公开(公告)号：US09773951B2

公开(公告)日：2017-09-26

申请号：US14383091

申请日：2013-03-04

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Ulrich Frei ,  Rainer Huber

IPC: H01L33/48 ,  H01L33/62 ,  H01L27/15

CPC classification number: H01L33/486 ,  H01L27/15 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An optoelectronic module (100) is defined, comprising at least one semiconductor chip (10) provided for emitting electromagnetic radiation and at least one holding device (20) which is adapted to fix in place a device (50) for encoding at least one optical or electronic parameter of the optoelectronic module (100). Furthermore, a process for the production of the optoelectronic module (100) is defined.

公开(公告)号：US09591705B2

公开(公告)日：2017-03-07

申请号：US14653816

申请日：2014-01-07

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Norbert Häfner ,  Ulrich Frei ,  Stefan Grötsch ,  Rainer Huber

IPC: H05B33/08 ,  B60Q1/14

CPC classification number: H05B33/0815 ,  B60Q1/1407 ,  H05B33/083 ,  H05B33/0845 ,  H05B33/089 ,  Y02B20/341

Abstract: A method is set up to operate an arrangement that has N radiation-emitting semiconductor chips arranged in an electric series circuit. The arrangement includes multiple switching elements, wherein to each of the semiconductor chips one of the switching elements is connected electrically in parallel. The arrangement includes a controller for the mutually independent activation of the switching elements. The arrangement includes a constant current circuit for energizing the series circuit. When switching off, the respective semiconductor chip associated with a switching element is bridged electrically by the switching element. A protective module of the arrangement is set up to reduce or to prevent current peaks when one or more of the semiconductor chips is/are switched off.

Abstract translation: 设置一种方法来操作具有布置在电串联电路中的N个发射辐射半导体芯片的布置。 该装置包括多个开关元件，其中对于每个半导体芯片，开关元件中的一个并联电连接。 该装置包括用于相互独立地激活开关元件的控制器。 该装置包括用于使串联电路通电的恒流电路。 当关断时，与开关元件相关联的各个半导体芯片由开关元件电气桥接。 设置该配置的保护模块以减少或防止当半导体芯片中的一个或多个被切断时的电流峰值。

公开(公告)号：US20150351176A1

公开(公告)日：2015-12-03

申请号：US14653816

申请日：2014-01-07

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： Norbert Häfner ,  Ulrich Frei ,  Stefan Grötsch ,  Rainer Huber

IPC: H05B33/08 ,  B60Q1/14

CPC classification number: H05B33/0815 ,  B60Q1/1407 ,  H05B33/083 ,  H05B33/0845 ,  H05B33/089 ,  Y02B20/341

Abstract: A method is set up to operate an arrangement that has N radiation-emitting semiconductor chips arranged in an electric series circuit. The arrangement includes multiple switching elements, wherein to each of the semiconductor chips one of the switching elements is connected electrically in parallel. The arrangement includes a controller for the mutually independent activation of the switching elements. The arrangement includes a constant current circuit for energizing the series circuit. When switching off, the respective semiconductor chip associated with a switching element is bridged electrically by the switching element. A protective module of the arrangement is set up to reduce or to prevent current peaks when one or more of the semiconductor chips is/are switched off.

Abstract translation: 设置一种方法来操作具有布置在电串联电路中的N个发射辐射半导体芯片的布置。 该装置包括多个开关元件，其中对于每个半导体芯片，开关元件中的一个并联电连接。 该装置包括用于相互独立地激活开关元件的控制器。 该装置包括用于使串联电路通电的恒流电路。 当关断时，与开关元件相关联的各个半导体芯片由开关元件电气桥接。 设置该配置的保护模块以减少或防止当半导体芯片中的一个或多个被切断时的电流峰值。

公开(公告)号：US20250096206A1

公开(公告)日：2025-03-20

申请号：US18970720

申请日：2024-12-05

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Michael BRANDL ,  Andreas Dobner ,  Matthias Goldbach ,  Sebastian Wittmann ,  Uli Hiller ,  Markus Klein ,  Thomas Schwarz ,  Andreas Waldschik ,  Michael Wittmann ,  Matthias Bruckschloegl ,  Stefan Groetsch ,  Rainer Huber ,  Peter Brick ,  Ludwig Hofbauer

IPC: H01L25/075 ,  B60K35/00 ,  H01L33/60

Abstract: An optoelectronic device, in particular an at least partially transparent pane for example of a vehicle, comprises a first layer, in particular an intermediate layer arranged between a cover layer and a carrier layer, at least one electronic or optoelectronic component, which is at least partially or completely embedded in the first layer and at least one structured conductor layer. A first portion of the conductor layer is arranged on an upper surface of the first layer and a second portion of the conductor layer is arranged on a top surface of the electronic or optoelectronic component and is in contact with an electric contact of the electronic or optoelectronic component. The electric contact, in particular a contact pad, is arranged on the top surface.

公开(公告)号：US12040317B2

公开(公告)日：2024-07-16

申请号：US17541761

申请日：2021-12-03

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Michael Brandl ,  Andreas Dobner ,  Matthias Goldbach ,  Sebastian Wittmann ,  Uli Hiller ,  Markus Klein ,  Thomas Schwarz ,  Andreas Waldschik ,  Michael Wittmann ,  Matthias Bruckschloegl ,  Stefan Groetsch ,  Rainer Huber ,  Peter Brick ,  Ludwig Hofbauer

IPC: H04W72/20 ,  H01L25/075 ,  H01L33/46 ,  H01L33/62 ,  H01L33/64 ,  H04W72/51 ,  B60J3/00 ,  B60K35/00 ,  B60K35/60 ,  B62J50/22

CPC classification number: H01L25/0756 ,  H01L33/46 ,  H01L33/62 ,  H01L33/641 ,  H04W72/20 ,  H04W72/51 ,  B60J3/00 ,  B60K35/00 ,  B60K35/60 ,  B60K2370/785 ,  B62J50/22

Abstract: An optoelectronic device comprises a plurality of optoelectronic light sources being arranged on a first layer, in particular an intermediate layer being arranged between a cover layer and a carrier layer. The first layer comprises or consists of an at least partially transparent material and each optoelectronic light source of the plurality of optoelectronic light sources comprises an individual light converter for converting light emitted by the associated light source into converted light. The light converter of each optoelectronic light source is arranged on the first layer and/or the associated optoelectronic light source.

公开(公告)号：US20220149019A1

公开(公告)日：2022-05-12

申请号：US17541798

申请日：2021-12-03

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Michael Brandl ,  Andreas Dobner ,  Matthias Goldbach ,  Sebastian Wittmann ,  Uli Hiller ,  Markus Klein ,  Thomas Schwarz ,  Andreas Waldschik ,  Michael Wittmann ,  Matthias Bruckschloegl ,  Stefan Groetsch ,  Rainer Huber ,  Peter Brick ,  Ludwig Hofbauer

IPC: H01L25/075 ,  H01L33/46 ,  H01L33/62 ,  H01L33/64

Abstract: An optoelectronic device comprises a layer stack, which includes a carrier layer, a cover layer, and a first layer. The first layer is in particular an intermediate layer, arranged between the cover layer and the carrier layer. At least one electronic or optoelectronic element, in particular an optoelectronic light source, is arranged on the first layer and at least one layer of the layer stack and preferably all layers of the layer stack are at least partially transparent. The layer stack comprises at least one layer which comprises particles with a high thermal conductivity and/or at least one thermally conductive layer which is arranged between two adjacent layers of the layer stack.