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公开(公告)号:US20210050054A1
公开(公告)日:2021-02-18
申请号:US16540862
申请日:2019-08-14
Applicant: SanDisk Technologies LLC
Inventor: Biswajit Ray , Peter Rabkin , Mohan Dunga , Gerrit Jan Hemink , Changyuan Chen
IPC: G11C11/56 , G11C11/406 , G11C11/4074 , G11C11/408
Abstract: Apparatuses and techniques are provided for programming memory cells while reducing widening of a threshold voltage distribution due to changes in the temperature between the time of programming and the time of a subsequent read operation. One technique is based on a correlation between program speed and temperature coefficient (Tco). A different verify test is used for different memory cells which have a common assigned data state according to the program loop number and the temperature. Another technique is based on sensing the memory cells to measure their subthreshold slope and classifying the memory cells into groups. The sensing can occur as a separate operation before programming or as part of the programming of user data. The subsequent programming of the memory cells involves adjusting the verify test of each memory cell based on its group and the temperature.
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公开(公告)号:US10818685B2
公开(公告)日:2020-10-27
申请号:US16141163
申请日:2018-09-25
Applicant: SANDISK TECHNOLOGIES LLC
Inventor: Mohan Dunga , James Kai , Venkatesh P. Ramachandra , Piyush Dak , Luisa Lin , Masaaki Higashitani
IPC: G11C11/24 , H01L27/11578 , G11C16/28 , G11C16/24 , H01L27/1157 , G11C16/08 , H01L27/11565 , H01L27/11573 , G11C16/30
Abstract: A non-volatile storage apparatus comprises a non-volatile memory structure and an I/O interface. A portion of the memory die is used as a pool capacitor for the I/O interface.
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3.
公开(公告)号:US20200294909A1
公开(公告)日:2020-09-17
申请号:US16886695
申请日:2020-05-28
Applicant: SANDISK TECHNOLOGIES LLC
Inventor: Luisa Lin , Mohan Dunga , Venkatesh P. Ramachandra , Peter Rabkin , Masaaki Higashitani
IPC: H01L23/522 , H01L23/528 , H01L23/00 , H01L49/02 , H01L27/11582
Abstract: A non-volatile storage apparatus comprises a non-volatile memory structure and a plurality of I/O pads in communication with the non-volatile memory structure. The I/O pads include a power I/O pad, a ground I/O pad and data/control I/O pads. The non-volatile storage apparatus further comprises one or more capacitors connected to the power I/O pad and the ground I/O pad. The one or more capacitors are positioned in one or more metal interconnect layers below the signal lines and/or above device capacitors on the top surface of the substrate.
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公开(公告)号:US20200013794A1
公开(公告)日:2020-01-09
申请号:US16141163
申请日:2018-09-25
Applicant: SANDISK TECHNOLOGIES LLC
Inventor: Mohan Dunga , James Kai , Venkatesh P. Ramachandra , Piyush Dak , Luisa Lin , Masaaki Higashitani
IPC: H01L27/11578 , G11C16/28 , G11C11/24 , G11C16/24 , G11C16/30 , G11C16/08 , H01L27/11565 , H01L27/11573 , H01L27/1157
Abstract: A non-volatile storage apparatus comprises a non-volatile memory structure and an I/O interface. A portion of the memory die is used as a pool capacitor for the I/O interface.
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公开(公告)号:US20190180831A1
公开(公告)日:2019-06-13
申请号:US15967572
申请日:2018-04-30
Applicant: SanDisk Technologies LLC
Inventor: Pitamber Shukla , Mohan Dunga , Anubhav Khandelwal
Abstract: A high-performance write operation to program data to a group of non-volatile memory cells may be completed in response to applying a single programming pulse to the group. Programming of the cells may be verified (and/or corrected) after completion of the command. Verifying programming of the cells may comprise identifying under-programmed cells, and applying an additional programming pulse to the identified cells. The under-programmed cells may comprise cells within an under-program range below a target level. The under-program range may be determined based on a threshold voltage distribution of the cells in response to applying the single programming pulse.
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公开(公告)号:US10319680B1
公开(公告)日:2019-06-11
申请号:US15909036
申请日:2018-03-01
Applicant: SANDISK TECHNOLOGIES LLC
Inventor: Jongsun Sel , Masaaki Higashitani , Mohan Dunga , Fumiaki Toyama , Peter Rabkin
IPC: H01L23/52 , H01L23/532 , H01L27/11556 , H01L21/768 , H01L23/522 , H01L27/11582
Abstract: A structure includes a metal interconnect structure embedded in a lower interconnect level dielectric layer overlying a substrate, at least one material layer overlying the metal interconnect structure, a first contact level dielectric layer overlying the at least one material layer; a metal contact via structure vertically extending through the first contact level dielectric layer and the at least one material layer and contacting a top surface of the metal interconnect structure, and an encapsulated tubular cavity laterally surrounding at least a lower portion of the metal contact via structure, and vertically extending through the at least one material layer.
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公开(公告)号:US20170372789A1
公开(公告)日:2017-12-28
申请号:US15194295
申请日:2016-06-27
Applicant: SanDisk Technologies LLC
Inventor: Biswajit Ray , Mohan Dunga , Gerrit Jan Hemink , Changyuan Chen
CPC classification number: G11C16/3445 , G11C16/0483 , G11C16/08 , G11C16/16
Abstract: Apparatuses, systems, methods, and computer program products are disclosed for erase depth control. One apparatus includes a block of non-volatile storage cells. A controller is configured to perform a first erase operation on a block of non-volatile storage cells. A controller for a block is configured to determine a first set of storage cells of the block having a faster erase speed than a second set of storage cells of the block based on a verify voltage threshold. A controller for a block is configured to perform a second erase operation on the block using different voltages for a first set of storage cells and a second set of storage cells of the block.
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8.
公开(公告)号:US11444016B2
公开(公告)日:2022-09-13
申请号:US16886695
申请日:2020-05-28
Applicant: SANDISK TECHNOLOGIES LLC
Inventor: Luisa Lin , Mohan Dunga , Venkatesh P. Ramachandra , Peter Rabkin , Masaaki Higashitani
IPC: H01L27/115 , H01L27/06 , H01L23/522 , H01L23/528 , H01L23/00 , H01L49/02 , H01L27/11582
Abstract: A non-volatile storage apparatus comprises a non-volatile memory structure and a plurality of I/O pads in communication with the non-volatile memory structure. The I/O pads include a power I/O pad, a ground I/O pad and data/control I/O pads. The non-volatile storage apparatus further comprises one or more capacitors connected to the power I/O pad and the ground I/O pad. The one or more capacitors are positioned in one or more metal interconnect layers below the signal lines and/or above device capacitors on the top surface of the substrate.
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公开(公告)号:US10971240B1
公开(公告)日:2021-04-06
申请号:US16726387
申请日:2019-12-24
Applicant: SanDisk Technologies LLC
Inventor: Mohan Dunga , Pitamber Shukla
Abstract: The storage device comprises a non-volatile memory coupled to a controller. The controller is configured to determine a first programming voltage by performing at least one program-verify iteration on a first word line using a voltage value which starts as a predetermined first initial voltage and is sequentially increased by a first voltage step amount following each failure to successfully program until the programming is completed. The controller is also configured to determine a second initial programming voltage by decreasing the first programming voltage by a second voltage step amount. The controller is further configured to perform at least one program-verify iteration on a second word line of the plurality of word lines using a voltage value which starts as the second initial programming voltage and is increased by the first voltage step amount following each sequential failure to successfully program until the programming is completed.
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公开(公告)号:US10789992B2
公开(公告)日:2020-09-29
申请号:US16168168
申请日:2018-10-23
Applicant: SANDISK TECHNOLOGIES LLC
Inventor: Luisa Lin , Mohan Dunga , Venkatesh P. Ramachandra , Peter Rabkin , Masaaki Higashitani
IPC: G11C11/24 , G11C5/06 , H01L27/1157 , H01L27/11573 , G11C16/08 , G11C5/10 , G11C16/28 , G11C16/24 , H01L27/11578
Abstract: A non-volatile storage apparatus comprises a non-volatile memory structure and a plurality of I/O pads in communication with the non-volatile memory structure. The I/O pads include a power I/O pad, a ground I/O pad and data/control I/O pads. The non-volatile storage apparatus further comprises one or more capacitors connected to the power I/O pad. The one or more capacitors are positioned in one or more metal interconnect layers below the I/O pads.
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