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    Method for preparing modified polypeptides
    4.
    发明申请
    Method for preparing modified polypeptides 审中-公开
    制备修饰多肽的方法

    公开(公告)号：US20050222389A1

    公开(公告)日：2005-10-06

    申请号：US10756813

    申请日：2004-01-12

    申请人： Torben Halkier ,  Anders Pedersen ,  Jens Okkels ,  Kim Anderson

    发明人： Torben Halkier ,  Anders Pedersen ,  Jens Okkels ,  Kim Anderson

    IPC分类号： C07H21/04 ,  C07K1/107 ,  C07K14/31 ,  C07K14/47 ,  C07K19/00 ,  C12N15/10 ,  C12Q1/68 ,  G01N33/48 ,  G01N33/50 ,  G06F19/00

    CPC分类号： C12N15/1058 ,  C07K1/107 ,  C07K14/31 ,  C07K19/00 ,  C12N15/1034

    摘要： Methods for producing polypeptide with altered immunogenicity or improved stability properties are disclosed. The methods involve a) expressing a diversified population of nucleotide sequences encoding a polypeptide of interest, b) screening the polypeptides expressed in step a) for function, immunogenicity and/or stability, c) selecting functional polypeptides having altered immunogenicity and/or increased stability, e.g. functional in vivo half-life as compared to the polypeptide of interest, and d) optionally subjecting the nucleotide sequence encoding the polypeptide selected in step c) to one or more repeated cycles of steps a)-c). In a further step the expressed polypeptides of step a) or c) can be conjugated to at least one non-polypeptide moiety.

    摘要翻译： 公开了产生具有改变的免疫原性或改善的稳定性的多肽的方法。 所述方法包括：a）表达编码感兴趣多肽的核苷酸序列的多样化群体，b）筛选功能，免疫原性和/或稳定性在步骤a）中表达的多肽，c）选择具有改变的免疫原性和/或增加稳定性的功能性多肽 ，例如 与目的多肽相比具有功能的体内半衰期，和d）任选地将编码步骤c）中选择的多肽的核苷酸序列经历步骤a）-c）的一个或多个重复循环。 在另一步骤中，步骤a）或c）的表达多肽可以与至少一个非多肽部分缀合。

    PRINTED WIRING BOARD WITH ENHANCED STRUCTURAL INTEGRITY
    5.
    发明申请
    PRINTED WIRING BOARD WITH ENHANCED STRUCTURAL INTEGRITY 有权
    具有增强结构完整性的印刷线路板

    公开(公告)号：US20080106475A1

    公开(公告)日：2008-05-08

    申请号：US12015535

    申请日：2008-01-17

    申请人： Gregory JANDZIO ,  Anders Pedersen ,  Gary Rief ,  Walter Whybrew

    发明人： Gregory JANDZIO ,  Anders Pedersen ,  Gary Rief ,  Walter Whybrew

    IPC分类号： H01Q9/04

    CPC分类号： H05K1/0243 ,  H01Q3/26 ,  H01Q21/0006 ,  H01Q21/0037 ,  H05K3/429 ,  H05K2201/0347 ,  H05K2201/09509 ,  H05K2201/09554 ,  H05K2201/0959 ,  H05K2201/10553 ,  H05K2203/049 ,  Y10T29/49165

    摘要： A structural printed wiring board panel includes a multilayer printed wiring board having opposing, outer faces and interlayer interconnects that route RF, power and control signals. Connection areas are formed in or on at least on one face for connecting the interlayer interconnects and any electrical components. A metallic face sheet is secured onto at least one outer face, adding structural rigidity to the multilayer printed wiring board. A metallic face sheet can have apertures positioned to allow access to connection areas. RF components can be carried by a face sheet and operatively connected to connection areas. Antenna elements can be positioned on the same or an opposing face sheet and operatively connected to RF components to form a phased array printed wiring board (PWB) panel,

    摘要翻译： 结构印刷线路板面板包括具有相对的外表面和层间互连的多层印刷线路板，其布置RF，功率和控制信号。 连接区域形成在至少一个面上或之上，用于连接层间互连和任何电气部件。 金属面板固定在至少一个外表面上，为多层印刷线路板增加结构刚性。 金属面板可以具有定位成允许接近连接区域的孔。 RF部件可以由面板承载并且可操作地连接到连接区域。 天线元件可以定位在相同或相对的面板上并且可操作地连接到RF部件以形成相控阵列印刷线路板（PWB）面板，