公开(公告)号：US20150194583A1

公开(公告)日：2015-07-09

申请号：US14414803

申请日：2013-07-16

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Mathias Sabathil ,  Stefan Illek ,  Thomas Schwarz

IPC: H01L33/60 ,  H01L33/54 ,  H01L33/56 ,  H01L25/075 ,  H01L33/48

CPC classification number: H01L33/60 ,  H01L25/0753 ,  H01L25/167 ,  H01L25/50 ,  H01L31/00 ,  H01L31/02322 ,  H01L33/46 ,  H01L33/486 ,  H01L33/54 ,  H01L33/56 ,  H01L51/5271 ,  H01L2924/0002 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2924/00

Abstract: An optoelectronic semiconductor component includes an optoelectronic semiconductor chip having a first surface. The semiconductor chip is embedded in a mold body. The first surface is elevated with respect to a top side of the mold body. A reflective layer is arranged on the top side of the mold body.

Abstract translation: 光电子半导体部件包括具有第一表面的光电子半导体芯片。 半导体芯片嵌入模具体内。 第一表面相对于模具主体的顶侧被提升。 反射层设置在模体的顶侧。