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公开(公告)号：US20180351058A1
公开(公告)日：2018-12-06
申请号：US15991271
申请日：2018-05-29
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Ralf Mueller , Ralf Staub , Christian Ziereis
Abstract: An optoelectronic component includes a reflective material, wherein the reflective material includes a surface, at least one optoelectronic semiconductor chip is embedded into the reflective material such that at least a top side of the optoelectronic semiconductor chip, the top side being configured to emit electromagnetic radiation and is not covered by the reflective material, the surface of the reflective material is formed in a manner extending parallel to the top side of the optoelectronic semiconductor chip and facing away from an underside of the optoelectronic semiconductor chip, the surface of the reflective material includes a contrast region, and the reflective material is superficially removed in the contrast region.
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公开(公告)号：US20160043291A1
公开(公告)日：2016-02-11
申请号：US14783255
申请日：2014-04-09
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor： Tobias Gebuhr , Christian Ziereis , Michael Zitzlsperger
CPC classification number: H01L33/56 , H01L25/0753 , H01L25/50 , H01L33/08 , H01L33/48 , H01L33/486 , H01L33/54 , H01L33/62 , H01L2224/48091 , H01L2224/73265 , H01L2933/0033 , H01L2933/005 , H01L2933/0066 , H01L2924/00014
Abstract: An optoelectronic component includes a carrier including a mounting surface, at least one light-emitting element arranged on the mounting surface and electrically conductively connected to the carrier, at least one reinforcing body integrated in the optoelectronic component, a housing consisting of a housing encapsulation compound or a housing molding compound, wherein the light emitting component is arranged in an emitter cavity of the housing, and a reinforcing body cavity in which the reinforcing body is arranged fully or partially encapsulated or encased with a reinforcing body encapsulation compound.
Abstract translation: 光电子部件包括载体，其包括安装表面，至少一个发光元件，其布置在安装表面上并导电地连接到载体，至少一个集成在光电子部件中的增强体，由壳体封装化合物 或壳体模制化合物，其中所述发光部件布置在所述壳体的发射器腔体中，以及加强体腔体，其中所述增强体被完全或部分地包封或包裹有增强体包封化合物。
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Patent Agency Ranking
公开(公告)号：US09614134B2
公开(公告)日：2017-04-04
申请号：US14783255
申请日：2014-04-09
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Tobias Gebuhr , Christian Ziereis , Michael Zitzlsperger
CPC classification number: H01L33/56 , H01L25/0753 , H01L25/50 , H01L33/08 , H01L33/48 , H01L33/486 , H01L33/54 , H01L33/62 , H01L2224/48091 , H01L2224/73265 , H01L2933/0033 , H01L2933/005 , H01L2933/0066 , H01L2924/00014
Abstract: An optoelectronic component includes a carrier including a mounting surface, at least one light-emitting element arranged on the mounting surface and electrically conductively connected to the carrier, at least one reinforcing body integrated in the optoelectronic component, a housing consisting of a housing encapsulation compound or a housing molding compound, wherein the light emitting component is arranged in an emitter cavity of the housing, and a reinforcing body cavity in which the reinforcing body is arranged fully or partially encapsulated or encased with a reinforcing body encapsulation compound.
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公开(公告)号：US20160240756A1
公开(公告)日：2016-08-18
申请号：US15022573
申请日：2014-09-18
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor： Michael Zitzlsperger , Christian Ziereis , Tobias Gebuhr
CPC classification number: H01L33/62 , H01L22/14 , H01L33/483 , H01L33/486 , H01L33/54 , H01L33/58 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/48479 , H01L2924/00014 , H01L2924/19107 , H01L2933/0033 , H01L2933/005 , H01L2933/0066 , H01L2224/48471 , H01L2924/00 , H01L2224/4554
Abstract: An optoelectronic component includes a housing including a plastic material and a first lead frame section at least partly embedded in the plastic material, a first recess and a second recess, wherein a first upper section of an upper side of the first lead frame section is not covered by the plastic material in the first recess, a second upper section of the upper side of the first lead frame section is not covered by the plastic material in the second recess, the first recess and the second recess are separated from one another by a section of the plastic material, an optoelectronic semiconductor chip is arranged in the first recess, and no optoelectronic semiconductor chips is arranged in the second recess.
Abstract translation: 光电子部件包括壳体，其包括塑料材料和至少部分地嵌入在塑料材料中的第一引线框架部分，第一凹部和第二凹部，其中第一引线框架部分的上侧的第一上部部分不是 在第一凹部中由塑料材料覆盖，第一引线框架部分的上侧的第二上部部分不被第二凹部中的塑料材料覆盖，第一凹部和第二凹部彼此分开一个 在第一凹部中配置光电子半导体芯片，在第二凹部内不设置光电子半导体芯片。
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公开(公告)号：US09922907B2
公开(公告)日：2018-03-20
申请号：US15327009
申请日：2015-07-14
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Daniel Richter , MIchael Zitzlsperger , Christian Ziereis , Stefan Gruber
IPC: H01L23/495 , H01L33/62 , H01L25/075 , H01L25/16 , H01L27/02 , H01L33/48
CPC classification number: H01L23/49541 , H01L23/49503 , H01L23/4951 , H01L23/49575 , H01L25/0753 , H01L25/167 , H01L27/0248 , H01L33/486 , H01L33/62 , H01L2224/49113
Abstract: An electronic component, a leadframe, and a method for producing an electronic component are disclosed. In an embodiment, the electronic component includes a housing and a leadframe section partly embedded in the housing, wherein the leadframe section includes a first quadrant, a second quadrant, a third quadrant and a fourth quadrant, wherein each of the quadrants has a first leadframe part and a second leadframe part, wherein each first leadframe part includes a chip landing area, wherein the chip landing areas of all four quadrants are arranged adjacently to a common central region of the leadframe section, and wherein the four quadrants are configured symmetrically with respect to one another.
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公开(公告)号：US09853198B2
公开(公告)日：2017-12-26
申请号：US15022573
申请日：2014-09-18
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Michael Zitzlsperger , Christian Ziereis , Tobias Gebuhr
CPC classification number: H01L33/62 , H01L22/14 , H01L33/483 , H01L33/486 , H01L33/54 , H01L33/58 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/48479 , H01L2924/00014 , H01L2924/19107 , H01L2933/0033 , H01L2933/005 , H01L2933/0066 , H01L2224/48471 , H01L2924/00 , H01L2224/4554
Abstract: An optoelectronic component includes a housing including a plastic material and a first lead frame section at least partly embedded in the plastic material, a first recess and a second recess, wherein a first upper section of an upper side of the first lead frame section is not covered by the plastic material in the first recess, a second upper section of the upper side of the first lead frame section is not covered by the plastic material in the second recess, the first recess and the second recess are separated from one another by a section of the plastic material, an optoelectronic semiconductor chip is arranged in the first recess, and no optoelectronic semiconductor chips is arranged in the second recess.
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公开(公告)号：US20170179353A1
公开(公告)日：2017-06-22
申请号：US15327009
申请日：2015-07-14
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Daniel Richter , Michael Zitzlsperger , Christian Ziereis , Stefan Gruber
IPC: H01L33/62 , H01L33/48 , H01L27/02 , H01L25/075 , H01L25/16
CPC classification number: H01L23/49541 , H01L23/49503 , H01L23/4951 , H01L23/49575 , H01L25/0753 , H01L25/167 , H01L27/0248 , H01L33/486 , H01L33/62 , H01L2224/49113
Abstract: An electronic component, a leadframe, and a method for producing an electronic component are disclosed. In an embodiment, the electronic component includes a housing and a leadframe section partly embedded in the housing, wherein the leadframe section includes a first quadrant, a second quadrant, a third quadrant and a fourth quadrant, wherein each of the quadrants has a first leadframe part and a second leadframe part, wherein each first leadframe part includes a chip landing area, wherein the chip landing areas of all four quadrants are arranged adjacently to a common central region of the leadframe section, and wherein the four quadrants are configured symmetrically with respect to one another.
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