公开(公告)号：US20230369229A1

公开(公告)日：2023-11-16

申请号：US17858358

申请日：2022-07-06

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Hsin-Jou Lin ,  Lung-Yuan Wang ,  Chih-Nan Lin ,  Feng Kao ,  Chiu-Ling Chen

IPC: H01L23/538 ,  H01L25/10 ,  H01L23/00 ,  H01L23/498 ,  H01L21/48

CPC classification number: H01L23/5381 ,  H01L25/105 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/5386 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/4857 ,  H01L23/49838 ,  H01L23/5385 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/3512 ,  H01L2924/182

Abstract: An electronic package and manufacturing method thereof are provided, in which an electronic module served as a bridge element and a plurality of conductive pillars are embedded in a packaging layer, a routing structure is formed on the packaging layer, and a plurality of electronic elements are disposed on the routing structure, such that the electronic elements electrically bridge the electronic module via the routing structure.

公开(公告)号：US20230178451A1

公开(公告)日：2023-06-08

申请号：US17944464

申请日：2022-09-14

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Hsin-Jou Lin ,  Lung-Yuan Wang ,  Feng Kao ,  Chiu-Ling Chen

IPC: H01L23/367 ,  H01L23/00 ,  H01L25/10 ,  H01L23/498 ,  H01L25/00 ,  H01L21/48

CPC classification number: H01L23/3675 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L23/3677 ,  H01L25/105 ,  H01L23/3672 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/49838 ,  H01L25/50 ,  H01L21/4882 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/16235 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2225/1076 ,  H01L2924/16151 ,  H01L2924/16196 ,  H01L2924/16235 ,  H01L2924/16251 ,  H01L2924/1632 ,  H01L2924/16315

Abstract: A method of manufacturing an electronic package is provided, in which a package module including a routing structure is stacked on a carrier structure via a plurality of conductive elements, a heat dissipation member covers a part of a surface of the routing structure, and an electronic module is disposed on another part of the surface of the routing structure, so that the routing structure is formed with at least one heat dissipation pad bonded to the heat dissipation member, such that the heat energy of the electronic module and the package module can be dissipated via the heat dissipation pad and the heat dissipation member.