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公开(公告)号：US20150001280A1
公开(公告)日：2015-01-01
申请号：US14378441
申请日：2013-02-25
CPC分类号： B23K20/026 , B23K20/021 , B23K20/16 , B23K20/233 , B23K35/282 , B23K2101/36 , B23K2103/08 , B23K2103/10 , B23K2103/12 , B23K2103/18
摘要： A method for joining metal materials, which joins a first member with at least a joining face made of Metal A, the Metal A being mainly composed of at least one selected from the group consisting of Al, Cu, Ag and Au, to a second member with at least a joining face made of Metal B, the Metal B being mainly composed of at least one selected from the group consisting of Al Cu, Ag and Au, includes interposing an insert between the joining faces of the first and second members, wherein the insert contains Zn as a metal capable of causing an eutectic reaction with at least one metal except for Au in Metal A as well as at least one metal except for Au in Metal B.
摘要翻译： 一种金属材料的接合方法，其将第一构件与至少由金属A制成的接合面接合，所述金属A主要由选自由Al，Cu，Ag和Au组成的组中的至少一种组成至第二构件 具有至少一个由金属B制成的接合面的构件，金属B主要由选自Al Cu，Ag和Au中的至少一种组成，包括在第一和第二构件的接合面之间插入插入物， 其中所述插入物含有Zn作为能够与金属A中除Au之外的至少一种金属发生共晶反应的金属以及金属B中除Au之外的至少一种金属。
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2.发明申请Bonded Structure of Dissimilar Metallic Materials and Method of Joining Dissimilar Metallic Materials 审中-公开不同金属材料的结合结构和接合不同金属材料的方法公开(公告)号：US20140144889A1
公开(公告)日：2014-05-29
申请号：US14169984
申请日：2014-01-31
CPC分类号： B23K11/115 , B23K11/20 , B23K26/22 , B23K26/323 , B23K2101/34 , B23K2103/10 , B23K2103/14 , B23K2103/18 , B23K2103/20 , B23K2103/24 , Y10T428/12736
摘要： Disclosed herein are bonded structures and methods of forming the same. One embodiment of a bonded structure comprises first and second metallic layers and a bonding interface between the first and second metallic layers formed by diffusion and comprising a layer of at least one intermetallic compound. The intermetallic compound layer is formed in an area 52% or greater of an area of the bonding interface and has a thickness of 0.5 to 3.2 μm.
摘要翻译： 本文公开了结合结构及其形成方法。 键合结构的一个实施例包括第一和第二金属层以及通过扩散形成的包括至少一种金属间化合物的层的第一和第二金属层之间的结合界面。 金属间化合物层形成在接合界面的面积的52％以上的区域中，其厚度为0.5〜3.2μm。
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公开(公告)号：US11623262B2
公开(公告)日：2023-04-11
申请号：US17257933
申请日：2018-07-06
IPC分类号： B21D22/18
摘要： A method for incrementally forming includes: preparing a tool T disposed on one side of a metal plate W, a fixing jig 1 to hold a periphery of the metal plate W, and a template P1 including a molded edge E that follows at least a part of a contour of a part to be processed F; arranging the template P1 on the other side of the metal plate W; holding the periphery of the metal plate W together with the template P1 by the fixing jig 1 to fix the metal plate W and the template P1; and moving the tool T while pressing the tool T against the metal plate W, to incrementally form the part to be processed F having a three-dimensional shape of the metal plate W.
The method enables to form the part to be processed F in high precision with no use of a molding die and thus, is effective in bringing about reducing cost of equipment and manufacturing.-
公开(公告)号：US10173281B2
公开(公告)日：2019-01-08
申请号：US14169984
申请日：2014-01-31
IPC分类号： B23K11/11 , B23K31/02 , B23K11/20 , B23K26/323 , B23K26/22 , B23K101/34 , B23K103/10 , B23K103/14 , B23K103/18 , B23K103/20 , B23K103/24
摘要： Disclosed herein are bonded structures and methods of forming the same. One embodiment of a bonded structure comprises first and second metallic layers and a bonding interface between the first and second metallic layers formed by diffusion and comprising a layer of at least one intermetallic compound. The intermetallic compound layer is formed in an area 52% or greater of an area of the bonding interface and has a thickness of 0.5 to 3.2 μm.
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公开(公告)号：US09272361B2
公开(公告)日：2016-03-01
申请号：US14378441
申请日：2013-02-25
IPC分类号： B23K31/02 , B23K20/02 , B23K20/16 , B23K20/233 , B23K35/28
CPC分类号： B23K20/026 , B23K20/021 , B23K20/16 , B23K20/233 , B23K35/282 , B23K2101/36 , B23K2103/08 , B23K2103/10 , B23K2103/12 , B23K2103/18
摘要： A method for joining metal materials, which joins a first member with at least a joining face made of Metal A, the Metal A being mainly composed of at least one selected from the group consisting of Al, Cu, Ag and Au, to a second member with at least a joining face made of Metal B, the Metal B being mainly composed of at least one selected from the group consisting of Al Cu, Ag and Au, includes interposing an insert between the joining faces of the first and second members, wherein the insert contains Zn as a metal capable of causing an eutectic reaction with at least one metal except for Au in Metal A as well as at least one metal except for Au in Metal B.
摘要翻译： 一种金属材料的接合方法，其将第一构件与至少由金属A制成的接合面接合，所述金属A主要由选自由Al，Cu，Ag和Au组成的组中的至少一种组成至第二构件 具有至少一个由金属B制成的接合面的构件，金属B主要由选自Al Cu，Ag和Au中的至少一种组成，包括在第一和第二构件的接合面之间插入插入物， 其中所述插入物含有Zn作为能够与金属A中除Au之外的至少一种金属发生共晶反应的金属以及金属B中除Au之外的至少一种金属。
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