公开(公告)号：US20180355195A1

公开(公告)日：2018-12-13

申请号：US16061042

申请日：2016-11-17

Applicant: SHOWA DENKO K.K.

Inventor： Kazuhiko OOGA ,  Naoki MURATA ,  Kai SUZUKI

IPC: C09D11/102 ,  C08G18/42 ,  C08G18/34 ,  C08G18/32 ,  C08G18/66 ,  C08G18/75 ,  C08G18/16 ,  C09D11/037 ,  C08K3/36 ,  C08K3/26 ,  H05K1/02 ,  H05K1/03 ,  H05K3/46

CPC classification number: C09D11/102 ,  C08G18/168 ,  C08G18/3215 ,  C08G18/348 ,  C08G18/42 ,  C08G18/4211 ,  C08G18/6659 ,  C08G18/758 ,  C08K3/26 ,  C08K3/34 ,  C08K3/36 ,  C08K2003/267 ,  C08L63/00 ,  C08L75/06 ,  C09D7/40 ,  C09D11/037 ,  C09D175/04 ,  H05K1/0271 ,  H05K1/028 ,  H05K1/0353 ,  H05K3/4644 ,  H05K2203/1105

Abstract: A curable composition for forming an overcoat film for flexible wiring boards, the curable composition being effective in improving adhesion to substrates, low warpage, flexibility, the property of inhibiting wire breakage, and long-term reliability. The curable composition according to the present invention comprises a polyurethane (component a) having carboxyl groups and an aromatic-ring concentration of 0.1-6.5 mmol/g and containing an organic residue derived from a polyisocyanate, a solvent (component b), and a compound (component c) having two or more epoxy groups in the molecule.

公开(公告)号：US20180368253A1

公开(公告)日：2018-12-20

申请号：US16061036

申请日：2016-12-13

Applicant: SHOWA DENKO K.K.

Inventor： Kazuhiko OOGA ,  Naoki MURATA ,  Kai SUZUKI

IPC: H05K1/02 ,  B41M3/00 ,  B41M7/00 ,  H05K1/09 ,  H05K1/03 ,  H05K3/28 ,  C08G18/42 ,  C08G18/32 ,  C08G18/34 ,  C08G18/66 ,  C08G18/75 ,  C09D11/102 ,  C08K3/36 ,  C08K3/26 ,  C09D11/037

Abstract: Provided are a polyurethane and a curable composition capable of obtaining an overcoat film for a flexible wiring board that is excellent in low-warpage properties, flexibility, long-term insulation reliability, and wiring disconnection preventing properties. The polyurethane has: a structural unit of formula (1) (in formula (1), an n-number of R1 each independently represents a 1,2-phenylene group or a 1,2-phenylene group having a substituent, an (n+1)-number of R2 each independently represents a hydrocarbon group having 3-9 carbon atoms, and n represents an integer from 1 to 50); a structural unit of formula (2) (in formula (2). R3 represents a divalent organic group having 6-14 carbon atoms); and a structural unit of formula (3) (in formula (3), R3 represents a divalent organic group having 6-14 carbon atoms, and R4 represents a methyl or ethyl group).

公开(公告)号：US20130331531A1

公开(公告)日：2013-12-12

申请号：US13964428

申请日：2013-08-12

Applicant: SHOWA DENKO K.K.

Inventor： Hiroshi UCHIDA ,  Kazuhiko OOGA ,  Toshio FUJITA ,  Masanao HARA

IPC: H01B3/40

CPC classification number: H01B3/40 ,  C08F8/14 ,  C08F220/14 ,  C08F220/32 ,  C08F224/00 ,  C08F2810/20 ,  C08F218/02

Abstract: According to the present invention, a novel epoxy group-containing copolymer, including a production process thereof, and an epoxy (meth)acrylate copolymer starting from the epoxy group-containing copolymer, including a production process thereof are provided. The epoxy group-containing copolymer of the present invention contains a specific epoxy group-containing repeating unit and an olefin-based repeating unit. A novel epoxy (meth)acrylate copolymer of the present invention is produced by reacting the epoxy group-containing copolymer with (meth)acrylic acid.

Abstract translation: 根据本发明，提供了包含其生产方法的新型含环氧基的共聚物和由包含环氧基的共聚物开始的环氧（甲基）丙烯酸酯共聚物，包括其制备方法。 本发明的含环氧基的共聚物含有特定的含环氧基的重复单元和烯烃系重复单元。 通过使含环氧基的共聚物与（甲基）丙烯酸反应制备本发明的新型环氧（甲基）丙烯酸酯共聚物。

公开(公告)号：US20220127498A1

公开(公告)日：2022-04-28

申请号：US17428823

申请日：2020-03-16

Applicant: SHOWA DENKO K.K.

Inventor： Kazuhiko OOGA ,  Takeshi KAWAMOTO ,  Kai SUZUKI ,  Ryunosuke YAMAMOTO

IPC: C09J7/29 ,  B32B15/20 ,  B32B27/32 ,  H01M50/197 ,  B32B15/085 ,  B32B7/12 ,  C09J7/38

Abstract: Provided are an outer package material that is for electricity storage devices such as batteries and has such a sufficient anti-electrolytic solution property that the time-dependent reduction of the adhesive strength between a metal foil layer and a sealant layer by an electrolytic solution is suppressed over a long time and a composition for adhesives for giving the outer package material. In an outer package material that is for electricity storage devices and has a structure in which at least a base material layer, a first adhesive layer, a metal foil layer, a second adhesive layer, and a sealant layer are stacked in sequence, a composition containing an isocyanato group and a (meth) acryloyl group and further containing an acid-modified polyolefin (component 1), an active energy ray polymerization initiator (component 3), and a solvent (component 4) is used as a composition for adhesives to form the second adhesive layer.

公开(公告)号：US20140309326A1

公开(公告)日：2014-10-16

申请号：US14317710

申请日：2014-06-27

Applicant: SHOWA DENKO K.K.

Inventor： Kazuhiko OOGA ,  Ritsuko AZUMA

IPC: H05K1/03

CPC classification number: H05K1/0346 ,  C08G18/3212 ,  C08G18/718 ,  C08G18/8019 ,  C08G18/8116 ,  C09D175/16 ,  H05K3/287

Abstract: Provided are a polymerizable compound, a photocurable composition, and a photocurable moisture-proof insulating coating material for mounting circuit boards, which reduce environmental impact, excel in surface curability at low irradiation dose, and have high adhesion to substrate materials. The compound according to the present invention has a structural unit derived from a dimerdiol and has, as an end group, a group represented by formula (1): wherein R1 represents H or CH3 and R2 represents a hydrocarbon group having 2 to 12 carbon atoms, at an end thereof. Preferably, the compound has, as end groups, the group represented by formula (1) and a group represented by formula (2): wherein R3s each independently represent CH3 or CH2CH3, and R4 represents a hydrocarbon group having 3 to 9 carbon atoms, at the end thereof. The structure having the structural unit derived from a dimerdiol is preferably represented by formula (3):

Abstract translation: 提供一种可聚合化合物，可光固化组合物和用于安装电路板的光固化防潮绝缘涂层材料，其降低环境影响，在低照射剂量下表面固化性优异，并且对基材材料具有高粘合性。 根据本发明的化合物具有衍生自二聚二醇的结构单元，并且具有作为端基的由式（1）表示的基团：其中R 1表示H或CH 3，R 2表示具有2至12个碳原子的烃基 ，在结尾。 优选地，化合物具有作为端基的由式（1）表示的基团和由式（2）表示的基团：其中R 3各自独立地表示CH 3或CH 2 CH 3，并且R 4表示具有3至9个碳原子的烃基， 在最后。 具有来自二聚二醇的结构单元的结构优选由式（3）表示：