公开(公告)号：US20190221500A1

公开(公告)日：2019-07-18

申请号：US16239333

申请日：2019-01-03

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Cristiano Gianluca STELLA ,  Francesco SALAMONE

IPC: H01L23/473 ,  H01L23/433 ,  H01L23/373 ,  H01L23/40 ,  H01L23/367 ,  H01L23/04

Abstract: A packaged device, having a package, including a first dissipative region, a second dissipative region, a first connection element and a second connection element. A die of semiconductor material is arranged within the package, carried by the first dissipative region. The first and second dissipative regions extend at a distance from each other, and the first and second connection elements extend at a distance from each other between the first and second dissipative regions. The first dissipative region, the second dissipative region, the first connection element, and the second connection element are hollow and form a circuit containing a cooling liquid.

公开(公告)号：US20240206133A1

公开(公告)日：2024-06-20

申请号：US18395137

申请日：2023-12-22

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Cristiano Gianluca STELLA ,  Francesco SALAMONE

IPC: H05K7/20 ,  H01L23/373 ,  H01L25/07

CPC classification number: H05K7/209 ,  H01L23/3735 ,  H01L25/071

Abstract: The device has a first support element forming a first thermal dissipation surface and carrying a first power component; a second support element forming a second thermal dissipation surface and carrying a second power component, a first contacting element superimposed to the first power component; a second contacting element superimposed to the second power component; a plurality of leads electrically coupled with the power components through the first and/or the second support elements; and a thermally conductive body arranged between the first and the second contacting elements. The first and the second support elements and the first and the second contacting elements are formed by electrically insulating and thermally conductive multilayers.

公开(公告)号：US20230317537A1

公开(公告)日：2023-10-05

申请号：US18193095

申请日：2023-03-30

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Sergio SAVINO ,  Francesco SALAMONE

IPC: H01L23/31 ,  H01L23/057 ,  H01L23/498 ,  H01L23/00

CPC classification number: H01L23/3121 ,  H01L23/057 ,  H01L23/315 ,  H01L23/49805 ,  H01L24/29 ,  H01L2924/1811 ,  H01L2924/1425

Abstract: Power module packaged in a housing accommodating a carrying substrate forming a plurality of connection regions of conductive material. An electronic component is arranged inside the housing, attached to a connection region of the plurality of connection regions. An electrical connector, coupled to the electronic component, extends towards the main surface of the housing and is accessible from the outside of the housing. The electrical connector has a tubular portion forming a pillar fixed to a pin which protrudes from the greater surface of the housing. The housing includes a packaging mass of electrically insulating material that embeds the pillar and blocks it therein.

公开(公告)号：US20190311976A1

公开(公告)日：2019-10-10

申请号：US16370193

申请日：2019-03-29

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Francesco SALAMONE ,  Cristiano Gianluca STELLA

IPC: H01L23/495 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56

Abstract: A semiconductor power device has: a die, with a front surface and a rear surface, and with an arrangement of projecting regions on the front surface, which define between them windows arranged within which are contact regions; and a package, which houses the die inside it. A metal frame has a top surface and a bottom surface; the die is carried by the frame on the top surface; an encapsulation coating coats the frame and the die. A first insulation multilayer is arranged above the die and is formed by an upper metal layer, a lower metal layer, and an intermediate insulating layer; the lower metal layer is shaped according to an arrangement of the projecting regions and has contact projections, which extend so as to electrically contact the contact regions, and insulation regions, interposed between the contact projections, in positions corresponding to the projecting regions.

公开(公告)号：US20240429132A1

公开(公告)日：2024-12-26

申请号：US18830402

申请日：2024-09-10

Applicant: STMicroelectronics S.r.l.

Inventor： Agatino MINOTTI ,  Francesco SALAMONE ,  Massimiliano FIORITO ,  Alessio SCORDIA ,  Manuel PONTURO

IPC: H01L23/49 ,  H01L23/373 ,  H01L23/492 ,  H01R12/58 ,  H01R43/02

Abstract: A blocking element is provided for connecting an electronic, micro-mechanical and/or micro-electro-mechanical component, in particular for controlling the propulsion of an electric vehicle. The pin blocking element is formed by a holed body having a first end, a second end and an axial cavity configured for fittingly accommodating a connecting pin. A first flange projects transversely from the holed body at the first end and a second flange projects transversely from the holed body at the second end. The first flange has a greater area than the second flange and is configured to be ultrasonically soldered to a conductive bearing plate to form a power module.

公开(公告)号：US20230317685A1

公开(公告)日：2023-10-05

申请号：US18188918

申请日：2023-03-23

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Cristiano Gianluca STELLA ,  Agatino MINOTTI ,  Francesco SALAMONE

IPC: H01L25/07 ,  H01L23/538 ,  H01L23/373 ,  H01L23/473 ,  H01L23/31

CPC classification number: H01L25/072 ,  H01L23/5383 ,  H01L23/3735 ,  H01L23/473 ,  H01L23/3107

Abstract: Electronic device comprising at least a first and a second branch, each branch including a first and a second transistor arranged in series to each other and formed in respective dice of semiconductor material. The dice are sandwiched between a first substrate element and a second substrate element. The first and the second substrate elements are formed each by a multilayer including a first conductive layer, a second conductive layer and an insulating layer extending between the first and the second conductive layers. The first conductive layers of the first and the second substrate elements face towards the outside of the electronic device and define a first and a second main face of the electronic device. The second conductive layer of the first and the second substrate elements is shaped so as to form contact regions facing and in selective electrical contact with the plurality of dice.

公开(公告)号：US20210327792A1

公开(公告)日：2021-10-21

申请号：US17227030

申请日：2021-04-09

Applicant: STMicroelectronics S.r.l.

Inventor： Cristiano Gianluca STELLA ,  Fabio Vito COPPONE ,  Francesco SALAMONE

IPC: H01L23/495 ,  H01L23/31

Abstract: A power device for surface mounting has a leadframe including a die-attach support and at least one first lead and one second lead. A die, of semiconductor material, is bonded to the die-attach support, and a package, of insulating material and parallelepipedal shape, surrounds the die and at least in part the die-attach support and has a package height. The first and second leads have outer portions extending outside the package, from two opposite lateral surfaces of the package. The outer portions of the leads have lead heights greater than the package height, extend throughout the height of the package, and have respective portions projecting from the first base.

公开(公告)号：US20200303278A1

公开(公告)日：2020-09-24

申请号：US16894460

申请日：2020-06-05

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Francesco SALAMONE ,  Cristiano Gianluca STELLA

IPC: H01L23/367 ,  H01L21/56 ,  H01L23/31 ,  H01L21/48 ,  H01L23/433 ,  H01L23/495 ,  H01L23/373 ,  H01L23/48 ,  H01L23/34 ,  H01L23/36 ,  H01L23/42 ,  H01L23/28

Abstract: A semiconductor power device has: a die, with a front surface and a rear surface, and with an arrangement of projecting regions on the front surface, which define between them windows arranged within which are contact regions; and a package, which houses the die inside it. A metal frame has a top surface and a bottom surface; the die is carried by the frame on the top surface; an encapsulation coating coats the frame and the die. A first insulation multilayer is arranged above the die and is formed by an upper metal layer, a lower metal layer, and an intermediate insulating layer; the lower metal layer is shaped according to an arrangement of the projecting regions and has contact projections, which extend so as to electrically contact the contact regions, and insulation regions, interposed between the contact projections, in positions corresponding to the projecting regions.

公开(公告)号：US20240203837A1

公开(公告)日：2024-06-20

申请号：US18395122

申请日：2023-12-22

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Cristiano Gianluca STELLA ,  Fabio Vito COPPONE ,  Francesco SALAMONE

IPC: H01L23/495 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L23/49537 ,  H01L23/3114 ,  H01L23/49513 ,  H01L23/4952 ,  H01L23/49541 ,  H01L23/49562 ,  H01L23/49568 ,  H01L23/49575 ,  H01L24/49 ,  H01L2924/181

Abstract: A power device for surface mounting has a leadframe including a die-attach support and at least one first lead and one second lead. A die, of semiconductor material, is bonded to the die-attach support, and a package, of insulating material and parallelepipedal shape, surrounds the die and at least in part the die-attach support and has a package height. The first and second leads have outer portions extending outside the package, from two opposite lateral surfaces of the package. The outer portions of the leads have lead heights greater than the package height, extend throughout the height of the package, and have respective portions projecting from the first base.

公开(公告)号：US20230143679A1

公开(公告)日：2023-05-11

申请号：US18150511

申请日：2023-01-05

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Cristiano Gianluca STELLA ,  Fabio Vito COPPONE ,  Francesco SALAMONE

IPC: H01L23/495 ,  H01L23/31 ,  H01L23/00

CPC classification number: H01L23/49537 ,  H01L23/3114 ,  H01L23/49513 ,  H01L23/4952 ,  H01L23/49562 ,  H01L23/49568 ,  H01L23/49575 ,  H01L23/49541 ,  H01L24/49 ,  H01L2924/181

Abstract: A power device for surface mounting has a leadframe including a die-attach support and at least one first lead and one second lead. A die, of semiconductor material, is bonded to the die-attach support, and a package, of insulating material and parallelepipedal shape, surrounds the die and at least in part the die-attach support and has a package height. The first and second leads have outer portions extending outside the package, from two opposite lateral surfaces of the package. The outer portions of the leads have lead heights greater than the package height, extend throughout the height of the package, and have respective portions projecting from the first base.