公开(公告)号：US08068553B2

公开(公告)日：2011-11-29

申请号：US12633895

申请日：2009-12-09

申请人： Po-Chuan Hsieh ,  Chun-Jen Chen ,  Chien-Hung Liu ,  Yu-Chang Pai ,  Shou-Kuo Hsu

发明人： Po-Chuan Hsieh ,  Chun-Jen Chen ,  Chien-Hung Liu ,  Yu-Chang Pai ,  Shou-Kuo Hsu

IPC分类号： H04L7/02 ,  H04B7/02

CPC分类号： H04B17/0085 ,  H04B17/21 ,  H04B17/23 ,  H04B17/327 ,  H04L1/0668

摘要： A performance evaluation system for a multiple-input multiple-output (MIMO) antenna system receives simulation parameters from an input device, and simulates a MIMO antenna system accordingly. A method, also provided, further evaluates performance of the simulated MIMO antenna system when a series of radio frequency (RF) signals are transmitted through the MIMO antenna system, and displays a performance analysis result of the MIMO antenna system on a display device for evaluation of the performance of the simulated MIMO antenna system.

摘要翻译： 用于多输入多输出（MIMO）天线系统的性能评估系统从输入设备接收模拟参数，并相应地模拟MIMO天线系统。 还提供了一种方法，当通过MIMO天线系统传输一系列射频（RF）信号时，进一步评估模拟MIMO天线系统的性能，并且在用于评估的显示装置上显示MIMO天线系统的性能分析结果 的模拟MIMO天线系统的性能。

公开(公告)号：US08263877B2

公开(公告)日：2012-09-11

申请号：US12837487

申请日：2010-07-15

申请人： Chien-Hung Liu ,  Po-Chuan Hsieh ,  Yu-Chang Pai ,  Shou-Kuo Hsu

发明人： Chien-Hung Liu ,  Po-Chuan Hsieh ,  Yu-Chang Pai ,  Shou-Kuo Hsu

IPC分类号： H05K1/11

CPC分类号： H05K1/162 ,  H05K1/0239 ,  H05K2201/0397 ,  H05K2201/10015 ,  H05K2201/1034

摘要： A printed circuit board includes a first signal layer, a second signal layer, and a dielectric layer sandwiched between the first signal layer and the second signal layer. The first signal layer includes two pads. The second signal layer includes two conducting pieces connected to two signal traces. The shape and material of the pads are the same as the shape and material of the conducting pieces. The projections of the pads on the second signal layer are overlapping with the conducting pieces.

摘要翻译： 印刷电路板包括第一信号层，第二信号层和夹在第一信号层和第二信号层之间的电介质层。 第一信号层包括两个焊盘。 第二信号层包括连接到两个信号迹线的两个导电片。 垫的形状和材料与导电片的形状和材料相同。 第二信号层上的焊盘的突起与导电片重叠。

公开(公告)号：US20110299263A1

公开(公告)日：2011-12-08

申请号：US12855903

申请日：2010-08-13

申请人： Yu-Chang Pai ,  Po-Chuan Hsieh ,  Chien-Hung Liu ,  Shou-Kuo Hsu

发明人： Yu-Chang Pai ,  Po-Chuan Hsieh ,  Chien-Hung Liu ,  Shou-Kuo Hsu

IPC分类号： H05K9/00

CPC分类号： H05K9/0041

摘要： An enclosure includes a plate. The plate defines a number of through holes. A hollow shield extends from the edges bounding each through hole. A top side of the shield opposite to the plate is smaller than a bottom side of the shield which is connected to the edges of the through hole. The enclosure can better shield electromagnetic interference (EMI) from the electronic device.

摘要翻译： 外壳包括一个板。 该板限定了多个通孔。 中空的护罩从每个通孔的边缘延伸。 屏蔽件与板的相对的顶侧小于屏蔽件的底部侧，该底部侧连接到通孔的边缘。 外壳可以更好地屏蔽电子设备的电磁干扰（EMI）。

公开(公告)号：US20110298341A1

公开(公告)日：2011-12-08

申请号：US12859283

申请日：2010-08-19

申请人： Chien-Hung Liu ,  Yu-Chang Pai ,  Po-Chuan Hsieh ,  Shou-Kuo Hsu

发明人： Chien-Hung Liu ,  Yu-Chang Pai ,  Po-Chuan Hsieh ,  Shou-Kuo Hsu

IPC分类号： H05K5/02

CPC分类号： H05K9/0086

摘要： An enclosure of an electronic device includes a plate. The plate defines a number of through holes with a number of shields. Each shield includes a tab apart from the plate. At least two spaced connection pieces connect the tab to a corresponding through hole in such a way that the tab is substantially aligned with and spaced from the corresponding through hole.

摘要翻译： 电子设备的外壳包括板。 该板限定了多个具有多个屏蔽的通孔。 每个护罩包括一个离开板的突出部分。 至少两个间隔开的连接件将突片连接到对应的通孔，使得突出部基本上与相应的通孔对准并与之隔开。

公开(公告)号：US08389873B2

公开(公告)日：2013-03-05

申请号：US12841125

申请日：2010-07-21

申请人： Po-Chuan Hsieh ,  Yu-Chang Pai ,  Chien-Hung Liu ,  Shou-Kuo Hsu

发明人： Po-Chuan Hsieh ,  Yu-Chang Pai ,  Chien-Hung Liu ,  Shou-Kuo Hsu

IPC分类号： H05K9/00 ,  H02B1/56

CPC分类号： H05K9/0041 ,  H05K9/0024

摘要： An enclosure of an electronic device includes a plate. The plate defines a number of through holes. A number of shields extend from the plate corresponding to the through holes. Each shield extends outwards from the outer surface of the plate, surrounding and partly covering a corresponding through hole. The enclosure with the shields can shield the electronic device from EMI.

摘要翻译： 电子设备的外壳包括板。 该板限定了多个通孔。 多个屏蔽件从对应于通孔的板延伸。 每个护罩从板的外表面向外延伸，围绕并部分覆盖相应的通孔。 带屏蔽的外壳可以屏蔽电子设备免受EMI影响。

公开(公告)号：US08305774B2

公开(公告)日：2012-11-06

申请号：US12855903

申请日：2010-08-13

申请人： Yu-Chang Pai ,  Po-Chuan Hsieh ,  Chien-Hung Liu ,  Shou-Kuo Hsu

发明人： Yu-Chang Pai ,  Po-Chuan Hsieh ,  Chien-Hung Liu ,  Shou-Kuo Hsu

IPC分类号： H05K9/00

CPC分类号： H05K9/0041

摘要： An enclosure includes a plate. The plate defines a number of through holes. A hollow shield extends from the edges bounding each through hole. A top side of the shield opposite to the plate is smaller than a bottom side of the shield which is connected to the edges of the through hole. The enclosure can better shield electromagnetic interference (EMI) from the electronic device.

摘要翻译： 外壳包括一个板。 该板限定了多个通孔。 中空的护罩从每个通孔的边缘延伸。 屏蔽件与板的相对的顶侧小于屏蔽件的底部侧，该底部侧连接到通孔的边缘。 外壳可以更好地屏蔽电子设备的电磁干扰（EMI）。

公开(公告)号：US08270180B2

公开(公告)日：2012-09-18

申请号：US12646888

申请日：2009-12-23

申请人： Chien-Hung Liu ,  Shou-Kuo Hsu ,  Yu-Chang Pai ,  Po-Chuan Hsieh

发明人： Chien-Hung Liu ,  Shou-Kuo Hsu ,  Yu-Chang Pai ,  Po-Chuan Hsieh

IPC分类号： H05K1/11 ,  H05K7/00 ,  H05K1/14

CPC分类号： H05K1/0251 ,  H05K1/0222 ,  H05K3/429 ,  H05K2201/09309 ,  H05K2201/09636

摘要： A printed circuit board includes a number of signal layers, a number of ground layers, a first transmission line, a second transmission line, a first via, and a second via. The first transmission is located on one of the number of signal layers. The second transmission line is located on another of the number of signal layers. The first and second vias pass through the printed circuit board. The first via is electrically coupled to the first and second transmission lines, and is isolated from the number of ground layers. The second via is electrically coupled to one or more of the number of ground layers, and is isolated from the other of the number of ground layers to increase an inductance, thus compensating capacitive nature of an open stub and improving signal integrity.

摘要翻译： 印刷电路板包括多个信号层，多个接地层，第一传输线，第二传输线，第一通孔和第二通孔。 第一个传输位于多个信号层之一上。 第二传输线位于多个信号层的另一个上。 第一和第二通孔穿过印刷电路板。 第一通孔电耦合到第一和第二传输线，并且与接地层的数量隔离。 第二通孔电耦合到多个接地层中的一个或多个，并与多个接地层中的另一个隔离，以增加电感，从而补偿开路短路的电容特性并提高信号完整性。

公开(公告)号：US08253038B2

公开(公告)日：2012-08-28

申请号：US12849939

申请日：2010-08-04

申请人： Yu-Chang Pai ,  Chien-Hung Liu ,  Po-Chuan Hsieh ,  Shou-Kuo Hsu

发明人： Yu-Chang Pai ,  Chien-Hung Liu ,  Po-Chuan Hsieh ,  Shou-Kuo Hsu

IPC分类号： H05K9/00 ,  H02B1/56

CPC分类号： H05K9/0024 ,  H05K9/0041

摘要： An enclosure includes a plate. The plate defines a number of through holes. A first shield extends from an edge bounding each through hole. A second shield extends from the edge bounding each through hole, opposite to the first shields. Each through hole is partially covered by a corresponding first shield and a corresponding second shield. The enclosure with the shields can shield the electronic device from electromagnetic interference.

摘要翻译： 外壳包括一个板。 该板限定了多个通孔。 第一个屏蔽从每个通孔的边缘延伸。 第二个屏蔽件从边界与每个通孔的边缘相延伸，与第一个屏蔽件相对。 每个通孔被相应的第一屏蔽和对应的第二屏蔽部分地覆盖。 带屏蔽的外壳可以屏蔽电子设备免受电磁干扰。

公开(公告)号：US08031029B2

公开(公告)日：2011-10-04

申请号：US12430132

申请日：2009-04-27

申请人： Yu-Chang Pai ,  Chien-Hung Liu ,  Po-Chuan Hsieh ,  Pei-Chun Lin ,  Shou-Kuo Hsu

发明人： Yu-Chang Pai ,  Chien-Hung Liu ,  Po-Chuan Hsieh ,  Pei-Chun Lin ,  Shou-Kuo Hsu

IPC分类号： H01P3/08 ,  H01P3/04

CPC分类号： H05K1/024 ,  H05K1/0245 ,  H05K1/0248 ,  H05K3/28 ,  H05K2201/0187 ,  H05K2201/0989

摘要： A compensation method compensates for a length offset between a first transmission line and a second transmission line of a differential signal transmission. The compensation method includes calculating a transmission speed of a first signal in the first transmission line, measuring lengths of the first and second transmission lines, calculating a transmission time of the first signal in the first transmission line, and calculating a relationship between permittivity values of the first and second transmission lines. The compensation method further changes the permittivity values of the first and second transmission lines according to the relationship.

摘要翻译： 补偿方法补偿差分信号传输的第一传输线和第二传输线之间的长度偏移。 所述补偿方法包括计算第一传输线中的第一信号的传输速度，测量第一和第二传输线的长度，计算第一传输线中的第一信号的传输时间，以及计算第一传输线的介电常数值之间的关系 第一和第二传输线。 补偿方法根据关系进一步改变第一和第二传输线的介电常数值。

公开(公告)号：US08436691B2

公开(公告)日：2013-05-07

申请号：US12620558

申请日：2009-11-17

申请人： Po-Chuan Hsieh ,  Yu-Chang Pai ,  Shou-Kuo Hsu

发明人： Po-Chuan Hsieh ,  Yu-Chang Pai ,  Shou-Kuo Hsu

IPC分类号： H01P3/08 ,  H01P1/203

CPC分类号： H01P1/2039 ,  H01P3/085

摘要： A signal transmission apparatus includes two circuit layers. First and second ground sheets each has a rectangular area are arranged in the two circuit layers respectively. A third ground sheet is arranged between the two circuit layers. A differential pair includes a transmission line arranged between the first and third ground sheets and a transmission line arranged between the second and third ground sheets. The first to third ground sheets have same electric potential. Projections of the two rectangular areas on a surface where the third ground sheet in only have one common border with the third ground sheet. The third ground sheet is formed by extending the common border along a signal transmission direction. The differential pair includes a number of section pairs each composed of two sections arranged in the two transmission lines symmetrically. Every two adjacent section pairs are equivalent to a capacitor and an inductor.

摘要翻译： 信号传输装置包括两个电路层。 分别在两个电路层中布置有具有矩形区域的第一和第二接地片。 第三接地片布置在两个电路层之间。 差动对包括布置在第一和第三接地片之间的传输线和布置在第二和第三接地片之间的传输线。 第一至第三接地片具有相同的电位。 在第三接地片与第三接地片只有一个共同边界的表面上的两个矩形区域的投影。 第三接地片通过沿着信号传输方向延伸公共边界而形成。 差分对包括多个部分对，每个部分对由两个对称布置在两个传输线中的部分组成。 每两个相邻的部分对相当于一个电容和一个电感。