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    SEALED FORCE SENSOR WITH ETCH STOP LAYER
    1.
    发明公开
    SEALED FORCE SENSOR WITH ETCH STOP LAYER 审中-公开

    公开(公告)号：US20240247986A1

    公开(公告)日：2024-07-25

    申请号：US18597341

    申请日：2024-03-06

    Applicant: NextInput, Inc.

    Inventor： Julius Minglin Tsai ,  Ryan Diestelhorst ,  Dan Krstyen Benjamin

    IPC: G01L1/18 ,  B81B3/00 ,  B81C1/00 ,  G01L1/26

    CPC classification number: G01L1/18 ,  B81B3/0021 ,  B81C1/00595 ,  G01L1/26 ,  B81B2203/0127 ,  B81C2201/014

    Abstract: An example microelectromechanical system (MEMS) force sensor is described herein. The MEMS force sensor can include a sensor die configured to receive an applied force. The sensor die can include a first substrate and a second substrate, where a cavity is formed in the first substrate and where at least a portion of the second substrate defines a deformable membrane. The MEMS force sensor can also include an etch stop layer arranged between the first substrate and the second substrate, and a sensing element arranged on a surface of the second substrate. The sensing element can be configured to convert a strain on the surface of the membrane substrate to an analog electrical signal that is proportional to the strain.

    Force-sensitive electronic device
    4.
    发明授权
    Force-sensitive electronic device 有权

    公开(公告)号：US10775940B2

    公开(公告)日：2020-09-15

    申请号：US15492127

    申请日：2017-04-20

    Applicant: NextInput, Inc.

    Inventor： Ian Campbell ,  Ryan Diestelhorst

    IPC: G06F3/044 ,  G06F3/041

    Abstract: An example force-sensitive electronic device is described herein. The device can include a device body, a touch surface bonded to the device body in a bonded region that is arranged along a peripheral edge of the touch surface, and a plurality of force sensors that are arranged between the device body and the touch surface. Each of the plurality of force sensors can be spaced apart from the bonded region.

    RUGGEDIZED WAFER LEVEL MEMS FORCE SENSOR WITH A TOLERANCE TRENCH
    5.
    发明申请
    RUGGEDIZED WAFER LEVEL MEMS FORCE SENSOR WITH A TOLERANCE TRENCH 审中-公开
    具有耐用性的凝结水平MEMS力传感器

    公开(公告)号：US20160363490A1

    公开(公告)日：2016-12-15

    申请号：US15178976

    申请日：2016-06-10

    Applicant: NextInput, Inc.

    Inventor： Ian Campbell ,  Ryan Diestelhorst ,  Dan Benjamin ,  Steven S. Nasiri

    IPC: G01L1/18

    CPC classification number: G01L1/18 ,  G01L1/26

    Abstract: An example MEMS force sensor is described herein. The MEMS force sensor can include a cap for receiving an applied force and a sensor bonded to the cap. A trench and a cavity can be formed in the sensor. The trench can be formed along at least a portion of a peripheral edge of the sensor. The cavity can define an outer wall and a flexible sensing element, and the outer wall can be arranged between the trench and the cavity. The cavity can be sealed between the cap and the sensor. The sensor can also include a sensor element formed on the flexible sensing element. The sensor element can change an electrical characteristic in response to deflection of the flexible sensing element.

    Abstract translation: 这里描述了示例性MEMS力传感器。 MEMS力传感器可以包括用于接收施加的力的盖和结合到盖的传感器。 可以在传感器中形成沟槽和空腔。 沟槽可以沿着传感器的周缘的至少一部分形成。 空腔可以限定外壁和柔性感测元件，并且外壁可以布置在沟槽和空腔之间。 空腔可以密封在盖和传感器之间。 传感器还可以包括形成在柔性感测元件上的传感器元件。 传感器元件可以响应于柔性传感元件的偏转而改变电特性。

    Integrated piezoresistive and piezoelectric fusion force sensor
    7.
    发明授权
    Integrated piezoresistive and piezoelectric fusion force sensor 有权

    公开(公告)号：US11808644B2

    公开(公告)日：2023-11-07

    申请号：US18081255

    申请日：2022-12-14

    Applicant: NEXTINPUT, Inc.

    Inventor： Julius Minglin Tsai ,  Ryan Diestelhorst ,  Dan Benjamin

    IPC: G01L1/16 ,  G01L1/18 ,  G01L5/00 ,  B81B3/00

    CPC classification number: G01L1/16 ,  G01L1/18 ,  G01L5/0028 ,  B81B3/0072

    Abstract: Described herein is a ruggedized microelectromechanical (“MEMS”) force sensor including both piezoresistive and piezoelectric sensing elements and integrated with complementary metal-oxide-semiconductor (“CMOS”) circuitry on the same chip. The sensor employs piezoresistive strain gauges for static force and piezoelectric strain gauges for dynamic changes in force. Both piezoresistive and piezoelectric sensing elements are electrically connected to integrated circuits provided on the same substrate as the sensing elements. The integrated circuits can be configured to amplify, digitize, calibrate, store, and/or communicate force values electrical terminals to external circuitry.

    FORCE SENSOR MODULE FOR APPLYING A PRELOAD FORCE TO A FORCE SENSOR
    9.
    发明申请
    FORCE SENSOR MODULE FOR APPLYING A PRELOAD FORCE TO A FORCE SENSOR 审中-公开
    用于将力传感器应用于力传感器的力传感器模块

    公开(公告)号：US20150138112A1

    公开(公告)日：2015-05-21

    申请号：US14536734

    申请日：2014-11-10

    Applicant: NextInput, Inc.

    Inventor： Ian Campbell ,  Ryan Diestelhorst

    IPC: G06F3/041 ,  G01L1/14

    CPC classification number: G06F3/0414 ,  G01L1/142 ,  G06F3/044 ,  G06F2203/04106 ,  Y10T29/4913

    Abstract: An example force sensor module for a touch-sensitive electronic device can include a force sensor, a bias assembly and an opposing bias assembly that is coupled to the bias assembly. The bias assembly can have a top wall and a plurality of side walls extending from the top wall. The top and side walls can define a chamber. The force sensor can be arranged between the bias assembly and the opposing bias assembly within the chamber. Additionally, the bias and opposing bias assemblies can be configured to apply a preload force to the force sensor, which is approximately equal to a spring force exerted between the bias and opposing bias assemblies.

    Abstract translation: 用于触敏电子设备的示例性力传感器模块可以包括力传感器，偏置组件和耦合到偏置组件的相对偏置组件。 偏置组件可以具有从顶壁延伸的顶壁和多个侧壁。 顶壁和侧壁可以限定一个室。 力传感器可以布置在偏压组件和腔室内的对置偏压组件之间。 另外，偏置和相对的偏置组件可以被配置为向力传感器施加预加载力，其大致等于施加在偏置组件和相对的偏置组件之间的弹簧力。

    Microelectromechanical load sensor and methods of manufacturing the same
    10.
    发明授权
    Microelectromechanical load sensor and methods of manufacturing the same 有权
    微机电负载传感器及其制造方法

    公开(公告)号：US09032818B2

    公开(公告)日：2015-05-19

    申请号：US13934900

    申请日：2013-07-03

    Applicant: NextInput, Inc.

    Inventor： Ian Campbell ,  Ryan Diestelhorst

    IPC: G01L1/22 ,  G01L1/18 ,  B81B3/00 ,  B81C1/00 ,  G01L1/14 ,  G01L1/26 ,  G01L5/16

    CPC classification number: G01L1/18 ,  B81B3/0018 ,  B81C1/00134 ,  G01L1/148 ,  G01L1/26 ,  G01L5/162

    Abstract: A microelectromechanical (“MEMS”) load sensor device for measuring a force applied by a human user is described herein. In one aspect, the load sensor device has a contact surface in communication with a touch surface which communicates forces originating on the touch surface to a deformable membrane, on which load sensor elements are arranged, such that the load sensor device produces a signal proportional to forces imparted by a human user along the touch surface. In another aspect, the load sensor device has an overload protection ring to protect the load sensor device from excessive forces. In another aspect, the load sensor device has embedded logic circuitry to allow a microcontroller to individually address load sensor devices organized into an array. In another aspect, the load sensor device has electrical and mechanical connectors such as solder bumps designed to minimize cost of final component manufacturing.

    Abstract translation: 本文描述了用于测量人类用户施加的力的微机电（“MEMS”）负载传感器装置。 在一个方面，负载传感器装置具有与触摸表面连通的接触表面，该接触表面将起始于触摸表面的力连接到可变形膜上，负载传感器元件布置在其上，使得负载传感器装置产生与 由人类使用者沿着触摸表面施加的力。 在另一方面，负载传感器装置具有过载保护环以保护负载传感器装置免受过大的力。 在另一方面，负载传感器装置具有嵌入式逻辑电路，以允许微控制器分别地组织成阵列的负载传感器装置。 在另一方面，负载传感器装置具有电气和机械连接器，例如设计成最小化最终部件制造成本的焊料凸块。

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