Imaging sensor
    1.
    发明授权
    Imaging sensor 有权
    成像传感器

    公开(公告)号:US07435961B2

    公开(公告)日:2008-10-14

    申请号:US11378169

    申请日:2006-03-17

    IPC分类号: G01J5/00

    摘要: A sensor that is responsive to at least two distinct spectral bands, e.g., infrared radiation and ultraviolet or infrared and visible light makes use of the junction of a diode-based bolometer as a photocell in addition to its temperature dependence for detecting infrared radiation. More specifically the diode bolometer is arranged to work in the conventional manner, in that an electrical characteristic of the diode, e.g., the temperature dependence of its current-voltage (I-V) curve, is used as the basis for measuring temperature, and hence, infrared radiation. Additionally, the same diode may be operated as a photocell to detect radiation that is capable of interacting with the electrons in the junction of the diode. This may be achieved by detecting a change in the operating point of the diode based given its present biasing in response to noninfrared radiation incident upon the diode.

    摘要翻译: 响应于至少两个不同光谱带(例如红外辐射和紫外线或红外线和可见光)的传感器除了其用于检测红外辐射的温度依赖性之外,还使用基于二极管的测辐射热计作为光电池的结。 更具体地说,二极管辐射热计被布置成以常规方式工作,因为二极管的电特性,例如其电流 - 电压(IV)曲线的温度依赖性被用作测量温度的基础,因此, 红外辐射。 此外,相同的二极管可以作为光电池来操作,以检测能够与二极管的结中的电子相互作用的辐射。 这可以通过响应于入射到二极管上的非红外辐射来鉴定其当前偏置来检测二极管的工作点的变化来实现。

    Armament fuse arrangement
    2.
    发明授权
    Armament fuse arrangement 有权
    装备保险丝安排

    公开(公告)号:US07701694B2

    公开(公告)日:2010-04-20

    申请号:US10817986

    申请日:2004-04-05

    申请人: Cristian A Bolle

    发明人: Cristian A Bolle

    CPC分类号: F42C19/06

    摘要: A highly reliable fuse for explosives and armaments is achieved by employing a micro mechanical device that operates to disrupt a relatively low impedance bypass circuit coupled in parallel with a relatively high impedance trigger mechanism. The removal of the electrical bypassing is performed as a result of the movement of the micro mechanical device to enable detonation under prescribed conditions. The electrical bypassing is removed by having at least one low impedance electrical bridge that is part of the bypass circuit break when the micro mechanical device is subjected to prescribed trigger activation forces, which are typically large forces, such as are generated during launch or impact. The micro mechanical device may be a micro-electrical mechanical system (MEMS) device and the bridge is at least one spring that is part of the MEMS device and also part of the bypass circuit.

    摘要翻译: 用于爆炸物和军备的高度可靠的保险丝通过采用微机械装置来实现,微机械装置用于破坏与相对高阻抗的触发机构并联耦合的相对低阻抗的旁路电路。 由于微机械装置的移动使得能够在规定的条件下引爆,所以执行电旁路的去除。 通过具有至少一个作为旁路电路的一部分的低阻抗电桥,当微机械装置经受规定的触发激活力(例如在发射或冲击时产生的大的力)时,电旁路被去除。 微机械装置可以是微电机械系统(MEMS)装置,并且桥是至少一个弹簧,其是MEMS装置的一部分,也是旁路电路的一部分。

    Optical micro-electromechanical systems (MEMS) devices and methods of making same
    3.
    发明授权
    Optical micro-electromechanical systems (MEMS) devices and methods of making same 有权
    光学微机电系统(MEMS)器件及其制造方法

    公开(公告)号:US06912081B2

    公开(公告)日:2005-06-28

    申请号:US10095820

    申请日:2002-03-12

    IPC分类号: B81C1/00 G02B26/08 G02B26/00

    摘要: An arbitrary gap between the two chips of a MEMS device arranged in a flip-chip arrangement is achieved by etching into a first substrate to form mesas which act as spacers between which, or even on which, any required circuit elements are formed. Points of a layer at a first surface of the second substrate within which MEMS structures are made are bonded to the mesas of the first substrate. The second substrate is then removed, leaving the structures bonded to the mesas. The mesas may be formed by placing a hard mask, such as silicon oxide, which defines the desired pattern of mesas on the first substrate, and then etching the unmasked portion of the substrate using a mixture of potassium hydroxide (KOH) with isopropanol (IPA) or, tetramethyl ammonium hydroxide (TMAH) mixed with a surfactant, e.g., nonylphenol ethoxy ether or other equivalent compounds.

    摘要翻译: 通过蚀刻到第一基板中来形成布置在倒装芯片布置中的MEMS器件的两个芯片之间的任意间隙,以形成台阶,其作为在其之间或甚至其上形成任何所需的电路元件的间隔件。 在其中制造MEMS结构的第二基板的第一表面处的层的点被结合到第一基板的台面。 然后除去第二衬底,留下结合到台面的结构。 台面可以通过在第一衬底上放置限定所需图案的硬质掩模(例如氧化硅)而形成,然后使用氢氧化钾(KOH)与异丙醇(IPA)的混合物蚀刻衬底的未屏蔽部分 )或与表面活性剂混合的四甲基氢氧化铵(TMAH),例如壬基酚乙氧基醚或其它等价化合物。

    Precision two dimensional optical fiber array
    4.
    发明授权
    Precision two dimensional optical fiber array 失效
    精密二维光纤阵列

    公开(公告)号:US06827500B2

    公开(公告)日:2004-12-07

    申请号:US09895910

    申请日:2001-06-29

    IPC分类号: G02B636

    摘要: A precise fiber array is formed using a chuck to tightly hold as an array with hexagonal packing a group of precision ferrules into ones of which is inserted and bonded a fiber end. The bonding is typically performed by gluing the fiber into the ferrule. The ferrules may also be bonded to each other. Once the ferrules are bonded together, the chuck may be removed. The terminating end of the fibers may be polished. Alternatively, cleaved terminating fiber ends may be employed, with the various terminating ends being coordinated, e.g., by an optical flat. The ferrules may have a tip and a conical entrance. The chuck may hold the ferrules in a straight orientation. The fiber terminating faces of all of the ferrules may be substantially coplanar. The ferrules may be arranged in a hexagonal configuration.

    摘要翻译: 使用卡盘形成精密的纤维阵列,以紧密地保持为具有六边形填料的阵列,一组精密套圈,其中插入并粘合纤维端。 通常通过将纤维粘合到套圈中来进行粘合。 套圈也可以彼此结合。 一旦套圈结合在一起,卡盘就可以被去除。 纤维的终端可以被抛光。 或者,可以使用切割的端接纤维端,其各种终止端例如通过光学平面进行协调。 套管可以具有尖端和锥形入口。 卡盘可以将套圈保持在直线方向。 所有套圈的光纤端接面可以是基本共面的。 套圈可以以六边形构造布置。

    Method for compensating for nonuniform etch profiles

    公开(公告)号:US06649073B2

    公开(公告)日:2003-11-18

    申请号:US10010570

    申请日:2001-11-13

    申请人: Cristian A Bolle

    发明人: Cristian A Bolle

    IPC分类号: H01L2100

    摘要: Problems caused by a nonuniform processing profile are avoided by altering the area to be processed so as to compensate for the processing profile. More specifically, with regard to etching, problems caused by a nonuniform etch profile can be avoided by altering the mask employed in specifying the etch area so as to compensate for the etch profile. Nonuniform parameters of interest of structures which result from a nonuniform etch profile during the etching of a mask in which all the structures were identical can be avoided for by altering the mask employed in specifying the etch area so as to compensate for the etch profile. The mask is changed in a manner that is inversely proportional to the etch profile for each particular structure characteristic that determines the parameter of interest for which uniformity is desired.

    Mechanical switch with melting bridge
    6.
    发明授权
    Mechanical switch with melting bridge 失效
    机械开关带熔化桥

    公开(公告)号:US07645952B2

    公开(公告)日:2010-01-12

    申请号:US11518693

    申请日:2006-09-11

    IPC分类号: H01H29/00

    摘要: A mechanical switch includes a pair of conducting contacts, metal located on and between the conducting contacts, a heater, and an electro-mechanical actuator. The heater is operable to apply heat that melts the metal. The electro-mechanical actuator is capable of moving one or both of the conducting contacts in a manner that causes the metal to either start physically bridging the conducting contacts or to stop physically bridging the conducting contacts.

    摘要翻译: 机械开关包括一对导电触点,位于导电触头之间和之间的金属,加热器和机电致动器。 加热器可操作以施加熔化金属的热量。 电 - 机械致动器能够以导致金属物理桥接导电触点或停止物理桥接导电触点的方式移动一个或两个导电触头。

    Precision two dimensional optical array
    7.
    发明授权
    Precision two dimensional optical array 有权
    精密二维光学阵列

    公开(公告)号:US07076131B2

    公开(公告)日:2006-07-11

    申请号:US10254133

    申请日:2002-09-25

    申请人: Cristian A Bolle

    发明人: Cristian A Bolle

    IPC分类号: G02B6/32

    摘要: A precise array of collimated light beams may be obtained by employing a chuck to tightly hold as an array a group of precision collimators attached to individual optical fibers. Advantageously, such arrays of collimators may be manufactured to very high tolerances so as to be useful in positioning collimated light beams for all-optical switching.

    摘要翻译: 准直的准直阵列的光束可以通过使用卡盘紧紧地保持为一组精确的准直器连接到各个光纤上而获得。 有利地,这种准直器阵列可被制造成非常高的公差,以便用于定位用于全光开关的准直光束。

    Precision two dimensional optical fiber array
    8.
    发明授权
    Precision two dimensional optical fiber array 失效
    精密二维光纤阵列

    公开(公告)号:US06655852B2

    公开(公告)日:2003-12-02

    申请号:US09915964

    申请日:2001-07-26

    申请人: Cristian A Bolle

    发明人: Cristian A Bolle

    IPC分类号: G02B636

    摘要: A precise fiber array may be formed by employing an array of pins into ones of the resulting interstices of which is inserted and bonded, e.g., glued, a fiber end. Such an array may be made by employing a chuck, at least initially, to tightly hold as an array a group of pins, e.g., metal, ceramic, or plastic pins. Thereafter, a fiber end is inserted and bonded into ones of the interstices formed by the resulting gaps, i.e., the interstices, between the pins. The pins may also be bonded to each other. If so, once the pins are bonded together, the chuck may be removed. The terminating end of the fibers may be polished. Alternatively, previously cleaved terminating fiber ends may be employed, with the various terminating ends being coordinated, e.g., by an optical flat or other surface which is placed at, or adjacent to, the fiber terminating end of the pin array.

    摘要翻译: 精密的纤维阵列可以通过使用一排销来形成,其中所形成的空隙插入和粘结(例如胶合)纤维端。 这样的阵列可以通过采用卡盘来制造,至少最初,将夹具紧紧地保持为一组销,例如金属,陶瓷或塑料销。 此后,将纤维端插入并结合到由所述间隙之间形成的间隙中的空隙中,即引脚之间的间隙。 销也可以彼此结合。 如果是这样,一旦销被结合在一起,卡盘就可以被去除。 纤维的终端可以被抛光。 或者,可以采用先前切割的端接纤维端部,其各种端接端例如通过放置在销阵列的光纤端接端处或邻近的光学平面或其它表面进行协调。

    Thermal management for shielded circuit packs
    9.
    发明授权
    Thermal management for shielded circuit packs 有权
    屏蔽电路板的热管理

    公开(公告)号:US07254034B2

    公开(公告)日:2007-08-07

    申请号:US11013054

    申请日:2004-12-15

    IPC分类号: H05K7/20

    CPC分类号: H05K7/20436 H05K9/0033

    摘要: A thermal management for EMI shielded circuit packs having one or more high-power components, i.e. heat sources. More particularly, a heat transfer device or assembly for EMI shielded circuit packs is provided whereby multiple components (e.g., high-power components) are cooled by individual heat sinks (i.e., each component has its own individual heat sink) which protrude into an external airflow through individual openings in the lid of the EMI shield. Mechanically-compliant, electrically-conductive gaskets are used to seal the base plates of the individual heat sinks against the lid of the EMI shield enclosure. As such, in accordance with the various embodiments, the conductive gaskets establish a compliance layer which accommodates any variation in the heights of the individual components, thereby, allowing optimum thermal contact between the components and their respective heat sinks without compromising the EMI shielding.

    摘要翻译: 用于具有一个或多个高功率组件即EMI的EMI屏蔽电路板的热管理。 更具体地,提供了一种用于EMI屏蔽电路组件的传热装置或组件,由此多个部件(例如,大功率部件)被各个散热器(即,每个部件具有其各自的散热器)冷却,这些散热器突出到外部 气流穿过EMI屏蔽盖的各个开口。 机械兼容的导电垫圈用于将各个散热器的基板与EMI屏蔽外壳的盖板密封。 因此,根据各种实施例,导电垫圈建立适应各个部件的高度的任何变化的柔性层,从而允许部件和它们各自的散热器之间的最佳热接触而不损害EMI屏蔽。

    Method for making micro lenses
    10.
    发明授权
    Method for making micro lenses 失效
    制作微透镜的方法

    公开(公告)号:US06926850B2

    公开(公告)日:2005-08-09

    申请号:US09916011

    申请日:2001-07-26

    申请人: Cristian A Bolle

    发明人: Cristian A Bolle

    摘要: A micro lens, or an array of micro lenses, can be formed without requiring the etching of a mesa into the substrate by deposited directly on the substrate, without any mesa each of the individual portions of the substance to be melted. The whole substrate and the portions are then conformally coated with a very thin layer of a substance, typically an adhesion promoter, e.g., hexamethyldisilazane (HMDS). The entire coated wafer is then subject to conditions which cause each of the individual substance portions to flow into a lens shape. A lens shape is achieved without requiring a mesa because the layer of adhesion promoter prevents the flowing substance from spilling in an undesired manner over the surface of the substrate.

    摘要翻译: 可以形成微透镜或微透镜阵列,而不需要通过直接沉积在衬底上而将台面蚀刻到衬底中,而不需要待融化物质的各个部分的任何台面。 然后将整个基材和部分共形涂覆有非常薄的物质层,通常为粘合促进剂,例如六甲基二硅氮烷(HMDS)。 然后,整个涂覆的晶片经受使各个物质部分中的每一个流入透镜形状的条件。 实现透镜形状而不需要台面,因为粘合促进剂层防止流动物质以不需要的方式溢出在基板的表面上。