Electrostatic discharge protection silicon controlled rectifier (ESD-SCR) for silicon germanium technologies
    7.
    发明授权
    Electrostatic discharge protection silicon controlled rectifier (ESD-SCR) for silicon germanium technologies 有权
    用于硅锗技术的静电放电保护硅控整流器(ESD-SCR)

    公开(公告)号:US06770918B2

    公开(公告)日:2004-08-03

    申请号:US10238699

    申请日:2002-09-10

    IPC分类号: H01L2972

    摘要: An electrostatic discharge (ESD) protection device having a silicon controlled rectifier (SCR) for protecting circuitry of an integrated circuit (IC). The SCR includes a N-doped layer disposed over a substrate and a first P doped region disposed over the N-doped layer. At least one first N+ doped region forming a cathode is disposed over the P-doped region and coupled to ground. The at least one first N+ doped region, first P-doped region, and N-doped layer form a vertical NPN transistor of the SCR. A second P doped region forming an anode is coupled to a protected pad. The second P doped region is disposed over the N-doped layer, and is laterally positioned and electrically isolated with respect to the first P doped region. The second P doped region, N-doped layer, and first P doped region form a lateral PNP transistor of the SCR.

    摘要翻译: 一种具有用于保护集成电路(IC)的电路的可控硅整流器(SCR)的静电放电(ESD)保护装置。 SCR包括设置在衬底上的N掺杂层和设置在N掺杂层上的第一P掺杂区。 形成阴极的至少一个第一N +掺杂区域设置在P掺杂区域上并耦合到地。 至少一个第一N +掺杂区,第一P掺杂区和N掺杂层形成SCR的垂直NPN晶体管。 形成阳极的第二P掺杂区域被耦合到受保护的焊盘。 第二P掺杂区域设置在N掺杂层上方,并相对于第一P掺杂区域横向定位并电隔离。 第二P掺杂区,N掺杂层和第一P掺杂区形成SCR的横向PNP晶体管。

    Electrostatic discharge (ESD) protection device with simultaneous and distributed self-biasing for multi-finger turn-on
    8.
    发明授权
    Electrostatic discharge (ESD) protection device with simultaneous and distributed self-biasing for multi-finger turn-on 有权
    静电放电(ESD)保护装置,具有同时分布的自适应多指开启

    公开(公告)号:US07372681B2

    公开(公告)日:2008-05-13

    申请号:US11105103

    申请日:2005-04-13

    摘要: An electrostatic discharge (ESD) protection circuit for a semiconductor integrated circuit (IC) that protects core circuitry of the IC during normal operations, and shunts ESD events during non-powered mode of the IC. The ESD protection circuitry includes a multi-fingered MOS transistor, each finger respectively adapted for coupling between an I/O pad and a first supply line of the IC. An ESD detector is coupled to the I/O pad via a first terminal, and a second terminal is adapted for coupling to a second supply line potential of the IC. A parasitic capacitance is formed between the second supply line potential of the IC and the first supply line potential. A transfer circuit is coupled to a third terminal of the ESD detector and is adapted for biasing at least one gate respectively associated with at least one finger of the multi-fingered MOS transistor.

    摘要翻译: 用于在正常操作期间保护IC的核心电路的半导体集成电路(IC)的静电放电(ESD)保护电路,并且在IC的非供电模式期间分流ESD事件。 ESD保护电路包括多指MOS晶体管,每个手指分别适于在IC的I / O焊盘和第一电源线之间耦合。 ESD检测器经由第一端子耦合到I / O焊盘,并且第二端子适于耦合到IC的第二电源线电位。 在IC的第二供电线电位和第一供电线电位之间形成寄生电容。 传输电路耦合到ESD检测器的第三端子,并且适于偏置分别与多指MOS晶体管的至少一个手指相关联的至少一个栅极。