Fabricating semiconductor devices
    2.
    发明授权
    Fabricating semiconductor devices 失效
    制造半导体器件

    公开(公告)号:US3560275A

    公开(公告)日:1971-02-02

    申请号:US3560275D

    申请日:1968-11-08

    Applicant: RCA CORP

    Abstract: A PN JUNCTION IS FORMED IN A SOLUTION GROWN EPITAXIAL LAYER CONSISTING OF A MIXED III-V COMPOUND SEMICONDUCTIVE MATERIAL BY UTILIZING A SINGLE AMPHOTERIC CONDUCTIVITY MODIFIER IN THE SOLUTION, AND VARYING THE TEMPERATURE OF THE SOLUTION DURING THE DEPOSITION OF THE EPITAXIAL LAYER. THE SEMICONDUCTIVE MATERIAL HAS THE COMPOSITION BAALBGACINDNEPFASGSBH, WHEREIN EACH OF SUBSCRIPTS, A, B, C, D, E, F, G, H RANGES FROM 0 TO 1, AND A+B+C+D=1, AND E+F+G+H=1. THE AMPHOTERIC CONDUCTIVITY MODIFIER IS SILICON OR GFERMANIUM, AND THE ADDITION OF THE AMPHOTERIC MODIFIER TO THE SOLUTION SHORTLY BEFORE THE DEPOSITION OF THE EPITAXIAL LAYER IS ESPECIALLY EFFICACIOUS. ALSO DESCRIBED IS THE FABRICATION OF AN IMPROVED ELECTROLUMINESCENT DIODE FROM A SUB-CLASS OF THE MIXED III-V COMPOUND MATERIALS COMPRISING TWO MEMBERS OF THE GROUP CONSISTING OF BORON, ALULMINUM, GALLIUM AND INDIUM, AND ONE MEMBER OF THE GROUP CONSISTING OF NITROGEN, PHOSPHORUS, ARSENIC AND ANTIMONY.

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