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公开(公告)号：US11637377B2
公开(公告)日：2023-04-25
申请号：US17299513
申请日：2019-11-22
Applicant: ROGERS CORPORATION
Inventor： Gianni Taraschi , Kristi Pance , Stephen O'Connor , Christopher Brown , Trevor Polidore , Allen F. Horn, III , Dirk Baars , Roshin Rose George , Jared Duperre , Shailesh Pandey , Karl E. Sprentall , Shawn P. Williams , William Blasius
Abstract: A method of making a dielectric, Dk, electromagnetic, EM, structure, includes: providing a first mold portion comprising substantially identical ones of a first plurality of recesses arranged in an array; filling the first plurality of recesses with a curable first Dk composition having a first average dielectric constant greater than that of air after full cure; placing a substrate on top of and across multiple ones of the first plurality of recesses filled with the first Dk composition, and at least partially curing the curable first Dk composition; and, removing the substrate with the at least partially cured first Dk composition from the first mold portion, resulting in an assembly having the substrate and a plurality of Dk forms including the at least partially cured first Dk composition, each of the plurality of Dk forms having a three dimensional, 3D, shape defined by corresponding ones of the first plurality of recesses.
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2.发明授权公开(公告)号：US11239563B2
公开(公告)日：2022-02-01
申请号：US16396943
申请日：2019-04-29
Applicant: ROGERS CORPORATION
Inventor： Stephen O'Connor , Gianni Taraschi , Christopher Brown , Kristi Pance , Karl E. Sprentall , Bruce Fitts , Dirk Baars , William Blasius , Murali Sethumadhavan , Roshin Rose George , Michael S. White , Michael Lunt , Sam Henson , John Dobrick
Abstract: In an embodiment, an electromagnetic device, comprises a substrate a substrate comprising a dielectric layer and a first conductive layer; at least one dielectric structure comprising at least one non-gaseous dielectric material that forms a first dielectric portion that extends outward from the first side of the substrate, the first dielectric portion having an average dielectric constant and an optional second dielectric portion that extends into an optional via. The at least one dielectric structure is bonded to the substrate by at least one of: a mechanical interlock between the second dielectric portion and the substrate due to the at least one interlocking slot comprising a retrograde surface; an intermediate layer located in between the dielectric structure and the substrate having a roughened surface; or an adhesive material located in between the dielectric structure and the substrate. A method of making the device can comprise injection molding a dielectric composition onto the substrate to form the dielectric substrate.
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公开(公告)号：US11895768B2
公开(公告)日：2024-02-06
申请号：US17641548
申请日：2019-10-02
Applicant: ROGERS CORPORATION
Inventor： Eui Kyoon Kim , Bruce Fitts , Christopher Brown
IPC: H05K1/02 , H05K1/03 , C23C16/455 , C23C16/40
CPC classification number: H05K1/0204 , C23C16/403 , C23C16/45525 , H05K1/0366 , H05K1/0373 , H05K2201/0209 , H05K2201/0227 , H05K2201/0293
Abstract: In an embodiment, a printed circuit board substrate (12) comprises a polymer matrix; a reinforcing layer (42); and a plurality of coated boron nitride particles (44); wherein the plurality of coated boron nitride particles comprise a coating having an average coating thickness of 1 to 100 nanometers. The polymer matrix can comprise at least one of an epoxy, a polyphenylene ether, polystyrene, an ethylene-propylene dicyclopentadiene copolymer, a polybutadiene, a polyisoprene, a fluoropolymer, or a crosslinked matrix comprising at least one of triallyl cyanurate, triallyl isocyanurate, 1,2,4-trivinyl cyclohexane, trimethylolpropane triacrylate, or trimethylolpropane trimethacrylate.
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4.发明申请公开(公告)号：US20190341696A1
公开(公告)日：2019-11-07
申请号：US16396943
申请日：2019-04-29
Applicant: ROGERS CORPORATION
Inventor： Stephen O'Connor , Gianni Taraschi , Christopher Brown , Kristi Pance , Karl E. Sprentall , Bruce Fitts , Dirk Baars , William Blasius , Murali Sethumadhavan , Roshin Rose George , Michael S. White , Michael Lunt , Sam Henson , John Dobrick
Abstract: In an embodiment, an electromagnetic device, comprises a substrate a substrate comprising a dielectric layer and a first conductive layer; at least one dielectric structure comprising at least one non-gaseous dielectric material that forms a first dielectric portion that extends outward from the first side of the substrate, the first dielectric portion having an average dielectric constant and an optional second dielectric portion that extends into an optional via. The at least one dielectric structure is bonded to the substrate by at least one of: a mechanical interlock between the second dielectric portion and the substrate due to the at least one interlocking slot comprising a retrograde surface; an intermediate layer located in between the dielectric structure and the substrate having a roughened surface; or an adhesive material located in between the dielectric structure and the substrate. A method of making the device can comprise injection molding a dielectric composition onto the substrate to form the dielectric substrate.
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Patent Agency Ranking
5.发明授权公开(公告)号：US11545753B2
公开(公告)日：2023-01-03
申请号：US17543195
申请日：2021-12-06
Applicant: ROGERS CORPORATION
Inventor： Stephen O'Connor , Gianni Taraschi , Christopher Brown , Kristi Pance , Karl E. Sprentall , Bruce Fitts , Dirk Baars , William Blasius , Murali Sethumadhavan , Roshin Rose George , Michael S. White , Michael Lunt , Sam Henson , John Dobrick
Abstract: An electromagnetic, EM, device, includes: a substrate having a dielectric layer and a first conductive layer at a first side of the substrate, the substrate having a via that extends at least partially through the substrate from the first side toward an opposing second side of the substrate; at least one dielectric structure having at least one non-gaseous dielectric material that forms a first dielectric portion that extends outward from the first side of the substrate, the first dielectric portion having a first average dielectric constant, the at least one dielectric structure further having a second dielectric portion that is contiguous with the first dielectric portion; wherein the second dielectric portion extends into the via of the substrate, the via having a mechanical interlock surface; and wherein the at least one dielectric structure includes a mechanical interlock between the second dielectric portion and the mechanical interlock surface of the via of the substrate.
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公开(公告)号：US20220029297A1
公开(公告)日：2022-01-27
申请号：US17299513
申请日：2019-11-22
Applicant: ROGERS CORPORATION
Inventor： Gianni Taraschi , Kristi Pance , Stephen O'Connor , Christopher Brown , Trevor Polidore , Allen F. Horn, III , Dirk Baars , Roshin Rose George , Jared Duperre , Shailesh Pandey , Karl E. Sprentall , Shawn P. Williams , William Blasius
Abstract: A method of making a dielectric, Dk, electromagnetic, EM, structure, includes: providing a first mold portion comprising substantially identical ones of a first plurality of recesses arranged in an array; filling the first plurality of recesses with a curable first Dk composition having a first average dielectric constant greater than that of air after full cure; placing a substrate on top of and across multiple ones of the first plurality of recesses filled with the first Dk composition, and at least partially curing the curable first Dk composition; and, removing the substrate with the at least partially cured first Dk composition from the first mold portion, resulting in an assembly having the substrate and a plurality of Dk forms including the at least partially cured first Dk composition, each of the plurality of Dk forms having a three dimensional, 3D, shape defined by corresponding ones of the first plurality of recesses.
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公开(公告)号：US11016574B2
公开(公告)日：2021-05-25
申请号：US16663443
申请日：2019-10-25
Applicant: Rogers Corporation
Inventor： Shawn P. Williams , Gianni Taraschi , Sara G. Canzano , Kristi Pance , Christopher Brown , Karl E. Sprentall , Roshin Rose George
Abstract: A wearable electromagnetic, EM, apparatus includes: at least one antenna operable in a millimeter-wave-radar-based, MWRB, application; at least one computer processor disposed in signal communication with the at least one antenna; an attachment system configured and adapted to attach to an actor; the at least one antenna and the at least one computer processor disposed in a supported relationship with the attachment system, such that the attachment system with the supported at least one antenna and the at least one computer processor at least partially forms a wearable apparatus that is wearable by the actor.
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公开(公告)号：US20220322517A1
公开(公告)日：2022-10-06
申请号：US17641548
申请日：2019-10-02
Applicant: ROGERS CORPORATION
Inventor： Eui Kyoon Kim , Bruce Fitts , Christopher Brown
IPC: H05K1/02 , H05K1/03 , C23C16/455 , C23C16/40
Abstract: In an embodiment, a printed circuit board substrate (12) comprises a polymer matrix; a reinforcing layer (42); and a plurality of coated boron nitride particles (44); wherein the plurality of coated boron nitride particles comprise a coating having an average coating thickness of 1 to 100 nanometers. The polymer matrix can comprise at least one of an epoxy, a polyphenylene ether, polystyrene, an ethylene-propylene dicyclopentadiene copolymer, a polybutadiene, a polyisoprene, a fluoropolymer, or a crosslinked matrix comprising at least one of triallyl cyanurate, triallyl isocyanurate, 1,2,4-trivinyl cyclohexane, trimethylolpropane triacrylate, or trimethylolpropane trimethacrylate.
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9.发明申请公开(公告)号：US20220158351A1
公开(公告)日：2022-05-19
申请号：US17543195
申请日：2021-12-06
Applicant: ROGERS CORPORATION
Inventor： Stephen O'Connor , Gianni Taraschi , Christopher Brown , Kristi Pance , Karl E. Sprentall , Bruce Fitts , Dirk Baars , William Blasius , Murali Sethumadhavan , Roshin Rose George , Michael S. White , Michael Lunt , Sam Henson , John Dobrick
Abstract: An electromagnetic, EM, device, includes: a substrate having a dielectric layer and a first conductive layer at a first side of the substrate, the substrate having a via that extends at least partially through the substrate from the first side toward an opposing second side of the substrate; at least one dielectric structure having at least one non-gaseous dielectric material that forms a first dielectric portion that extends outward from the first side of the substrate, the first dielectric portion having a first average dielectric constant, the at least one dielectric structure further having a second dielectric portion that is contiguous with the first dielectric portion; wherein the second dielectric portion extends into the via of the substrate, the via having a mechanical interlock surface; and wherein the at least one dielectric structure includes a mechanical interlock between the second dielectric portion and the mechanical interlock surface of the via of the substrate.
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