公开(公告)号：US20240079425A1

公开(公告)日：2024-03-07

申请号：US18508710

申请日：2023-11-14

Applicant: OLYMPUS CORPORATION

Inventor： Naoki ITO ,  Takatoshi IGARASHI ,  Keiichi KOBAYASHI ,  Takahiro SHIMOHATA

IPC: H01L27/146 ,  H04N23/50 ,  H04N23/54

CPC classification number: H01L27/14618 ,  H01L27/14627 ,  H01L27/14636 ,  H01L27/14685 ,  H04N23/54 ,  H04N23/555 ,  A61B1/051

Abstract: An image pickup module includes: a lens unit including a first principal surface and a second principal surface; an image pickup unit including a third principal surface and a fourth principal surface on which an external electrode is disposed; a wiring board including a hole and a bonding electrode disposed on a bottom surface of the hole; a solder that bonds the bonding electrode and the external electrode; a rigid member that defines a spacing between the fourth principal surface and the bottom surface; and a second resin disposed between the fourth principal surface and the bottom surface.

公开(公告)号：US20230225593A1

公开(公告)日：2023-07-20

申请号：US18125902

申请日：2023-03-24

Applicant: OLYMPUS CORPORATION

Inventor： Takatoshi IGARASHI

IPC: A61B1/00 ,  A61B1/06

CPC classification number: A61B1/00163 ,  A61B1/06 ,  A61B1/00002

Abstract: An image pickup apparatus of the present invention includes a first member including an illumination optical element and an observation optical element, an image pickup device, and a second member including a signal wire and an illumination member. The first member includes a first layer substrate including an illumination window and an observation window and a second layer substrate including a first illumination element and an observation lens, the second member includes a third layer substrate including a second illumination element and an opening in which the image pickup device is disposed and a fourth layer substrate including a third illumination element and a signal wire, the first member and the second member are stacked in order of the first layer substrate, the second layer substrate, the third layer substrate, and the fourth layer substrate and integrally bonded, and the first illumination element is a light emitting element.

公开(公告)号：US20210141210A9

公开(公告)日：2021-05-13

申请号：US16656788

申请日：2019-10-18

Applicant: OLYMPUS CORPORATION

Inventor： Takatoshi IGARASHI ,  Takahiro SHIMOHATA ,  Takuro SUYAMA

IPC: G02B23/24 ,  H04N5/225 ,  H01L27/146

Abstract: An image pickup module includes a stacked element in which an external electrode is disposed on a rear surface, a first wiring board where a front electrode connected to the external electrode by an interconnecting bonding section and a first electrode are disposed, and a first signal cable connected to the first electrode by a cable bonding section, in which the first wiring board is flexible and includes a bent section in a space defined by extending a first region out of the first region and a second region obtained by dividing the rear surface into two regions in an optical axis direction, and a length of the first wiring board from the interconnecting bonding section to the cable bonding section is longer than a length of the stacked element from the interconnecting bonding section to an end side in the first region.

公开(公告)号：US20200333581A1

公开(公告)日：2020-10-22

申请号：US16921236

申请日：2020-07-06

Applicant: OLYMPUS CORPORATION

Inventor： Hiroshi KOBAYASHI ,  Takatoshi IGARASHI

IPC: G02B23/24 ,  H04N5/225

Abstract: An image pickup apparatus for endoscope includes: an optical unit having an incident surface and an emitting surface; an image pickup unit adhering to the emitting surface; an interposer where the image pickup unit is bonded to a first electrode of a first main surface; and an electric cable bonded to the interposer. The image pickup unit is smaller than the optical unit and the interposer in an outer size in a direction orthogonal to an optical axis. The image pickup apparatus for endoscope further includes a heat conductive resin with which a portion among the emitting surface, the first main surface, and a side surface of the image pickup unit is filled. The first electrode extends to a position where the first electrode is brought into contact with the heat conductive resin.

公开(公告)号：US20190274529A1

公开(公告)日：2019-09-12

申请号：US16416522

申请日：2019-05-20

Applicant: OLYMPUS CORPORATION

Inventor： Takuro SUYAMA ,  Takatoshi IGARASHI ,  Kensuke SUGA ,  Yoshiro NISHIMURA

IPC: A61B1/05 ,  G02B23/24 ,  H01L27/146 ,  A61B1/00 ,  H04N5/225

Abstract: An image pickup module includes a plurality of semiconductor devices laminated via a sealing layer a signal is transmitted via a signal cable connected to a rear surface of the image pickup module, a first semiconductor device has a semiconductor circuit portion in a central area on a first principal plane, through wires in an intermediate area and first electrodes connected to the through wires in the central area on a second principal plane, the second semiconductor device has second electrodes in the central area on a third principal plane, and an external connection terminal to which the signal cable is connected, on a rear surface, and the sealing layer includes a first sealing layer arranged in the central area and a second sealing layer disposed in an outer circumferential area surrounding the intermediate area and with a Young's modulus smaller than a Young's modulus of the first sealing layer.

公开(公告)号：US20190214426A1

公开(公告)日：2019-07-11

申请号：US16352954

申请日：2019-03-14

Applicant: OLYMPUS CORPORATION

Inventor： Takahiro SHIMOHATA ,  Takatoshi IGARASHI

IPC: H01L27/146 ,  A61B1/05 ,  H04N5/369

CPC classification number: H01L27/14636 ,  A61B1/04 ,  A61B1/05 ,  H01L27/14 ,  H01L27/14618 ,  H01L27/14632 ,  H01L27/14687 ,  H04N5/369

Abstract: An image pickup unit includes: an image pickup device; a device laminate in which a plurality of semiconductor devices are laminated; and a signal cable having a lead wire and a shield lead wire. The plurality of semiconductor devices have cutouts. A groove in parallel with an optical axis direction is configured on a side surface of the device laminate by a plurality of the cutouts which communicate with one another. On cutout surfaces of the semiconductor devices, side electrodes are arranged. The lead wire and the shield lead wire are housed in the respective cutouts which have diameters in accordance with respective diameters of the lead wire and the shield lead wire. The lead wire is bonded to the side electrode and the shield lead wire is bonded to the side electrode.

公开(公告)号：US20170360284A1

公开(公告)日：2017-12-21

申请号：US15695194

申请日：2017-09-05

Applicant: OLYMPUS CORPORATION ,  PANASONIC CORPORATION

Inventor： Tomokazu YAMASHITA ,  Takatoshi IGARASHI ,  Noriyuki FUJIMORI ,  Motonari KATSUNO

IPC: A61B1/05 ,  H04N5/225

CPC classification number: A61B1/05 ,  A61B1/04 ,  G02B23/24 ,  H01L21/3205 ,  H01L21/768 ,  H01L21/822 ,  H01L23/522 ,  H01L27/04 ,  H01L27/14 ,  H01L27/146 ,  H01L27/14618 ,  H01L27/14636 ,  H01L2224/11 ,  H04N5/2253 ,  H04N5/2256 ,  H04N5/369 ,  H04N2005/2255

Abstract: An endoscope device includes: an imaging unit including a semiconductor chip including an image sensor formed thereon, and a protective glass adhered on the image sensor with an adhesive layer; and a holder configured to hold the imaging unit by fitting the protective glass therein. The semiconductor chip includes: a light-receiving section; a peripheral circuit section; a guard ring surrounding the light-receiving section and the peripheral circuit section; and a plurality of metal dots formed on an outer circumference of the guard ring. The protective glass is adhered to the semiconductor chip by the adhesive layer so as to cover the light-receiving section, the peripheral circuit section, the guard ring, and the metal dots, and the metal dots are formed at a same interval from the outer circumference of the guard ring to a connection end portion of a connecting surface between the semiconductor chip and the protective glass.

公开(公告)号：US20160028926A1

公开(公告)日：2016-01-28

申请号：US14873791

申请日：2015-10-02

Applicant: OLYMPUS CORPORATION

Inventor： Hironobu ICHIMURA ,  Tomohisa TAKAHASHI ,  Noriyuki FUJIMORI ,  Takatoshi IGARASHI

IPC: H04N5/225 ,  A61B1/12 ,  A61B1/00 ,  A61B1/04

CPC classification number: H04N5/2251 ,  A61B1/00114 ,  A61B1/04 ,  A61B1/051 ,  A61B1/128 ,  G02B23/2484 ,  H04N5/2256 ,  H04N2005/2255 ,  H05K1/0201

Abstract: An endoscope apparatus includes: a solid-state imaging element including a light receiving surface on a front face thereof; a circuit board arranged on a rear face side of the solid-state imaging element, the circuit board including a wiring pattern a part of which is exposed on a distal end side of the circuit board, the distal end side facing the solid-state imaging element; a first heat dissipation member arranged between the solid-state imaging element and the exposed part of the wiring pattern, the first heat dissipation member being in contact with the rear face of the solid-state imaging element and the exposed part of the wiring pattern; and a cable electrically connected to the wiring pattern. A width of the exposed part of the wiring pattern in contact with the first heat dissipation member is wider than that of the wiring pattern at a central part of the circuit board.

Abstract translation: 一种内窥镜装置，包括：固态成像元件，其在前表面包括受光面; 布置在所述固态成像元件的背面侧的电路板，所述电路板包括布线图案，所述布线图案的一部分暴露在所述电路板的远端侧，所述远端侧面向固态成像 元件; 布置在固态成像元件和布线图案的暴露部分之间的第一散热构件，第一散热构件与固态成像元件的背面和布线图案的露出部分接触; 以及电连接到布线图案的电缆。 与第一散热构件接触的布线图案的露出部分的宽度比在电路板的中心部分处的布线图案的宽度宽。

公开(公告)号：US20220365334A1

公开(公告)日：2022-11-17

申请号：US17865738

申请日：2022-07-15

Applicant: OLYMPUS CORPORATION

Inventor： Takatoshi IGARASHI ,  Satoru ADACHI ,  Nana AKAHANE ,  Masashi SAITO

IPC: G02B23/24 ,  H01L27/146 ,  H04N5/369

Abstract: An endoscope includes: an image sensor having a light receiving plane; a laminate provided to be opposed to an opposite side of the image sensor from the light receiving plane and having a plurality of layers formed by lamination of a plurality of semiconductor elements; and an insertion section having the image sensor and the laminate therein. The laminate includes: a first active layer in which a first active element is provided; a first passive layer in which a first passive element is provided and which is provided between the first active layer and the image sensor; and a through-silicon via provided in each of the first active layer and the first passive layer.

公开(公告)号：US20210096354A1

公开(公告)日：2021-04-01

申请号：US17028015

申请日：2020-09-22

Applicant: OLYMPUS CORPORATION

Inventor： Keiichi KOBAYASHI ,  Takatoshi IGARASHI ,  Takahiro SHIMOHATA

IPC: G02B23/24

Abstract: An image pickup apparatus includes an image pickup module in which an image pickup device is laminated, a relay board having a plurality of flying leads which are electrically connected to a proximal end face of the image pickup module through ultrasonic wire bonding, and a plurality of cables electrically connected to a plurality of connection lands of the relay board, and a bent portion is formed on the relay board so that the plurality of cables are fitted within a projection surface of the proximal end face of the image pickup module.