公开(公告)号：US20190189587A1

公开(公告)日：2019-06-20

申请号：US16324528

申请日：2017-06-16

Applicant: OSAKA UNIVERSITY

Inventor： Katsuaki SUGANUMA ,  Shijo NAGAO ,  Akio SHIMOYAMA ,  Shinya SEKI

IPC: H01L23/00 ,  B23K1/00

CPC classification number: H01L24/75 ,  B23K1/0008 ,  B23K2101/40 ,  H01L21/52 ,  H01L2224/75304 ,  H01L2224/7555 ,  H01L2224/75822 ,  H01L2224/7598

Abstract: A bonding device (100) bonds at least one component (C) to a substrate (B) using a metal material (M). The bonding device (100) includes a wall section (20), at least one pressing section (40), and a rotational shaft (30). The rotational shaft (30) is fixed to the wall section (20). Each pressing section (40) has an arm (42) and a presser (43) or a substrate supporting member (90). The arm (42) extends from the rotational shaft (30). The arm (42) pivots about the rotational shaft (30). The presser (43) presses the component (C). The substrate supporting member (90) is disposed on a reference surface (142). The substrate supporting member (90) supports the substrate (B). The component (C) is bonded to the substrate (B) through point contact of the presser (43) with the component (C) or point contact of the substrate supporting member (90) with the reference surface (142).

公开(公告)号：US20190157229A1

公开(公告)日：2019-05-23

申请号：US16097050

申请日：2017-04-28

Applicant: SHARP KABUSHIKI KAISHA ,  OSAKA UNIVERSITY

Inventor： Tomotoshi SATOH ,  Hiroya SATO ,  Katsuaki SUGANUMA ,  Aiji SUETAKE ,  Shijo NAGAO ,  Jinting JIU ,  Seiichiro KIHARA

IPC: H01L23/00

Abstract: Provided is an electrode like a protruding electrode that is self-standing on a substrate. A conductive paste (202) contains a conductive powder, an alcoholic liquid component, and no adhesives. The conductive powder contains conductive particles having a thickness of 0.05 μm or more and 0.1 μm or less and a representative length of 5 μm or more and 10 μm or less, the representative length being a maximum diameter in a plane perpendicular to the direction of the thickness. The weight percentage of the alcoholic liquid component relative to the conductive paste is 8% or more and 20% or less.

公开(公告)号：US20190047093A1

公开(公告)日：2019-02-14

申请号：US16077376

申请日：2017-02-10

Applicant: OSAKA UNIVERSITY ,  National Cheng Kung University

Inventor： Katsuaki SUGANUMA ,  Shijo NAGAO ,  Shih-kang LIN

IPC: B23K35/30 ,  B23K1/00 ,  B23K35/02 ,  C23C30/00

Abstract: A bonding material (10) of the present invention includes an amorphous silver film (12).

公开(公告)号：US20170170137A1

公开(公告)日：2017-06-15

申请号：US15116104

申请日：2015-02-03

Applicant: OSAKA UNIVERSITY

Inventor： Katsuaki SUGANUMA ,  Shijo NAGAO ,  Chulmin OH

IPC: H01L23/00

CPC classification number: H01L24/16 ,  H01L23/367 ,  H01L23/3736 ,  H01L23/3737 ,  H01L23/42 ,  H01L24/00 ,  H01L24/11 ,  H01L24/13 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/0345 ,  H01L2224/0346 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/05573 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/05684 ,  H01L2224/11848 ,  H01L2224/13294 ,  H01L2224/13339 ,  H01L2224/16057 ,  H01L2224/16227 ,  H01L2224/27848 ,  H01L2224/29118 ,  H01L2224/29124 ,  H01L2224/29139 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2224/29157 ,  H01L2224/2916 ,  H01L2224/29164 ,  H01L2224/29294 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/81007 ,  H01L2224/8183 ,  H01L2224/8184 ,  H01L2224/83007 ,  H01L2224/83193 ,  H01L2224/8383 ,  H01L2224/8384 ,  H01L2224/83855 ,  H01L2224/83815 ,  H01L2924/00014

Abstract: A bonding structure (100) of the present invention includes a substrate (110), a metal film (120), a semiconductor element (130). The substrate (110), the metal film (120), and the semiconductor element (130) are laminated in order just mentioned. The metal film (120) contains a metal diffused through stress migration, and the substrate (110) and the semiconductor element (130) are bonded together with the metal film (120) therebetween.