公开(公告)号：US20160079144A1

公开(公告)日：2016-03-17

申请号：US14946502

申请日：2015-11-19

Applicant: STMicroelectronics S.r.l.

Inventor： Mario Giovanni Scurati ,  Laura Ceriati ,  Luciano Benini

IPC: H01L23/373 ,  H01L23/42 ,  H01L23/00 ,  H01L21/56 ,  H01L21/78

CPC classification number: H01L23/3733 ,  B29C65/4855 ,  B29C65/4865 ,  B29C65/54 ,  H01L21/561 ,  H01L21/565 ,  H01L21/78 ,  H01L23/373 ,  H01L23/42 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L24/94 ,  H01L24/97 ,  H01L2224/29082 ,  H01L2224/29099 ,  H01L2224/29193 ,  H01L2224/292 ,  H01L2224/2929 ,  H01L2224/29393 ,  H01L2224/29499 ,  H01L2224/32221 ,  H01L2224/32245 ,  H01L2224/83855 ,  H01L2224/83862 ,  H01L2224/94 ,  H01L2924/13055 ,  H01L2924/13091 ,  Y10T428/30 ,  H01L2924/00 ,  H01L2224/27 ,  H01L2924/014

Abstract: An integrated circuit chip attachment in a microstructure device is accomplished through the use of an adhesive-based material in which graphene flakes are incorporated. This results in superior thermal conductivity. The spatial orientation of the graphene flakes is controlled, for example by adhering polar molecules to the graphene flakes and exposing the flakes to an external force field, so that the graphene flakes have desired orientations under the integrated circuit chip, alongside of the integrated circuit chip and above the integrated circuit chip.

Abstract translation: 微结构器件中的集成电路芯片附件通过使用其中掺入石墨烯薄片的基于粘合剂的材料来实现。 这导致优异的导热性。 控制石墨烯薄片的空间取向，例如通过将极性分子粘附到石墨烯薄片上并将薄片暴露于外部力场，使得石墨烯薄片在集成电路芯片的下方具有期望的取向，并且与集成电路芯片 以上集成电路芯片。

公开(公告)号：US09892994B2

公开(公告)日：2018-02-13

申请号：US14946502

申请日：2015-11-19

Applicant: STMicroelectronics S.r.l.

Inventor： Mario Giovanni Scurati ,  Laura Ceriati ,  Luciano Benini

IPC: H01L23/373 ,  B29C65/48 ,  B29C65/54 ,  H01L21/56 ,  H01L21/78 ,  H01L23/42 ,  H01L23/00

CPC classification number: H01L23/3733 ,  B29C65/4855 ,  B29C65/4865 ,  B29C65/54 ,  H01L21/561 ,  H01L21/565 ,  H01L21/78 ,  H01L23/373 ,  H01L23/42 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L24/94 ,  H01L24/97 ,  H01L2224/29082 ,  H01L2224/29099 ,  H01L2224/29193 ,  H01L2224/292 ,  H01L2224/2929 ,  H01L2224/29393 ,  H01L2224/29499 ,  H01L2224/32221 ,  H01L2224/32245 ,  H01L2224/83855 ,  H01L2224/83862 ,  H01L2224/94 ,  H01L2924/13055 ,  H01L2924/13091 ,  Y10T428/30 ,  H01L2924/00 ,  H01L2224/27 ,  H01L2924/014

Abstract: An integrated circuit chip attachment in a microstructure device is accomplished through the use of an adhesive-based material in which graphene flakes are incorporated. This results in superior thermal conductivity. The spatial orientation of the graphene flakes is controlled, for example by adhering polar molecules to the graphene flakes and exposing the flakes to an external force field, so that the graphene flakes have desired orientations under the integrated circuit chip, alongside of the integrated circuit chip and above the integrated circuit chip.

公开(公告)号：US20160099200A1

公开(公告)日：2016-04-07

申请号：US14750920

申请日：2015-06-25

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Laura Ceriati ,  Paolo Crema ,  Agatino Minotti

IPC: H01L23/495 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00

CPC classification number: H01L24/32 ,  C22C21/02 ,  H01L21/56 ,  H01L23/3107 ,  H01L23/49562 ,  H01L23/49579 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/97 ,  H01L2224/05554 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/13091 ,  H01L2924/17724 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: Described herein is a semiconductor device provided with: a die of semiconductor material; a lead frame, defining a support plate, which is designed to carry the die, and leads, which are designed to be electrically coupled to the die; and a package, of encapsulating material, which is designed to encapsulate the die and partially coming out of which are the leads. The lead frame has as constituent material an aluminum alloy comprising a percentage of silicon ranging between 1% and 1.5%.

Abstract translation: 这里描述的是一种半导体器件，其具有：半导体材料的管芯; 引线框架，限定被设计成承载芯片的支撑板和被设计成电耦合到管芯的引线; 以及封装材料的封装，其被设计成封装模具并部分地从其中引出。 引线框架具有作为构成材料的铝合金，其包含1％至1.5％之间的硅的百分比。

公开(公告)号：US20140287239A1

公开(公告)日：2014-09-25

申请号：US14215597

申请日：2014-03-17

Applicant: STMicroelectronics S.r.l.

Inventor： Mario Giovanni Scurati ,  Laura Ceriati ,  Luciano Benini

IPC: H01L23/373 ,  B29C65/48 ,  B29C65/54

CPC classification number: H01L23/3733 ,  B29C65/4855 ,  B29C65/4865 ,  B29C65/54 ,  H01L21/561 ,  H01L21/565 ,  H01L21/78 ,  H01L23/373 ,  H01L23/42 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L24/94 ,  H01L24/97 ,  H01L2224/29082 ,  H01L2224/29099 ,  H01L2224/29193 ,  H01L2224/292 ,  H01L2224/2929 ,  H01L2224/29393 ,  H01L2224/29499 ,  H01L2224/32221 ,  H01L2224/32245 ,  H01L2224/83855 ,  H01L2224/83862 ,  H01L2224/94 ,  H01L2924/13055 ,  H01L2924/13091 ,  Y10T428/30 ,  H01L2924/00 ,  H01L2224/27 ,  H01L2924/014

Abstract: An integrated circuit chip attachment in a microstructure device is accomplished through the use of an adhesive-based material in which graphene flakes are incorporated. This results in superior thermal conductivity. The spatial orientation of the graphene flakes is controlled, for example by adhering polar molecules to the graphene flakes and exposing the flakes to an external force field, so that the graphene flakes have desired orientations under the integrated circuit chip, alongside of the integrated circuit chip and above the integrated circuit chip.

Abstract translation: 微结构器件中的集成电路芯片附件通过使用其中掺入石墨烯薄片的基于粘合剂的材料来实现。 这导致优异的导热性。 控制石墨烯薄片的空间取向，例如通过将极性分子粘附到石墨烯薄片上并将薄片暴露于外部力场，使得石墨烯薄片在集成电路芯片的下方具有期望的取向，并且与集成电路芯片 以上集成电路芯片。