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公开(公告)号：US20150380289A1
公开(公告)日：2015-12-31
申请号：US14768352
申请日：2014-02-17
Inventor： Shiro HARA , Hitoshi MAEKAWA , Shizuka NAKANO
IPC: H01L21/677
CPC classification number: H01L21/67778 , H01L21/67155 , H01L21/67167 , H01L21/67276 , H01L21/67739 , H01L21/67745
Abstract: [Problem to be Solved]A production system to facilitate the commonization of front chambers among a plurality of production devices that are different in the kind of a process to be performed for a processing substrate. According to the production system of the present invention, it is possible to reduce the development cost and production cost of the production devices.[Solution]Control units are provided separately in a processing chamber and a front chamber of a small production device. When the processing-chamber control unit outputs a load request signal, the front-chamber control unit loads a processing substrate to the processing chamber, and outputs a load acknowledgment signal. When the load acknowledgment signal is input, the processing-chamber control unit performs a process for the processing substrate, and outputs an unload request signal after the completion of the process. When the unload request signal is input, the front-chamber control unit starts the unloading of the processing substrate, and outputs an unload acknowledgment signal when the processing substrate is unloaded from the processing chamber. When the unload acknowledgment signal is input, the processing chamber starts the preparation of the next process.
Abstract translation: [待解决的问题]一种生产系统，用于促进在对处理基板进行的处理的种类不同的多个生产装置之间的前室的通用化。 根据本发明的生产系统，可以降低生产装置的开发成本和生产成本。 [解决方案]控制单元分别设置在小型生产装置的处理室和前室中。 当处理室控制单元输出负载请求信号时，前室控制单元将处理衬底加载到处理室，并输出负载确认信号。 当输入负载确认信号时，处理室控制单元执行处理衬底的处理，并且在完成处理之后输出卸载请求信号。 当输入卸载请求信号时，前室控制单元开始卸载处理基板，并且当处理基板从处理室卸载时输出卸载确认信号。 当输入卸载确认信号时，处理室开始准备下一个处理。
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2.发明申请MOUNTING STRUCTURE OF MOVABLE MANUFACTURING DEVICE, FIXING STRUCTURE AND MOVABLE MANUFACTURING DEVICE 有权可移动制造装置的安装结构，固定结构和可移动制造装置公开(公告)号：US20140263938A1
公开(公告)日：2014-09-18
申请号：US14292125
申请日：2014-05-30
Applicant: NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY , DESIGN NETWORK CO., LTD.
Inventor： Shiro HARA , Shizuka NAKANO , Hitoshi MAEKAWA , Shinji FUTAGAWA , Takahiro FUKUDA
IPC: B23Q1/01
CPC classification number: B23Q1/01 , B62B3/06 , B62B5/049 , B62B5/063 , B62B2203/28 , F16M11/20 , H01L21/67775
Abstract: Mounting structure to allow a production line made up of movable manufacturing devices to be rearranged quickly, safely, and reliably. The mounting structure according to the present invention includes a fixing structure installed on a floor and a leg portion installed on a bottom plate of the movable manufacturing device. The fixing structure comprises a floor side positioning member and a floor side coupling member while the leg portion comprises a leg side positioning member and a leg side coupling member. The floor side positioning member and the leg side positioning member positions the movable manufacturing device accurately by fitting each other when the device is placed at the specified location of the fixing structure. The floor side coupling member and the leg side coupling member fixes the movable manufacturing device located on the fixing structure by coupling each other.
Abstract translation: 安装结构使得由可移动制造装置组成的生产线能够快速，安全，可靠地重新排列。 根据本发明的安装结构包括安装在地板上的固定结构和安装在可移动制造装置的底板上的脚部。 固定结构包括地板侧定位构件和地板侧联接构件，而腿部包括腿侧定位构件和腿侧联接构件。 当装置放置在固定结构的指定位置时，地板侧定位构件和腿侧定位构件将可动制造装置准确地相互配合。 地板侧联接构件和腿侧联接构件通过彼此联接固定位于固定结构上的可移动制造装置。
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公开(公告)号：US20150311101A1
公开(公告)日：2015-10-29
申请号：US14647685
申请日：2013-10-29
Inventor： Shiro HARA , Hitoshi MAEKAWA
IPC: H01L21/677
CPC classification number: H01L21/67742 , B25J9/0027 , B25J18/02 , H01L21/67745 , H01L21/67748 , H01L21/67772 , H01L21/67778
Abstract: There is provided a substrate transfer antechamber mechanism for a compact manufacturing apparatus that produces various types of devices in small volume using a small-diameter processing substrate at low cost. A container placement table, on which a wafer transfer container housing a semiconductor wafer is placed, is provided on an upper surface of an apparatus antechamber for a compact semiconductor manufacturing apparatus, and the apparatus antechamber includes therein a wafer elevating mechanism and a horizontal transfer mechanism. The wafer elevating mechanism moves down while holding from below a delivery bottom of the wafer transfer container, on which the semiconductor wafer remains placed, to transfer the semiconductor wafer into the apparatus antechamber. The horizontal transfer mechanism transfers the semiconductor wafer into a processing chamber using a transfer arm that receives the semiconductor wafer from the delivery bottom and extends.
Abstract translation: 提供了一种用于小型制造装置的基板转移前室机构，其使用小直径处理基板以低成本产生小体积的各种类型的装置。 在紧凑型半导体制造装置的装置前厅的上表面上设置有容纳有半导体晶片的晶片转移容器的容器放置台，该装置前后室包括晶片升降机构和水平输送机构 。 晶片升降机构向下移动，同时保持半导体晶片保持放置的晶片转移容器的输送底部的下方，以将半导体晶片转移到装置前室中。 水平传送机构使用从传送底部接收半导体晶片并延伸的传送臂将半导体晶片传送到处理室。
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公开(公告)号：US20190164797A1
公开(公告)日：2019-05-30
申请号：US16182891
申请日：2018-11-07
Applicant: NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY , DESIGN NETWORK CO., LTD.
Inventor： Shiro HARA , Hitoshi MAEKAWA , Hiroyuki NISHIHARA , Koji SAGISAWA
IPC: H01L21/677
Abstract: An automatic clamping mechanism capable of automatically securing and releasing a wafer transport container to or from a manufacturing apparatus and having a small height dimension is provided at low cost. A wafer transport container is placed on a container placing table. A semiconductor wafer is loaded into the manufacturing apparatus main body from a wafer loading port while being placed on a container base part of the wafer transport container. An automatic clamping mechanism generates a press force component in a vertical direction at the wafer transport container and secures the wafer transport container to the container placing table by bringing claw parts of a plurality of clamping claws into contact with an inclined contact surface provided on a container lid part of the wafer transport container and pressing the inclined contact surface in a substantially horizontal direction.
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Patent Agency Ranking
公开(公告)号：US20150321347A1
公开(公告)日：2015-11-12
申请号：US14647366
申请日：2013-11-26
Inventor： Kenji HIROTA , Shinichi IMAI , Shiro HARA , Hitoshi MAEKAWA
CPC classification number: B25J9/106 , B25J9/104 , B25J9/1065 , B25J18/02 , B25J18/04 , H01L21/67706
Abstract: The present invention provides a transfer robot which has a simple structure and a small occupied area in an operation.A transfer robot of the present invention includes a support member fixed to a side wall or the like, a transfer arm by which a hand member is held capable of linear movement, and first and second link members. One end portions of the first and second link members are rotatably linked to the support member, respectively. Another end portions of the first and second link members are rotatably linked to the transfer arm, respectively. The hand member holds/transfers a work. A rotational driving force applied to a linking portion between the support member and the first link member is transmitted to the transfer arm by a predetermined mechanism and linearly moves the hand member. The transfer arm moves by rotating the first link member or the second link member.
Abstract translation: 本发明提供一种操作简单，占用面积小的传送机器人。 本发明的传送机器人包括：固定到侧壁等的支撑构件，能够保持直线运动的手部构件的传送臂以及第一和第二连杆构件。 第一和第二连杆构件的一个端部分别可旋转地连接到支撑构件。 第一和第二连杆构件的另一个端部分别可旋转地连接到传送臂。 手部会员持有/转移作品。 施加到支撑构件和第一连杆构件之间的连接部分的旋转驱动力通过预定机构传递到传送臂，并直线地移动手构件。 传送臂通过旋转第一连杆构件或第二连杆构件而移动。
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公开(公告)号：US20150170948A1
公开(公告)日：2015-06-18
申请号：US14625508
申请日：2015-02-18
Inventor： Shiro HARA , Hitoshi MAEKAWA
IPC: H01L21/677
CPC classification number: H01L21/67742 , A47B47/0091 , A47B81/00 , B65D51/28 , B65D2313/04 , H01L21/67379 , H01L21/6773 , H01L21/67745 , H01L21/67751 , H01L21/67772 , H01L21/67775
Abstract: A transfer box has a sealing structure hermetically sealable by means of tight coupling of a transfer box body and a transfer box door. The transfer box is structured in such a way that magnets on the transfer box body face magnetic bodies on the transfer box door when the transfer box door is closed on the transfer box body, with these magnets and magnetic bodies forming a magnetic closed circuit.
Abstract translation: 传送箱具有密封结构，其通过传送箱主体和传送箱门的紧密连接而可气密地密封。 传送箱的结构使得当传送箱门关闭在传送箱体上时，传送箱体上的磁体面对传送箱门上的磁体，这些磁体和磁体形成磁闭合电路。
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公开(公告)号：US20230301850A1
公开(公告)日：2023-09-28
申请号：US17613382
申请日：2020-12-01
Inventor： Hitoshi MAEKAWA
CPC classification number: A61G5/1027 , F16H1/46 , A61G5/101 , F16H1/36 , A61G5/1037
Abstract: In a power transmission mechanism 20, a line connecting a center shaft 21 of a reference gear member 40 and a first shaft 44 of a first planetary gear member 42 and a line connecting the center shaft 21 of the reference gear member 40 and a second shaft 47 of a second planetary gear member 45 form a specific angle α. Rotation in one direction is prevented when a first carrier member 22 and a second carrier member 32 are relatively rotated in a direction to decrease the specific angle α. Further, a rotation prevention release unit is provided to release a prevention state of the rotation when the first carrier member 22 and the second carrier member 32 are relatively rotated in a direction to increase the specific angle α.
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公开(公告)号：US20210302034A1
公开(公告)日：2021-09-30
申请号：US17210361
申请日：2021-03-23
Inventor： Shiro HARA , Hitoshi MAEKAWA , Sommawan KHUMPUANG , Takashi YAJIMA , Yuuki ISHIDA
Abstract: An encapsulated cleanroom system comprising a processing chamber and a storage section in which the processing chamber is stored, wherein, during operation, the pressure in the storage section is lower or higher than the pressures in the processing chamber and exterior space. The system can simultaneously prevent the entry of outside gases into its processing chamber and the leakage of the gases inside the processing chamber to the exterior space.
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公开(公告)号：US20170309507A1
公开(公告)日：2017-10-26
申请号：US15531962
申请日：2015-12-01
Inventor： Shiro HARA , Hitoshi MAEKAWA
IPC: H01L21/677 , H01L21/687
CPC classification number: H01L21/67745 , H01L21/677 , H01L21/67727 , H01L21/6773 , H01L21/67736 , H01L21/67742 , H01L21/67766 , H01L21/68785
Abstract: A compact manufacturing device to automatically transport a wafer transport container. The compact manufacturing device comprises a processing chamber and a device front chamber provided inside a housing, a container mounting table provided in the housing to mount a substrate transport container accommodating a processing substrate, and a container transport mechanism. The container transport mechanism delivers the substrate transport container to the adjacent compact manufacturing device along a container transport path and/or receives the substrate transport container from adjacent compact manufacturing device along the container transport path when a plurality of the compact manufacturing devices are provided in parallel.
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