公开(公告)号：US20230044888A1

公开(公告)日：2023-02-09

申请号：US17965911

申请日：2022-10-14

Applicant: SEMES CO., LTD.

Inventor： Yong-Jun SEO ,  Hyun YOON ,  Jungsuk GOH ,  Byeong Geun KIM ,  Yoonki SA ,  Doyeon KIM ,  Yerim YEON ,  Choonghyun LEE ,  Pil Kyun HEO ,  Youngje UM ,  Jaeseong LEE ,  Dongok AHN

IPC: H01L21/02 ,  H01L21/67

Abstract: The inventive concept provides a method for treating a substrate. In an embodiment, the substrate treating method includes a treatment step of treating a residue on the substrate with a first fluid in a supercritical state and a second fluid in a supercritical state in a process space of a chamber, and the first fluid in the supercritical state and the second fluid in the supercritical state have different densities.

公开(公告)号：US20210050210A1

公开(公告)日：2021-02-18

申请号：US16993442

申请日：2020-08-14

Applicant: SEMES CO., LTD.

Inventor： Yong-Jun SEO ,  Hyun YOON ,  Jungsuk GOH ,  Byeong Geun KIM ,  Yoonki SA ,  Doyeon KIM ,  Yerim YEON ,  Choonghyun LEE ,  Pil Kyun HEO ,  Youngje UM ,  Jaeseong LEE ,  Dongok AHN

IPC: H01L21/02 ,  H01L21/67

Abstract: The inventive concept provides a method for treating a substrate. In an embodiment, the substrate treating method includes a treatment step of treating a residue on the substrate with a first fluid in a supercritical state and a second fluid in a supercritical state in a process space of a chamber, and the first fluid in the supercritical state and the second fluid in the supercritical state have different densities.

公开(公告)号：US20210023582A1

公开(公告)日：2021-01-28

申请号：US16936132

申请日：2020-07-22

Applicant: SEMES CO., LTD.

Inventor： Chan Young HEO ,  Kihoon CHOI ,  Ki-Moon KANG ,  Do Heon KIM ,  Jaeseong LEE

IPC: B05C5/02 ,  B05C11/10

Abstract: An apparatus for treating a substrate includes a process chamber having a treatment space defined therein, a support unit for supporting the substrate in the treatment space, a fluid supply unit for supplying supercritical fluid to the treatment space, and a controller configured to control the fluid supply unit, wherein the fluid supply unit is configured to selectively supply the supercritical fluid at a first density or a second density higher than the first density into the treatment space. Thus, drying efficiency of the substrate when drying the substrate using the supercritical fluid may be improved.

公开(公告)号：US20220415680A1

公开(公告)日：2022-12-29

申请号：US17664243

申请日：2022-05-20

Applicant: Semes Co., Ltd. ,  Samsung Electronics Co., Ltd.

Inventor： Jaeseong LEE ,  Kihoon CHOI ,  Hae-Won CHOI ,  Jihoon JEONG ,  Seohyun KIM ,  Young-Hoo KIM ,  Sangjine PARK ,  Kuntack LEE

IPC: H01L21/67 ,  H01L21/687

Abstract: A substrate processing apparatus includes a chamber including an upper chamber and a lower chamber coupled to each other to provide a space for processing a substrate, a substrate support configured to support the substrate within the chamber, an upper supply port provided in the upper chamber and configured to supply a supercritical fluid on an upper surface of the substrate within the chamber, a recess provided in a lower surface of the upper chamber, the recess including a horizontal extension portion extending in a direction parallel with the upper surface of the substrate in a radial direction from an outlet of the upper supply port and an inclined extension portion extending obliquely at an angle from the horizontal extension portion, and a baffle member disposed within the recess between the upper supply port and the substrate.

公开(公告)号：US20190080902A1

公开(公告)日：2019-03-14

申请号：US16129089

申请日：2018-09-12

Applicant: SEMES CO., LTD.

Inventor： Hae-Won CHOI ,  Ki-Moon KANG ,  Kihoon CHOI ,  Anton KORIAKIN ,  Chan Young HEO ,  Jaeseong LEE ,  Kwon Taek LIM ,  Yong Hun KIM ,  Sang Ho LEE

IPC: H01L21/02 ,  B08B3/08 ,  C09K13/08 ,  C11D7/36 ,  C11D7/50 ,  C11D7/34 ,  C11D11/00 ,  H01L21/687 ,  H01L21/67

Abstract: Disclosed are an anhydrous substrate cleaning composition, a substrate treating method, and a substrate treating apparatus. The anhydrous substrate cleaning composition includes an etching composite that provides fluorine, a solvent that dissolves the etching composite, and a binder that is a composite including phosphorous.