Abstract:
A sputtering apparatus includes a chamber in which a display device is placed and a deposition process is performed on the display device, a gas supply part supplying plasma gas into the chamber, a first target disposed in the chamber and facing the display device, and a plurality of first magnet members disposed inside the first target. The first target includes a first surface facing the display device and a second surface opposite the first surface and facing the plurality of first magnet members, and the first target further includes hollows and protrusions alternately repeated on the first surface.
Abstract:
A thin film transistor array panel is provided. The thin film transistor array panel includes a substrate, a seed layer positioned on the substrate, and a semiconductor layer positioned on the seed layer, wherein a lattice mismatch between the seed layer and the semiconductor layer is equal to or less than 1.4%.
Abstract:
A display device includes a pixel defining layer on a substrate and including a bank including first through third bank layers, in order from the substrate, an inorganic pixel defining layer between the bank and the substrate, and the bank together with the inorganic pixel defining layer defining a light emission opening, an a light emitting element in the light emission opening. Each of the first and third bank layers has a side surface which defines the light emission opening, the third bank layer protrudes further than the side surface of the first bank layer to define a tip of the third bank layer which defines the side surface of the third bank layer, and the side surface of the third bank layer is inclined relative to the substrate and defines an inclined side surface of the third bank layer.
Abstract:
A sputtering device includes: a sputtering target; a substrate supporter facing the sputtering target and upon which a substrate is disposed; an anode mask between the sputtering target and the substrate which is on the substrate supporter; and a gas distribution member between the anode mask and the sputtering target, and including a plurality of gas distribution tubes separated from each other. Each gas distribution tube includes a plurality of discharge holes defined therein and through which gas is discharged to a vacuum chamber configured to receive the sputtering device.