公开(公告)号：US20250096061A1

公开(公告)日：2025-03-20

申请号：US18964984

申请日：2024-12-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Taehwan Kim ,  Kyungsuk Oh ,  Jaechoon Kim

IPC: H01L23/367 ,  H01L23/00 ,  H01L23/48 ,  H01L23/522 ,  H01L25/04

Abstract: A semiconductor package includes a first semiconductor chip including first through electrodes and having a first hot zone in which the first through electrodes are disposed; a heat redistribution chip disposed on the first semiconductor chip, having a cool zone overlapping the first hot zone in a stacking direction with respect to the first semiconductor chip, and including first heat redistribution through electrodes disposed outside of an outer boundary of the cool zone and electrically connected to the first through electrodes, respectively; a second semiconductor chip disposed on the heat redistribution chip, having a second hot zone overlapping the cool zone in the stacking direction, and including second through electrodes disposed in the second hot zone and electrically connected to the first heat redistribution through electrodes, respectively; and a first thermal barrier layer disposed between the first hot zone and the cool zone, wherein the first through electrodes are electrically connected to the second through electrodes by bypassing the cool zone via the first heat redistribution through electrodes.

公开(公告)号：US12199002B2

公开(公告)日：2025-01-14

申请号：US17736500

申请日：2022-05-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Taehwan Kim ,  Kyungsuk Oh ,  Jaechoon Kim

IPC: H01L21/00 ,  H01L23/00 ,  H01L23/367 ,  H01L23/48 ,  H01L23/522 ,  H01L25/04

Abstract: A semiconductor package includes a first semiconductor chip including first through electrodes and having a first hot zone in which the first through electrodes are disposed; a heat redistribution chip disposed on the first semiconductor chip, having a cool zone overlapping the first hot zone in a stacking direction with respect to the first semiconductor chip, and including first heat redistribution through electrodes disposed outside of an outer boundary of the cool zone and electrically connected to the first through electrodes, respectively; a second semiconductor chip disposed on the heat redistribution chip, having a second hot zone overlapping the cool zone in the stacking direction, and including second through electrodes disposed in the second hot zone and electrically connected to the first heat redistribution through electrodes, respectively; and a first thermal barrier layer disposed between the first hot zone and the cool zone, wherein the first through electrodes are electrically connected to the second through electrodes by bypassing the cool zone via the first heat redistribution through electrodes.

公开(公告)号：US20240321682A1

公开(公告)日：2024-09-26

申请号：US18394575

申请日：2023-12-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jonggyu Lee ,  Jaechoon Kim ,  Youngjoon Koh ,  Taehwan Kim

IPC: H01L23/427 ,  H01L23/00 ,  H01L23/528 ,  H01L25/10 ,  H10B80/00

CPC classification number: H01L23/473 ,  H01L23/3677 ,  H01L23/3733 ,  H01L23/44 ,  H01L24/32 ,  H01L25/18 ,  H10B80/00 ,  H01L24/16 ,  H01L24/73 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/1431

Abstract: Provided is a semiconductor package including a package substrate, a semiconductor device mounted on the package substrate, and a heat dissipation structure attached onto the semiconductor device, wherein the heat dissipation structure includes a plurality of vapor chambers at different levels in the vertical direction and a plurality of heat pipes extending between the plurality of vapor chambers.

公开(公告)号：US12087696B2

公开(公告)日：2024-09-10

申请号：US18095900

申请日：2023-01-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sunkyoung Seo ,  Taehwan Kim ,  Hyunjung Song ,  Hyoeun Kim ,  Wonil Lee ,  Sanguk Han

IPC: H01L23/48 ,  H01L23/00 ,  H01L23/367 ,  H01L23/538

CPC classification number: H01L23/5384 ,  H01L23/367 ,  H01L23/5385 ,  H01L23/5386 ,  H01L24/14

Abstract: A semiconductor package includes a package substrate, a lower semiconductor device arranged on the package substrate and including first through electrodes, first lower connection bumps arranged between the package substrate and the lower semiconductor device and electrically connecting the package substrate to the first through electrodes, a connecting substrate arranged on the package substrate and including second through electrodes, second lower connection bumps arranged between the package substrate and the connecting substrate and electrically connecting the package substrate to the second through electrodes, and an upper semiconductor device arranged on the lower semiconductor device and electrically connected to the first through electrodes and the second through electrodes.

公开(公告)号：US11943538B2

公开(公告)日：2024-03-26

申请号：US17732976

申请日：2022-04-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hwajoong Jung ,  Bongchan Kim ,  Kwangseok Byon ,  Taehwan Kim ,  Hyungjin Rho ,  Jaeheung Park ,  Jonghun Won

IPC: H04N23/68 ,  H04N23/51 ,  H04N23/54 ,  H05K1/11 ,  H05K1/14

CPC classification number: H04N23/687 ,  H04N23/54 ,  H05K1/112 ,  H05K1/118 ,  H05K1/14 ,  H04N23/51

Abstract: Disclosed is an electronic device including a camera module enabling a movable member (e.g., a circuit board) having an image sensor disposed thereon to move for an image stabilization function and including a connecting member that provides electrical connection of the image sensor, and an electronic device including the camera module.

公开(公告)号：US11574873B2

公开(公告)日：2023-02-07

申请号：US17003639

申请日：2020-08-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sunkyoung Seo ,  Taehwan Kim ,  Hyunjung Song ,  Hyoeun Kim ,  Wonil Lee ,  Sanguk Han

IPC: H01L23/367 ,  H01L23/538 ,  H01L23/00

Abstract: A semiconductor package includes a package substrate, a lower semiconductor device arranged on the package substrate and including first through electrodes, first lower connection bumps arranged between the package substrate and the lower semiconductor device and electrically connecting the package substrate to the first through electrodes, a connecting substrate arranged on the package substrate and including second through electrodes, second lower connection bumps arranged between the package substrate and the connecting substrate and electrically connecting the package substrate to the second through electrodes, and an upper semiconductor device arranged on the lower semiconductor device and electrically connected to the first through electrodes and the second through electrodes.

公开(公告)号：US10091527B2

公开(公告)日：2018-10-02

申请号：US14938248

申请日：2015-11-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Taehwan Kim ,  Sungho Roh

IPC: H04B1/66 ,  H04N19/57 ,  H04N19/20

Abstract: An encoding system includes a motion estimation unit configured to receive a plurality of frames and motion data corresponding to the plurality of frames, the plurality of frames including a first frame and a second frame, the first frame being a reference frame to an encoding target frame and the second frame being the encoding target frame, the motion estimation unit further configured to generate a motion vector to indicate a positional relationship between a macroblock of the first frame and a target macroblock of the second frame, a motion compensation unit configured to compensate for a motion of the target macroblock of the second frame according to the motion vector, a transform and quantization unit configured to output transformed and quantized data transforming and quantizing the motion-compensated target macroblock of the second frame and an encoder configured to encode the transformed and quantized data and output the encoded data.

公开(公告)号：US20240170366A1

公开(公告)日：2024-05-23

申请号：US18512640

申请日：2023-11-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jonggyu Lee ,  Youngsuk Nam ,  Seokkan Ki ,  Jaechoon Kim ,  Taehwan Kim

IPC: H01L23/427 ,  H01L23/00 ,  H01L23/538 ,  H01L25/065

CPC classification number: H01L23/4275 ,  H01L23/5383 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L25/0655 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2225/065 ,  H01L2924/1611 ,  H01L2924/186 ,  H01L2924/20102

Abstract: Provided is a semiconductor package including a circuit board, a semiconductor chip on the circuit board, a heat dissipation member adjacent to the semiconductor chip, and a heat transmission member between the semiconductor chip and the heat dissipation member, the heat transmission member including a resin insulating body and phase change metal particles connected to each other in the resin insulating body, wherein the phase change metal particles connect the semiconductor chip and the heat dissipation member, the phase change metal particles being configured to transmit heat generated by the semiconductor chip to the heat dissipation member.

公开(公告)号：US11483935B2

公开(公告)日：2022-10-25

申请号：US17172338

申请日：2021-02-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hwajoong Jung ,  Manho Kim ,  Taehwan Kim ,  Kihuk Lee ,  Yonghwan Choi

IPC: H05K3/12 ,  H05K1/02 ,  H05K1/18 ,  H05K3/30

Abstract: An electronic device includes: a housing and a printed circuit board (PCB) structure disposed in the housing. The PCB structure includes a circuit board including an opening area formed through a first surface of the circuit board and a second surface of the circuit board opposite the first surface and a conductive pattern formed in a peripheral area around the opening area, a plate disposed on the second surface of the circuit board covering the opening area, an electronic element disposed on the plate and electrically connected with the circuit board, a resin portion disposed between the plate and the circuit board and extending from the conductive pattern, the resin portion including a conductive material, and a solder portion formed between the resin portion and the plate.

公开(公告)号：US11367714B2

公开(公告)日：2022-06-21

申请号：US16845567

申请日：2020-04-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jangwoo Lee ,  Jongbo Shim ,  Ji Hwang Kim ,  Yungcheol Kong ,  Youngbae Kim ,  Taehwan Kim ,  Hyunglak Ma

IPC: H01L25/10 ,  H01L23/00 ,  H01L25/00 ,  H01L23/31 ,  H01L23/367 ,  H01L23/373

Abstract: A semiconductor package device may include a first package substrate, a first semiconductor chip on the first package substrate, an interposer on the first semiconductor chip, a warpage prevention member on the interposer, a molding member on the interposer and the first package substrate, and a second package substrate on the molding member. At least a portion of a top surface of the molding member may be spaced apart from a bottom surface of the second package substrate.