining part of the bottom surface of the wavelength conversion layer and a side surface of the light emitting diode chip. The second portion has a side surface including a linear surface substantially aligning with a side surface of the wavelength conversion layer, and a curved surface having a first end connected to the linear surface and a second end connected to the side surface of the light emitting diode chip. The linear surface and the curved surface define a chamfer angle.
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公开(公告)号：US10679974B2
公开(公告)日：2020-06-09
申请号：US16198790
申请日：2018-11-22
Applicant: Lextar Electronics Corporation
Inventor： Fu-Hsin Chen , Yu-Chun Lee
IPC: H01L25/07 , H01L33/50 , H01L33/58 , H01L33/60 , G02F1/133 , H01L25/075 , G02F1/1333
Abstract: A display device includes a driving substrate, multiple light-emitting elements, first and second transparent substrates, multiple pixels, and a patterned light-absorbing layer. The light-emitting elements are disposed on the driving substrate and used to emit a light. The first transparent substrate is disposed over the driving substrate and the light-emitting elements and includes at least one groove. The pixels are disposed in the groove and include a first sub-pixel, a second sub-pixel, and a third sub-pixel respectively aligned with one of the light-emitting elements. The second transparent substrate covers the first transparent substrate and the pixels. The patterned light-absorbing layer is disposed on the second transparent substrate and includes multiple first openings respectively aligned with the first, second, and third sub-pixels. The first, second, and third sub-pixels correspond to the light emitted by the light-emitting elements to respectively emit a red light, a green light, and a blue light.
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公开(公告)号：US20220115257A1
公开(公告)日：2022-04-14
申请号：US17644792
申请日：2021-12-17
Applicant: Lextar Electronics Corporation
Inventor： Fu-Hsin Chen , Yu-Chun Lee , Hung-Chun Tong , Tzong-Liang Tsai
IPC: H01L21/683 , H01L25/075 , H01L33/50 , H01L33/62
Abstract: A display device includes a substrate, a plurality of white light-emitting units, and a color filter layer. The white light-emitting units are arranged on the substrate at intervals, and the white light-emitting units are chip scale package (CSP). The color filter layer is above the white light-emitting units. Each of the white light-emitting units includes a light-emitting diode chip and a wavelength conversion film. The wavelength conversion film directly covers a top surface and side surfaces of the light-emitting diode chip, and the wavelength conversion film converts light emitted by the light-emitting diode chip into white light.
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公开(公告)号：US11469352B2
公开(公告)日：2022-10-11
申请号：US16698980
申请日：2019-11-28
Applicant: Lextar Electronics Corporation
Inventor： Fu-Hsin Chen , Yu-Chun Lee , Hung-Chun Tong , Tzong-Liang Tsai
IPC: H01L33/50 , H01L33/06 , H01L25/075 , H01L33/00
Abstract: A display device includes a substrate, a plurality of white light-emitting units, and a color filter layer. The white light-emitting units are arranged on the substrate at intervals, and the white light-emitting units are chip scale package (CSP). The color filter layer is above the white light-emitting units. Each of the white light-emitting units includes a light-emitting diode chip and a wavelength conversion film. The wavelength conversion film directly covers a top surface and side surfaces of the light-emitting diode chip, and the wavelength conversion film converts light emitted by the light-emitting diode chip into white light.
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公开(公告)号：US11357145B2
公开(公告)日：2022-06-07
申请号：US16693399
申请日：2019-11-25
Applicant: Lextar Electronics Corporation
Inventor： Chi-Wei Liu , Fu-Hsin Chen , Yu-Chun Lee
Abstract: A picking apparatus is configured to pick up a plurality of micro elements. The picking apparatus includes a main body and a plurality of picking portions. The picking portions connect with and protrude from the main body. Each of the picking portions has a first surface. The first surfaces are away from the main body and configured to pick up the micro elements. The main body has a second surface at least partially located between the picking portions. Each of the first surfaces has a first viscosity. The second surface has a second viscosity. The second viscosity is less than the first viscosity.
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