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    FILTRATION APPARATUS AND CONTROL METHOD THEREOF
    2.
    发明申请
    FILTRATION APPARATUS AND CONTROL METHOD THEREOF 有权

    公开(公告)号：US20230035630A1

    公开(公告)日：2023-02-02

    申请号：US17804574

    申请日：2022-05-30

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Jongsoo HONG ,  Doyoon KIM ,  Hojin LEE ,  Byoungwoo KO

    IPC: C02F1/32 ,  C02F1/00 ,  E03B7/07

    Abstract: A filtration apparatus includes a flow path, a valve provided on the flow path, a first light source configured to emit a first light including ultraviolet (UV) light toward the flow path, a second light source configured to emit a second light including visible light or infrared light toward the flow path, a first optical sensor located out of a path of the first light and the second light, electrodes provided on the flow path, and a processor electrically coupled to the valve, the first light source, the second light source, the first optical sensor, and the electrodes. The processor is configured to alternately operate the first light source and the second light source, receive a first signal from the first optical sensor while the first light source emits the first light, and control the valve and the electrodes to sterilize the flow path based on the first signal.

    SEMICONDUCTOR DEVICE
    3.
    发明公开
    SEMICONDUCTOR DEVICE 审中-公开

    公开(公告)号：US20230253293A1

    公开(公告)日：2023-08-10

    申请号：US18075535

    申请日：2022-12-06

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Sohye CHO ,  Kwangjin MOON ,  Hojin LEE

    IPC: H01L23/48 ,  H01L29/423 ,  H01L29/08 ,  H01L29/06 ,  H01L29/786 ,  H01L29/775

    CPC classification number: H01L23/481 ,  H01L29/42392 ,  H01L29/0847 ,  H01L29/0673 ,  H01L29/78696 ,  H01L29/775

    Abstract: A semiconductor device includes a first semiconductor substrate having a protruding active pattern, a gate structure, a source/drain region in the active pattern on a side of the gate structure, an interlayer insulating layer on the source/drain region, a contact structure connected to the source/drain region through the interlayer insulating layer, a through-via structure electrically connected to the contact structure and passing through the interlayer insulating layer and the first semiconductor substrate, a first bonding structure including a first insulating layer on the first semiconductor substrate and a first connection pad in the first insulating layer, a second bonding structure on the first bonding structure and including a second insulating layer bonded to the first insulating layer and a second connection pad in the second insulating layer and bonded to the first connection pad, and a second semiconductor substrate disposed on the second bonding structure.

    SEMICONDUCTOR DEVICE INCLUDING THROUGH-ELECTRODES
    4.
    发明申请
    SEMICONDUCTOR DEVICE INCLUDING THROUGH-ELECTRODES 有权

    公开(公告)号：US20220399251A1

    公开(公告)日：2022-12-15

    申请号：US17708137

    申请日：2022-03-30

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Hyoukyung CHO ,  Hojin LEE ,  Kwangjin MOON

    IPC: H01L23/48 ,  H01L21/768 ,  H01L25/065 ,  H01L21/762 ,  H01L29/06

    Abstract: A semiconductor device includes: a semiconductor substrate having opposing first side and second sides; an active region and an isolation region on the first side; a circuit device on the active region; a front side interconnection structure on the first side and including front side interconnection layers disposed on different levels; first and second back side interconnection structures below the second side; a buried structure having a portion disposed in the isolation region and including a conductive line; a first through-electrode structure including a first through-electrode contacting the conductive line and penetrating the semiconductor substrate between the conductive line and the first back side interconnection structure; and a second through-electrode structure including a second through-electrode penetrating the semiconductor substrate between a first front side interconnection layer and the second back side interconnection structure. The first front side interconnection layer is on a level higher than that of the conductive line.

    OVEN
    5.
    发明公开
    OVEN 审中-公开

    公开(公告)号：US20240318830A1

    公开(公告)日：2024-09-26

    申请号：US18735781

    申请日：2024-06-06

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Jaewan HONG ,  Byoungwoo KO ,  Kyounghoon LEE ,  Hojin LEE

    IPC: F24C15/20 ,  F24C15/00

    CPC classification number: F24C15/2007 ,  F24C15/006 ,  F24C15/2021 ,  F24C15/2035

    Abstract: An oven including an inner cabinet forming a cooking chamber; an outer cabinet, to surround the inner cabinet so as to form a cooling passage through which external air passes; an air exhaust apparatus between the outer cabinet and the inner cabinet; a filter arrangeable on the upper side of the inner cabinet such that air from the cooking chamber passes through to the filter; a pressure regulating duct arrangeable on the upper side of the inner cabinet such that air having passed through the filter passes toward the cooling passage; a sensing pipe, arrangeable in the air exhaust apparatus, on the upper side of the filter such that air from the filter passes through a space above the filter and the cooling passage; and a steam sensor, arrangeable in the sensing pipe and measuring the amount of steam contained in the air passing through the sensing pipe.

    CLOTHES CARE APPARATUS
    7.
    发明申请
    CLOTHES CARE APPARATUS 有权

    公开(公告)号：US20210062404A1

    公开(公告)日：2021-03-04

    申请号：US17009274

    申请日：2020-09-01

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Yeonsoo HAM ,  Jiho SEO ,  Jaebok LEE ,  Hojin LEE ,  Seokho JU ,  Yongjun HWANG

    IPC: D06F73/02 ,  D06F71/34 ,  D06F71/04 ,  D06F71/20

    Abstract: A clothes care apparatus including a main body including a clothes care room, a support device arranged inside the clothes care room and configured to support clothes, and a steam generating device configured to supply steam into the clothes care room, wherein the support device includes a first support member, and a second support member and a third support member that are arranged in a first direction with respect to the first support member, the first support member and each of the second support member and the third support member are separated by a first separation distance, the second support member and the third support member are separated by a second separation distance in a second direction which is perpendicular to the first direction, wherein each of the first separation distances, and the second separation distance are variable to, when the clothes are supported on the support device and steam is supplied by the steam generating device, prevent wrinkles.

    AIR CONDITIONER
    8.
    发明申请
    AIR CONDITIONER 有权

    公开(公告)号：US20240393002A1

    公开(公告)日：2024-11-28

    申请号：US18784079

    申请日：2024-07-25

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Hojin LEE ,  Hyunho KIM ,  Wooyoung PARK ,  Byungyul SO ,  Soonwon AHN ,  Byeongkook YOO ,  Joonho YOON ,  Mingu JEON ,  Changwoo JUNG

    IPC: F24F13/08

    Abstract: An air conditioner includes: a main body including a heat exchanger and a blower fan, a panel frame assembled to the main body, a grille panel positioned on one side of the panel frame, a blade arranged to be spaced apart from the grille panel by a specified distance and to be rotatable relative to the panel frame, an intermediate panel positioned between the grille panel and the blade, a plurality of first holes arranged in the intermediate panel and capable of discharging air delivered from the blower fan, and a plurality of second holes arranged in the blade and capable of discharging air delivered from the blower fan.

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