公开(公告)号：US08704358B2

公开(公告)日：2014-04-22

申请号：US13688008

申请日：2012-11-28

Applicant: STMicroelectronics S.A.

Inventor： Pierre Bar ,  Sylvain Joblot ,  Nicolas Hotellier

IPC: H01L23/04

CPC classification number: H01L21/56 ,  H01L21/6836 ,  H01L21/76898 ,  H01L23/481 ,  H01L23/49811 ,  H01L24/08 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/80 ,  H01L24/92 ,  H01L24/94 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2224/0401 ,  H01L2224/05571 ,  H01L2224/05647 ,  H01L2224/08145 ,  H01L2224/09181 ,  H01L2224/11009 ,  H01L2224/11334 ,  H01L2224/13022 ,  H01L2224/13025 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/80203 ,  H01L2224/80895 ,  H01L2224/80896 ,  H01L2224/83203 ,  H01L2224/9202 ,  H01L2224/9222 ,  H01L2224/94 ,  H01L2225/06517 ,  H01L2225/06524 ,  H01L2225/06541 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2224/80 ,  H01L2924/00012 ,  H01L2224/11 ,  H01L2224/81 ,  H01L2224/05552

Abstract: A method for forming an integrated circuit including the steps of: a) forming openings in a front surface of a first semiconductor wafer, the depth of the openings being smaller than 10 μm, and filling them with a conductive material; b) forming doped areas of components in active areas of the front surface, forming interconnection levels on the front surface and leveling the surface supporting the interconnection levels; c) covering with an insulating layer a front surface of a second semiconductor wafer, and leveling the surface coated with an insulator; d) applying the front surface of the second wafer coated with insulator on the front surface of the first wafer supporting interconnection levels, to obtain a bonding between the two wafers; e) forming vias from the rear surface of the second wafer, to reach the interconnection levels of the first wafer; and f) thinning the first wafer to reach the openings filled with conductive material.

Abstract translation: 一种用于形成集成电路的方法，包括以下步骤：a）在第一半导体晶片的前表面形成开口，开口深度小于10μm，并用导电材料填充; b）在前表面的有源区域中形成组分的掺杂区域，在前表面上形成互连层，并平整支撑互连层的表面; c）用绝缘层覆盖第二半导体晶片的前表面，并平整涂有绝缘体的表面; d）将涂有绝缘体的第二晶片的前表面施加在第一晶片支撑互连电平的前表面上，以获得两个晶片之间的结合; e）从第二晶片的后表面形成通孔，以达到第一晶片的互连电平; 以及f）使第一晶片变薄以到达填充有导电材料的开口。

公开(公告)号：US20130140693A1

公开(公告)日：2013-06-06

申请号：US13688008

申请日：2012-11-28

Applicant: STMicroelectronics S.A.

Inventor： Pierre Bar ,  Sylvain Joblot ,  Nicolas Hotellier

IPC: H01L21/56 ,  H01L23/498

CPC classification number: H01L21/56 ,  H01L21/6836 ,  H01L21/76898 ,  H01L23/481 ,  H01L23/49811 ,  H01L24/08 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/80 ,  H01L24/92 ,  H01L24/94 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2224/0401 ,  H01L2224/05571 ,  H01L2224/05647 ,  H01L2224/08145 ,  H01L2224/09181 ,  H01L2224/11009 ,  H01L2224/11334 ,  H01L2224/13022 ,  H01L2224/13025 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/80203 ,  H01L2224/80895 ,  H01L2224/80896 ,  H01L2224/83203 ,  H01L2224/9202 ,  H01L2224/9222 ,  H01L2224/94 ,  H01L2225/06517 ,  H01L2225/06524 ,  H01L2225/06541 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2224/80 ,  H01L2924/00012 ,  H01L2224/11 ,  H01L2224/81 ,  H01L2224/05552

Abstract: A method for forming an integrated circuit including the steps of: a) forming openings in a front surface of a first semiconductor wafer, the depth of the openings being smaller than 10 μm, and filling them with a conductive material; b) forming doped areas of components in active areas of the front surface, forming interconnection levels on the front surface and leveling the surface supporting the interconnection levels; c) covering with an insulating layer a front surface of a second semiconductor wafer, and leveling the surface coated with an insulator; d) applying the front surface of the second wafer coated with insulator on the front surface of the first wafer supporting interconnection levels, to obtain a bonding between the two wafers; e) forming vias from the rear surface of the second wafer, to reach the interconnection levels of the first wafer; and f) thinning the first wafer to reach the openings filled with conductive material.

Abstract translation: 一种用于形成集成电路的方法，包括以下步骤：a）在第一半导体晶片的前表面形成开口，开口深度小于10um，并用导电材料填充; b）在前表面的有源区域中形成组分的掺杂区域，在前表面上形成互连层，并平整支撑互连层的表面; c）用绝缘层覆盖第二半导体晶片的前表面，并平整涂有绝缘体的表面; d）将涂有绝缘体的第二晶片的前表面施加在第一晶片支撑互连层的前表面上，以获得两个晶片之间的结合; e）从第二晶片的后表面形成通孔，以达到第一晶片的互连电平; 以及f）使第一晶片变薄以到达填充有导电材料的开口。