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公开(公告)号：US20120052263A1
公开(公告)日：2012-03-01
申请号：US13292260
申请日：2011-11-09
CPC分类号： B32B7/045 , B23K3/0623 , B23K2101/40 , B32B7/14 , B32B15/01 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2924/00014 , Y10T428/12347 , Y10T428/24562 , Y10T428/24826 , Y10T428/249921 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A method for fine positioning a component through the use of fusible elements having two or more melting points so as to establish intermediate displacements between totally melted fusible elements and unmelted fusible elements. Because of the use of non-eutectic fusible materials, fine adjustments in the displacement may be achieved.
摘要翻译： 一种通过使用具有两个或多个熔点的可熔元件来精细定位部件的方法，以便在完全融化的可熔元件和未熔化的可熔元件之间建立中间位移。 由于使用非共晶的易熔材料，可以实现位移的微调。
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公开(公告)号：US20110091737A1
公开(公告)日：2011-04-21
申请号：US12955038
申请日：2010-11-29
CPC分类号： B32B7/045 , B23K3/0623 , B23K2101/40 , B32B7/14 , B32B15/01 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2924/00014 , Y10T428/12347 , Y10T428/24562 , Y10T428/24826 , Y10T428/249921 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A method for fine positioning a component through the use of fusible elements having two or more melting points so as to establish intermediate displacements between totally melted fusible elements and unmelted fusible elements. Because of the use of non-eutectic fusible materials, fine adjustments in the displacement may be achieved.
摘要翻译： 一种通过使用具有两个或多个熔点的可熔元件来精细定位部件的方法，以便在完全融化的可熔元件和未熔化的可熔元件之间建立中间位移。 由于使用非共晶的易熔材料，可以实现位移的微调。
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3.发明授权Method and apparatus providing fine alignment of a structure relative to a support 失效提供结构相对于支撑件的精细对准的方法和装置公开(公告)号：US07841510B2
公开(公告)日：2010-11-30
申请号：US11624830
申请日：2007-01-19
CPC分类号： B32B7/045 , B23K3/0623 , B23K2101/40 , B32B7/14 , B32B15/01 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2924/00014 , Y10T428/12347 , Y10T428/24562 , Y10T428/24826 , Y10T428/249921 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A method for fine positioning a component through the use of fusible elements having two or more melting points so as to establish intermediate displacements between totally melted fusible elements and unmelted fusible elements. Because of the use of non-eutectic fusible materials, fine adjustments in the displacement may be achieved.
摘要翻译： 一种通过使用具有两个或多个熔点的可熔元件来精细定位部件的方法，以便在完全融化的可熔元件和未熔化的可熔元件之间建立中间位移。 由于使用非共晶的易熔材料，可以实现位移的微调。
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公开(公告)号：US07857195B2
公开(公告)日：2010-12-28
申请号：US12536175
申请日：2009-08-05
CPC分类号： B32B7/045 , B23K3/0623 , B23K2101/40 , B32B7/14 , B32B15/01 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2924/00014 , Y10T428/12347 , Y10T428/24562 , Y10T428/24826 , Y10T428/249921 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A method for fine positioning a component through the use of fusible elements having two or more melting points so as to establish intermediate displacements between totally melted fusible elements and unmelted fusible elements. Because of the use of non-eutectic fusible materials, fine adjustments in the displacement may be achieved.
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5.发明申请Method and Apparatus Providing Fine Alignment of a Structure Relative to a Support 失效提供相对于支撑件的结构的精细对准的方法和装置公开(公告)号：US20090291263A1
公开(公告)日：2009-11-26
申请号：US12536175
申请日：2009-08-05
IPC分类号： B32B3/10 , B23K37/047 , B23K31/12
CPC分类号： B32B7/045 , B23K3/0623 , B23K2101/40 , B32B7/14 , B32B15/01 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2924/00014 , Y10T428/12347 , Y10T428/24562 , Y10T428/24826 , Y10T428/249921 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A method for fine positioning a component through the use of fusible elements having two or more melting points so as to establish intermediate displacements between totally melted fusible elements and unmelted fusible elements. Because of the use of non-eutectic fusible materials, fine adjustments in the displacement may be achieved.
摘要翻译： 一种通过使用具有两个或多个熔点的可熔元件来精细定位部件的方法，以便在完全融化的可熔元件和未熔化的可熔元件之间建立中间位移。 由于使用非共晶的易熔材料，可以实现位移的微调。
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6.发明授权Method and apparatus providing fine alignment of a structure relative to a support 失效提供结构相对于支撑件的精细对准的方法和装置公开(公告)号：US08104668B2
公开(公告)日：2012-01-31
申请号：US12955038
申请日：2010-11-29
CPC分类号： B32B7/045 , B23K3/0623 , B23K2101/40 , B32B7/14 , B32B15/01 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2924/00014 , Y10T428/12347 , Y10T428/24562 , Y10T428/24826 , Y10T428/249921 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A method for fine positioning a component through the use of fusible elements having two or more melting points so as to establish intermediate displacements between totally melted fusible elements and unmelted fusible elements. Because of the use of non-eutectic fusible materials, fine adjustments in the displacement may be achieved.
摘要翻译： 一种通过使用具有两个或多个熔点的可熔元件来精细定位部件的方法，以便在完全融化的可熔元件和未熔化的可熔元件之间建立中间位移。 由于使用非共晶的易熔材料，可以实现位移的微调。
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7.发明授权Method and apparatus providing fine alignment of a structure relative to a support 失效提供结构相对于支撑件的精细对准的方法和装置公开(公告)号：US08528805B2
公开(公告)日：2013-09-10
申请号：US13292260
申请日：2011-11-09
CPC分类号： B32B7/045 , B23K3/0623 , B23K2101/40 , B32B7/14 , B32B15/01 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2924/00014 , Y10T428/12347 , Y10T428/24562 , Y10T428/24826 , Y10T428/249921 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A method for fine positioning a component through the use of fusible elements having two or more melting points so as to establish intermediate displacements between totally melted fusible elements and unmelted fusible elements. Because of the use of non-eutectic fusible materials, fine adjustments in the displacement may be achieved.
摘要翻译： 一种通过使用具有两个或多个熔点的可熔元件来精细定位部件的方法，以便在完全融化的可熔元件和未熔化的可熔元件之间建立中间位移。 由于使用非共晶的易熔材料，可以实现位移的微调。
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公开(公告)号：US20080176055A1
公开(公告)日：2008-07-24
申请号：US11624830
申请日：2007-01-19
CPC分类号： B32B7/045 , B23K3/0623 , B23K2101/40 , B32B7/14 , B32B15/01 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2924/00014 , Y10T428/12347 , Y10T428/24562 , Y10T428/24826 , Y10T428/249921 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A method for fine positioning a component through the use of fusible elements having two or more melting points so as to establish intermediate displacements between totally melted fusible elements and unmelted fusible elements. Because of the use of non-eutectic fusible materials, fine adjustments in the displacement may be achieved.
摘要翻译： 一种通过使用具有两个或多个熔点的可熔元件来精细定位部件的方法，以便在完全融化的可熔元件和未熔化的可熔元件之间建立中间位移。 由于使用非共晶的易熔材料，可以实现位移的微调。
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9.发明授权公开(公告)号：US08828860B2
公开(公告)日：2014-09-09
申请号：US13600204
申请日：2012-08-30
申请人： Peter A. Gruber , Paul A. Lauro , Jae-Woong Nah
发明人： Peter A. Gruber , Paul A. Lauro , Jae-Woong Nah
IPC分类号： H01L21/00
CPC分类号： H05K3/3436 , B23K1/0016 , B23K3/0638 , H01L21/4853 , H01L21/563 , H01L23/49816 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/81 , H01L2224/11011 , H01L2224/13076 , H01L2224/131 , H01L2224/13147 , H01L2224/16113 , H01L2224/16238 , H01L2224/73204 , H01L2224/81065 , H01L2224/81193 , H01L2224/814 , H01L2224/81815 , H01L2924/01029 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01079 , H01L2924/01083 , H01L2924/14 , H01L2924/20104 , H01L2924/20106 , H01L2924/20107 , H01L2924/35 , H05K3/3494 , H05K13/0465 , H05K2203/043 , H01L2924/00014 , H01L2924/014
摘要： Multiple injections of molten solder are employed to form double solder bumps having outer layers that melt at lower temperatures than the inner portions thereof. During a flip chip assembly process, the reflow temperature is above the melting temperature of the outer layers and below the melting temperature of the inner portions of the solder bumps. As the inner portions of the solder bumps do not collapse during reflow, a flip chip assembly can be made at relatively low temperatures and have a high stand-off height. A structure having double solder bumps facilitates flip chip assembly.
摘要翻译： 采用多次注入熔融焊料来形成双层焊料凸点，其外层在比其内部部分更低的温度下熔化。 在倒装芯片组装过程中，回流温度高于外层的熔化温度并低于焊料凸块的内部部分的熔化温度。 由于焊料凸块的内部在回流期间不会塌陷，所以可以在相对低的温度下制造倒装芯片组件并具有高的间隔高度。 具有双重焊料凸块的结构有助于倒装芯片组装。
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公开(公告)号：US20140065771A1
公开(公告)日：2014-03-06
申请号：US13600204
申请日：2012-08-30
申请人： Peter A. Gruber , Paul A. Lauro , Jae-Woong Nah
发明人： Peter A. Gruber , Paul A. Lauro , Jae-Woong Nah
IPC分类号： H01L21/60
CPC分类号： H05K3/3436 , B23K1/0016 , B23K3/0638 , H01L21/4853 , H01L21/563 , H01L23/49816 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/81 , H01L2224/11011 , H01L2224/13076 , H01L2224/131 , H01L2224/13147 , H01L2224/16113 , H01L2224/16238 , H01L2224/73204 , H01L2224/81065 , H01L2224/81193 , H01L2224/814 , H01L2224/81815 , H01L2924/01029 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01079 , H01L2924/01083 , H01L2924/14 , H01L2924/20104 , H01L2924/20106 , H01L2924/20107 , H01L2924/35 , H05K3/3494 , H05K13/0465 , H05K2203/043 , H01L2924/00014 , H01L2924/014
摘要： Multiple injections of molten solder are employed to form double solder bumps having outer layers that melt at lower temperatures than the inner portions thereof. During a flip chip assembly process, the reflow temperature is above the melting temperature of the outer layers and below the melting temperature of the inner portions of the solder bumps. As the inner portions of the solder bumps do not collapse during reflow, a flip chip assembly can be made at relatively low temperatures and have a high stand-off height. A structure having double solder bumps facilitates flip chip assembly.
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