公开(公告)号：US20190308360A1

公开(公告)日：2019-10-10

申请号：US16463106

申请日：2017-12-28

Applicant: SABIC GLOBAL TECHNOLOGIES B.V.

Inventor： Chao Liu ,  Ying Na ,  Shuailei Ma ,  Yonglei Xu ,  Kapil Chandrakant Sheth ,  Shan Qin

IPC: B29C48/154 ,  B29C48/00 ,  B29C48/05 ,  B29C48/28 ,  B29C48/88

Abstract: A method of making a wire with multiple coating layers can comprise: preheating a wire to a temperature Tpreheat to form a pre-heated wire; using a first extruder to coat the pre-heated wire with the first coating material to form a first coated wire; passing the first coated wire to a second extruder without storing the first coated wire, coating the first coated wire with a second coating material to form a second coated wire; and cooling the second coated wire.

公开(公告)号：US20170226303A1

公开(公告)日：2017-08-10

申请号：US15502312

申请日：2015-04-20

Applicant: SABIC Global Technologies B.V.

Inventor： Wei Feng ,  Yuzhen Xu ,  Hengjie Lai ,  Zhe Chen ,  Yonglei Xu

IPC: C08J7/04 ,  B29C51/02 ,  B32B27/36 ,  B29B11/12 ,  B29B13/08 ,  B29C51/00 ,  B29C51/10

CPC classification number: C08J7/045 ,  B29B11/12 ,  B29B13/08 ,  B29C51/002 ,  B29C51/02 ,  B29C51/10 ,  B29K2069/00 ,  B29K2105/256 ,  B32B27/365 ,  B32B2255/10 ,  B32B2255/26 ,  C08J7/16 ,  C08J7/18 ,  C08J2367/02 ,  C08J2369/00 ,  C08J2433/00 ,  C08J2433/08 ,  C08J2435/02 ,  C08J2475/14

Abstract: A method of making a multilayer sheet includes: forming a substrate including a substrate first surface and a substrate second surface; applying a conductive layer including a base and a conductive coating to the substrate first surface; and applying an ultraviolet cured coating layer to a surface of the conductive layer opposite that in contact with the substrate second surface, wherein the ultraviolet cured coating layer comprises a multifunctional acrylate oligomer and an acrylate monomer; pressing the substrate, conductive layer, and ultraviolet cured coating layer together to form a stack; heating the stack; activating the ultraviolet cured coating layer with an ultraviolet radiation source; and removing the base from the stack leaving a conductive multilayer sheet; wherein the ultraviolet cured coating layer remains adhered to the conductive layer.

公开(公告)号：US20200253048A1

公开(公告)日：2020-08-06

申请号：US16838101

申请日：2020-04-02

Applicant: SABIC Global Technologies B.V.

Inventor： Zhe Chen ,  Jing Chen ,  Yonglei Xu ,  Yuzhen Xu

IPC: H05K1/09 ,  B29C51/14 ,  B32B27/16 ,  B32B27/08 ,  H05K3/00 ,  B32B27/26

Abstract: A method of thermoforming an article from an integrated transparent conductive film, comprising: applying an ultraviolet curable transfer coating to a first surface of a recipient substrate or to a first surface of a donor substrate, wherein the first surface of the donor substrate includes a conductive coating coupled thereto; pressing the first surface of the recipient substrate and the first surface of the donor substrate together to form a stack; heating the stack and activating the ultraviolet curable transfer coating with an ultraviolet radiation source; removing the donor substrate from the stack leaving a transparent conductive layer, wherein the ultraviolet curable transfer coating remains adhered to the first surface of the recipient substrate and to the conductive coating; laser etching an electrical circuit onto a transparent conductive layer second surface to form an integrated transparent conductive film; and thermoforming the integrated transparent conductive film to form the article.

公开(公告)号：US20190152196A1

公开(公告)日：2019-05-23

申请号：US15759566

申请日：2016-09-13

Applicant: SABIC Global Technologies B.V.

Inventor： Yuzhen Xu ,  Wei Feng ,  Zhe Chen ,  Yonglei Xu ,  Tsan-Ming Chen

IPC: B32B27/08 ,  B32B27/36 ,  B29C45/14 ,  B29B11/06

Abstract: A method of forming an article of manufacture, comprising: forming a mold insert, comprising applying a conductive layer on a donor substrate second surface, wherein the conductive layer includes nanometer sized metal particles arranged in a network; applying an ultraviolet curable coating layer to a recipient substrate first surface; pressing the recipient substrate, the ultraviolet curable coating layer, and the donor substrate together to form a stack; heating the stack and activating the ultraviolet cured coating layer with an ultraviolet radiation source; removing the donor substrate from the stack, wherein the ultraviolet curable coating layer adheres to the recipient substrate first surface and the conductive layer; thermoforming the mold insert; and injection molding a polymeric resin layer around a portion of the recipient substrate second surface.

公开(公告)号：US10227465B2

公开(公告)日：2019-03-12

申请号：US15502312

申请日：2015-04-20

Applicant: SABIC Global Technologies B.V.

Inventor： Wei Feng ,  Yuzhen Xu ,  Hengjie Lai ,  Zhe Chen ,  Yonglei Xu

IPC: C08G63/02 ,  C08J7/04 ,  C08J7/16 ,  C08J7/18 ,  B29B11/12 ,  B29B13/08 ,  B29C51/00 ,  B29C51/02 ,  B29C51/10 ,  B32B27/36 ,  B29K69/00 ,  B29K105/00

Abstract: A method of making a multilayer sheet includes: forming a substrate including a substrate first surface and a substrate second surface; applying a conductive layer including a base and a conductive coating to the substrate first surface; and applying an ultraviolet cured coating layer to a surface of the conductive layer opposite that in contact with the substrate second surface, wherein the ultraviolet cured coating layer comprises a multifunctional acrylate oligomer and an acrylate monomer; pressing the substrate, conductive layer, and ultraviolet cured coating layer together to form a stack; heating the stack; activating the ultraviolet cured coating layer with an ultraviolet radiation source; and removing the base from the stack leaving a conductive multilayer sheet; wherein the ultraviolet cured coating layer remains adhered to the conductive layer.

公开(公告)号：US20180279471A1

公开(公告)日：2018-09-27

申请号：US15763547

申请日：2016-09-27

Applicant: SABIC Global Technologies B.V.

Inventor： Zhe Chen ,  Jing Chen ,  Yonglei Xu ,  Yuzhen Xu

IPC: H05K1/09 ,  B32B27/16 ,  B32B27/08 ,  B29C51/14

CPC classification number: H05K1/095 ,  B29C51/14 ,  B32B27/08 ,  B32B27/16 ,  B32B27/26 ,  B32B2255/10 ,  B32B2255/205 ,  B32B2307/202 ,  B32B2323/04 ,  B32B2323/10 ,  B32B2325/00 ,  B32B2327/12 ,  B32B2369/00 ,  B32B2457/08 ,  B32B2457/12 ,  B32B2457/20 ,  B32B2457/202 ,  B32B2457/206 ,  B32B2457/208 ,  H05K1/097 ,  H05K3/0014 ,  H05K2201/0108 ,  H05K2201/0129

Abstract: A method of thermoforming an article from an integrated transparent conductive film includes heating the integrated transparent conductive film to a formable temperature in a mold, wherein the integrated transparent conductive film comprises a substrate comprising a transparent thermoplastic material, wherein the substrate includes a substrate first surface and a substrate second surface; a transparent conductive layer disposed adjacent to the substrate, wherein the transparent conductive layer includes a transparent conductive layer first surfaced disposed on the substrate first surface; and an electrical circuit etched onto a transparent conductive layer second surface; thermoforming the integrated transparent conductive film to the article comprising the mold shape; cooling the formed article; and removing the formed article form the mold; wherein the formed article has a functional electrical circuit after thermoforming.