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公开(公告)号：US20170203568A9
公开(公告)日：2017-07-20
申请号：US14523625
申请日：2014-10-24
Applicant: STMicroelectronics S.r.l. , STMicroelectronics, Inc.
Inventor： Dino Faralli , Michele Palmieri
IPC: B41J2/16
CPC classification number: B41J2/162 , B41J2/1433 , B41J2/1601 , B41J2/1623 , B41J2/1626 , B41J2/1628 , B41J2/1629 , B41J2/1632 , B41J2/1639 , B41J2/164 , B41J2/1642 , B41J2002/14475 , Y10T29/49401
Abstract: A nozzle plate for a fluid-ejection device, comprising: a first substrate made of semiconductor material, having a first side and a second side; a structural layer extending on the first side of the first substrate, the structural layer having a first side and a second side, the second side of the structural layer facing the first side of the first substrate; at least one first through hole, having an inner surface, extending through the structural layer, the first through hole having an inlet section corresponding to the first side of the structural layer and an outlet section corresponding to the second side of the structural layer; a narrowing element adjacent to the surface of the first through hole, and including a tapered portion such that the inlet section of the first through hole has an area larger than a respective area of the outlet section of the first through hole.
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2.发明申请PROCESS FOR MANUFACTURING A NOZZLE PLATE AND FLUID-EJECTION DEVICE PROVIDED WITH THE NOZZLE PLATE 审中-公开用喷嘴板制造喷嘴板和流体喷射装置的方法公开(公告)号：US20150040397A1
公开(公告)日：2015-02-12
申请号：US14523625
申请日：2014-10-24
Applicant: STMicroelectronics S.r.l. , STMicroelectronics, Inc.
Inventor： Dino Faralli , Michele Palmieri
IPC: B41J2/16
CPC classification number: B41J2/162 , B41J2/1433 , B41J2/1601 , B41J2/1623 , B41J2/1626 , B41J2/1628 , B41J2/1629 , B41J2/1632 , B41J2/1639 , B41J2/164 , B41J2/1642 , B41J2002/14475 , Y10T29/49401
Abstract: A nozzle plate for a fluid-ejection device, comprising: a first substrate made of semiconductor material, having a first side and a second side; a structural layer extending on the first side of the first substrate, the structural layer having a first side and a second side, the second side of the structural layer facing the first side of the first substrate; at least one first through hole, having an inner surface, extending through the structural layer, the first through hole having an inlet section corresponding to the first side of the structural layer and an outlet section corresponding to the second side of the structural layer; a narrowing element adjacent to the surface of the first through hole, and including a tapered portion such that the inlet section of the first through hole has an area larger than a respective area of the outlet section of the first through hole.
Abstract translation: 一种用于流体喷射装置的喷嘴板，包括：具有第一侧和第二侧的由半导体材料制成的第一基板; 所述结构层在所述第一基板的所述第一侧上延伸，所述结构层具有第一侧面和第二侧面，所述结构层的第二面朝向所述第一基板的第一侧; 至少一个第一通孔，具有延伸穿过所述结构层的内表面，所述第一通孔具有对应于所述结构层的第一侧的入口部分和与所述结构层的第二侧相对应的出口部分; 与第一通孔的表面相邻的变窄元件，并且包括锥形部分，使得第一通孔的入口部分具有比第一通孔的出口部分的相应面积大的面积。
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公开(公告)号：US09707761B2
公开(公告)日：2017-07-18
申请号：US14523625
申请日：2014-10-24
Applicant: STMicroelectronics S.r.l. , STMicroelectronics, Inc.
Inventor： Dino Faralli , Michele Palmieri
CPC classification number: B41J2/162 , B41J2/1433 , B41J2/1601 , B41J2/1623 , B41J2/1626 , B41J2/1628 , B41J2/1629 , B41J2/1632 , B41J2/1639 , B41J2/164 , B41J2/1642 , B41J2002/14475 , Y10T29/49401
Abstract: A nozzle plate for a fluid-ejection device, comprising: a first substrate made of semiconductor material, having a first side and a second side; a structural layer extending on the first side of the first substrate, the structural layer having a first side and a second side, the second side of the structural layer facing the first side of the first substrate; at least one first through hole, having an inner surface, extending through the structural layer, the first through hole having an inlet section corresponding to the first side of the structural layer and an outlet section corresponding to the second side of the structural layer; a narrowing element adjacent to the surface of the first through hole, and including a tapered portion such that the inlet section of the first through hole has an area larger than a respective area of the outlet section of the first through hole.
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公开(公告)号：US20180065371A1
公开(公告)日：2018-03-08
申请号：US15812960
申请日：2017-11-14
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Mauro Cattaneo , Carlo Luigi Prelini , Lorenzo Colombo , Dino Faralli , Alessandra Sciutti , Lorenzo Tentori
CPC classification number: B41J2/1626 , B41J2/01 , B41J2/135 , B41J2/16 , B41J2/1607 , B41J2/161 , B41J2/162 , B41J2/1621 , B41J2/1628 , B41J2/1629 , B41J2/1631 , B41J2/1632 , Y10T29/49401
Abstract: A method for manufacturing a device for ejecting a fluid, including producing a nozzle plate including: forming a first nozzle cavity, having a first diameter, in a first semiconductor body; forming a hydrophilic layer at least in part in the first nozzle cavity; forming a structural layer on the hydrophilic layer; etching the structural layer to form a second nozzle cavity aligned to the first nozzle cavity in a fluid-ejection direction and having a second diameter larger than the first diameter; proceeding with etching of the structural layer for removing portions thereof in the first nozzle cavity, to reach the hydrophilic layer and arranged in fluid communication the first and second nozzle cavities; and coupling the nozzle plate with a chamber for containing the fluid.
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5.发明申请ASSEMBLY FOR A MEMS ENVIRONMENTAL SENSOR DEVICE HAVING IMPROVED RESISTANCE, AND CORRESPONDING MANUFACTURING PROCESS 审中-公开具有改进电阻的MEMS环境传感器装置的组装以及相应的制造工艺公开(公告)号：US20150014798A1
公开(公告)日：2015-01-15
申请号：US14327272
申请日：2014-07-09
Inventor： Dino Faralli , Benedetto Vigna , Laura Maria Castoldi
CPC classification number: B81B3/00 , B81B7/0058 , B81B2201/0257 , B81B2201/0264 , B81B2201/0278 , B81B2203/0127 , B81C1/00 , B81C2203/0109 , G01F1/00 , G01H17/00 , G01K1/00 , G01L1/00 , H01L2224/48145 , H01L2224/73265 , H01L2924/1461 , H01L2924/16151 , H01L2924/16152 , H01L2924/00012
Abstract: Described herein is an assembly for a MEMS sensor device, which envisages: a first body made of semiconductor material, integrating a micromechanical detection structure at a first main face thereof; a cap element, set stacked on the first main face of the first body, above the micromechanical detection structure; and an adhesion structure set between the first body and the cap element, defining a gap in a position corresponding to the micromechanical detection structure. At least one first opening is defined through the adhesion structure in fluidic communication with the gap.
Abstract translation: 这里描述的是一种用于MEMS传感器装置的组件，其设想：由半导体材料制成的第一主体，在其第一主面处集成微机械检测结构; 设置在第一主体的第一主面上的盖元件，位于微机械检测结构的上方; 以及设置在第一主体和盖元件之间的粘合结构，在对应于微机械检测结构的位置中限定间隙。 通过与间隙流体连通的粘合结构限定至少一个第一开口。
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Patent Agency Ranking
公开(公告)号：US20180236447A1
公开(公告)日：2018-08-23
申请号：US15960509
申请日：2018-04-23
Inventor： Praveen Kumar Radhakrishnan , Dino Faralli
CPC classification number: B01L3/502715 , B01L3/502707 , B01L2300/0627 , B01L2300/0848 , B01L2300/12 , G01F1/6845 , G01F1/6888 , G01K7/02 , G01K7/021 , H01L35/32 , H01L35/325
Abstract: A microfluidic-based sensor, comprising: a semiconductor body, having a first and a second side opposite to one another in a direction; a buried channel, extending within the semiconductor body; a structural layer, of dielectric or insulating material, formed over the first side of the semiconductor body at least partially suspended above the buried channel; and a first thermocouple element, including a first strip, of a first electrical conductive material, and a second strip, of a second electrical conductive material different from the first electrical conductive material, electrically coupled to the first strip. The first thermocouple element is buried in the structural layer and partially extends over the buried channel at a first location. A corresponding manufacturing method is disclosed.
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公开(公告)号：US09849674B2
公开(公告)日：2017-12-26
申请号：US15179096
申请日：2016-06-10
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Mauro Cattaneo , Carlo Luigi Prelini , Lorenzo Colombo , Dino Faralli , Alessandra Sciutti , Lorenzo Tentori
CPC classification number: B41J2/1626 , B41J2/01 , B41J2/135 , B41J2/16 , B41J2/1607 , B41J2/161 , B41J2/162 , B41J2/1621 , B41J2/1628 , B41J2/1629 , B41J2/1631 , B41J2/1632 , Y10T29/49401
Abstract: A method for manufacturing a device for ejecting a fluid, including producing a nozzle plate including: forming a first nozzle cavity, having a first diameter, in a first semiconductor body; forming a hydrophilic layer at least in part in the first nozzle cavity; forming a structural layer on the hydrophilic layer; etching the structural layer to form a second nozzle cavity aligned to the first nozzle cavity in a fluid-ejection direction and having a second diameter larger than the first diameter; proceeding with etching of the structural layer for removing portions thereof in the first nozzle cavity, to reach the hydrophilic layer and arranged in fluid communication the first and second nozzle cavities; and coupling the nozzle plate with a chamber for containing the fluid.
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8.发明申请公开(公告)号：US20140159717A1
公开(公告)日：2014-06-12
申请号：US14102899
申请日：2013-12-11
Applicant: STMicroelectronics S.r.l.
Inventor： Dario Paci , Dino Faralli , Andrea Picco
CPC classification number: G01R33/09 , G01R33/0011 , G01R33/0052 , G01R33/096
Abstract: An integrated magnetoresistive sensor, formed in a chip including a substrate having a surface and an insulating region covering the surface of the substrate. A magnetoresistor, of a first ferromagnetic material, is formed in the insulating region and has a sensitivity plane parallel to the surface. A concentrator of a second ferromagnetic material is formed in the substrate and has at least one arm extending in a transverse direction to the sensitivity plane. The arm has one end in contact with the magnetoresistor.
Abstract translation: 一种集成磁阻传感器，其形成在包括具有覆盖基板的表面的表面和绝缘区域的基板的芯片中。 第一铁磁材料的磁阻电阻器形成在绝缘区域中并且具有平行于表面的灵敏度平面。 第二铁磁材料的集中器形成在基板中，并且具有至少一个在横向方向上延伸到灵敏度平面的臂。 臂的一端与磁电阻接触。
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公开(公告)号：US12058938B2
公开(公告)日：2024-08-06
申请号：US17722713
申请日：2022-04-18
Applicant: STMicroelectronics S.r.l.
Inventor： Maria Fortuna Bevilacqua , Flavio Francesco Villa , Rossana Scaldaferri , Valeria Casuscelli , Andrea Di Matteo , Dino Faralli
IPC: H10N30/30 , H02N2/18 , H10N30/01 , H10N30/03 , H10N30/06 , H10N30/082 , H10N30/853 , H10N30/87 , H10N30/88
CPC classification number: H10N30/308 , H02N2/186 , H10N30/01 , H10N30/03 , H10N30/06 , H10N30/082 , H10N30/304 , H10N30/8554 , H10N30/87 , H10N30/88
Abstract: A process for manufacturing a MEMS piezoelectric device includes: forming a membrane at a first surface of wafer of semiconductor material further having a second surface (the first and second surfaces being opposite along a vertical axis and extending parallel to a horizontal plane formed by first and second horizontal axes); forming a cavity within the wafer so that the membrane is suspended above the cavity; forming a piezoelectric material layer above a first surface of the membrane; forming an electrode arrangement in contact with the piezoelectric material layer; and forming a proof mass coupled to a second surface of the membrane opposite to the first surface along the vertical axis. The proof mass deforms the membrane in response to environmental mechanical vibrations. Forming the proof mass includes forming a connection element at a central position between the membrane and the proof mass in the direction of the vertical axis.
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公开(公告)号：US10682645B2
公开(公告)日：2020-06-16
申请号：US15960509
申请日：2018-04-23
Inventor： Praveen Kumar Radhakrishnan , Dino Faralli
Abstract: A microfluidic-based sensor, comprising: a semiconductor body, having a first and a second side opposite to one another in a direction; a buried channel, extending within the semiconductor body; a structural layer, of dielectric or insulating material, formed over the first side of the semiconductor body at least partially suspended above the buried channel; and a first thermocouple element, including a first strip, of a first electrical conductive material, and a second strip, of a second electrical conductive material different from the first electrical conductive material, electrically coupled to the first strip. The first thermocouple element is buried in the structural layer and partially extends over the buried channel at a first location. A corresponding manufacturing method is disclosed.
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