公开(公告)号：US20220148975A1

公开(公告)日：2022-05-12

申请号：US17134925

申请日：2020-12-28

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Wei-Jhen Chen ,  Chih-Hsun Hsu ,  Yuan-Hung Hsu ,  Chih-Nan Lin ,  Chang-Fu Lin ,  Don-Son Jiang ,  Chih-Ming Huang ,  Yi-Hsin Chen

IPC: H01L23/538 ,  H01L25/065 ,  H01L23/00 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56 ,  H01L21/683 ,  H01L25/00

Abstract: An electronic package and a manufacturing method thereof, which embeds an electronic structure acting as an auxiliary functional component and a plurality of conductive pillars in an encapsulation layer, and disposes an electronic component on the encapsulation layer, so as to facilitate electrical transmission with the electronic component in a close range.

公开(公告)号：US20230369229A1

公开(公告)日：2023-11-16

申请号：US17858358

申请日：2022-07-06

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Hsin-Jou Lin ,  Lung-Yuan Wang ,  Chih-Nan Lin ,  Feng Kao ,  Chiu-Ling Chen

IPC: H01L23/538 ,  H01L25/10 ,  H01L23/00 ,  H01L23/498 ,  H01L21/48

CPC classification number: H01L23/5381 ,  H01L25/105 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/5386 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/4857 ,  H01L23/49838 ,  H01L23/5385 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/3512 ,  H01L2924/182

Abstract: An electronic package and manufacturing method thereof are provided, in which an electronic module served as a bridge element and a plurality of conductive pillars are embedded in a packaging layer, a routing structure is formed on the packaging layer, and a plurality of electronic elements are disposed on the routing structure, such that the electronic elements electrically bridge the electronic module via the routing structure.

公开(公告)号：US20230361091A1

公开(公告)日：2023-11-09

申请号：US18220501

申请日：2023-07-11

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Wei-Jhen Chen ,  Chih-Hsun Hsu ,  Yuan-Hung Hsu ,  Chih-Nan Lin ,  Chang-Fu Lin ,  Don-Son Jiang ,  Chih-Ming Huang ,  Yi-Hsin Chen

IPC: H01L25/10 ,  H01L23/498 ,  H01L23/00 ,  H01L21/56

CPC classification number: H01L25/105 ,  H01L23/49822 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L21/565 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/32225 ,  H01L2224/81801 ,  H01L2924/182 ,  H01L2224/73204

Abstract: An electronic package and a manufacturing method thereof, which embeds an electronic structure acting as an auxiliary functional component and a plurality of conductive pillars in an encapsulation layer, and disposes an electronic component on the encapsulation layer, so as to facilitate electrical transmission with the electronic component in a close range.

公开(公告)号：US11742296B2

公开(公告)日：2023-08-29

申请号：US17134925

申请日：2020-12-28

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Wei-Jhen Chen ,  Chih-Hsun Hsu ,  Yuan-Hung Hsu ,  Chih-Nan Lin ,  Chang-Fu Lin ,  Don-Son Jiang ,  Chih-Ming Huang ,  Yi-Hsin Chen

IPC: H01L23/538 ,  H01L21/48 ,  H01L21/56 ,  H01L21/683 ,  H01L23/31 ,  H01L23/00 ,  H01L25/065 ,  H01L25/00

CPC classification number: H01L23/5386 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/3157 ,  H01L23/5381 ,  H01L23/5383 ,  H01L24/16 ,  H01L25/0655 ,  H01L25/50 ,  H01L2221/68359 ,  H01L2224/16227 ,  H01L2924/18161

Abstract: An electronic package and a manufacturing method thereof, which embeds an electronic structure acting as an auxiliary functional component and a plurality of conductive pillars in an encapsulation layer, and disposes an electronic component on the encapsulation layer, so as to facilitate electrical transmission with the electronic component in a close range.