公开(公告)号：US12058939B2

公开(公告)日：2024-08-06

申请号：US18140577

申请日：2023-04-27

Applicant: The Regents of the University of Michigan ,  Qualcomm Technologies, Inc.

Inventor： Karl Grosh ,  Robert J. Littrell

IPC: H10N30/50 ,  B81B3/00 ,  B81B7/00 ,  B81B7/02 ,  H04R17/00 ,  H04R17/02 ,  H10N30/30 ,  H10N30/853

CPC classification number: H10N30/50 ,  B81B3/0021 ,  B81B7/0032 ,  B81B7/02 ,  H04R17/00 ,  H04R17/02 ,  H10N30/302 ,  H10N30/306 ,  H10N30/308 ,  H10N30/853 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81B2203/0315 ,  B81B2203/04 ,  B81B2207/09 ,  H04R2201/003

Abstract: A microphone including a casing having a front wall, a back wall, and a side wall joining the front wall to the back wall, a transducer mounted to the front wall, the transducer including a substrate and a transducing element, the transducing element having a transducer acoustic compliance dependent on the transducing element dimensions, a back cavity cooperatively defined between the back wall, the side wall, and the transducer, the back cavity having a back cavity acoustic compliance. The transducing element is dimensioned such that the transducing element length matches a predetermined resonant frequency and the transducing element width, thickness, and elasticity produces a transducer acoustic compliance within a given range of the back cavity acoustic compliance.

公开(公告)号：US11950052B2

公开(公告)日：2024-04-02

申请号：US17675850

申请日：2022-02-18

Applicant: Qualcomm Technologies Inc.

Inventor： Karl Grosh ,  Robert J. Littrell

IPC: H04R17/02 ,  H01L41/27 ,  H01L41/314 ,  H01L41/332 ,  H04R7/06 ,  H04R31/00 ,  H10N30/05 ,  H10N30/074 ,  H10N30/082

CPC classification number: H04R17/02 ,  H04R7/06 ,  H04R31/003 ,  H10N30/05 ,  H10N30/074 ,  H10N30/082 ,  H04R17/025 ,  H04R31/00 ,  H04R2201/003 ,  H04R2410/03

Abstract: A transducer of the preferred embodiment including a transducer and a plurality of adjacent, tapered cantilevered beams. Each of the beams define a beam base, a beam tip, and a beam body disposed between the beam base and the beam tip. The beams are arranged such that each of the beam tips extends toward a common area. Each beam is joined to the substrate along the beam base and is free from the substrate along the beam body. A preferred method of manufacturing a transducer can include: depositing alternating layers of piezoelectric and electrode onto the substrate in block, processing the deposited layers to define cantilever geometry in block, depositing metal traces in block, and releasing the cantilevered beams from the substrate in block.

公开(公告)号：US11617041B2

公开(公告)日：2023-03-28

申请号：US15930530

申请日：2020-05-13

Applicant: Qualcomm Technologies, Inc.

Inventor： Robert J. Littrell ,  Ronald Gagnon ,  Karl Grosh

IPC: H04R17/02 ,  H04R3/00 ,  H04R3/04

Abstract: A device comprising: a sensor; and a first circuit configured to detect when an input stimulus to the sensor satisfies one or more detection criteria, and further configured to produce a signal upon detection that causes adjustment of performance of the device; and a second circuit for processing input following detection, wherein the second circuit is configured to increase its power level following detection, relative to a power level of the second circuit prior to detection.

公开(公告)号：US11871664B1

公开(公告)日：2024-01-09

申请号：US16790537

申请日：2020-02-13

Applicant: Qualcomm Technologies Inc.

Inventor： Robert J. Littrell ,  Karl Grosh

IPC: H01L41/083 ,  H10N30/50 ,  B06B1/06 ,  H01L21/02 ,  H10N30/87

CPC classification number: H10N30/508 ,  B06B1/064 ,  H01L21/02104 ,  H10N30/871

Abstract: A transducer comprising: at least one piezoelectric layer; a first patterned conductive layer that is patterned with a first opening; a second patterned conductive layer that is patterned with a second opening; wherein at least one piezoelectric layer is between the first and the second patterned conductive layers in a stack; and wherein a position of the first opening is staggered relative to a position of the second opening in the stack to mitigate an occurrence of crack propagation through the layers.

公开(公告)号：US20230337544A1

公开(公告)日：2023-10-19

申请号：US18140577

申请日：2023-04-27

Applicant: The Regents of the University of Michigan ,  Qualcomm Technologies, Inc.

Inventor： Karl Grosh ,  Robert J. Littrell

IPC: H10N30/853 ,  B81B3/00 ,  H04R17/00 ,  H10N30/50 ,  B81B7/02 ,  H10N30/30 ,  H04R17/02 ,  B81B7/00

CPC classification number: H10N30/50 ,  B81B3/0021 ,  B81B7/0032 ,  B81B7/02 ,  H04R17/00 ,  H04R17/02 ,  H10N30/302 ,  H10N30/306 ,  H10N30/308 ,  H10N30/853 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81B2203/0315 ,  B81B2203/04 ,  B81B2207/09 ,  H04R2201/003

Abstract: A microphone including a casing having a front wall, a back wall, and a side wall joining the front wall to the back wall, a transducer mounted to the front wall, the transducer including a substrate and a transducing element, the transducing element having a transducer acoustic compliance dependent on the transducing element dimensions, a back cavity cooperatively defined between the back wall, the side wall, and the transducer, the back cavity having a back cavity acoustic compliance. The transducing element is dimensioned such that the transducing element length matches a predetermined resonant frequency and the transducing element width, thickness, and elasticity produces a transducer acoustic compliance within a given range of the back cavity acoustic compliance.