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公开(公告)号:US20240322012A1
公开(公告)日:2024-09-26
申请号:US18602274
申请日:2024-03-12
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Byeonghee Son , Myunggil Kang , Dongwon Kim , Jongsu Kim , Changwoo Noh , Beomjin Park
IPC: H01L29/66 , H01L29/06 , H01L29/423 , H01L29/775 , H01L29/786
CPC classification number: H01L29/66553 , H01L29/0673 , H01L29/42392 , H01L29/66439 , H01L29/775 , H01L29/78696
Abstract: A semiconductor device including an active region extending in a first horizontal direction, a nanosheet stack apart from the active region, a plurality of gate structures extending in a second horizontal direction and including a plurality of gate electrodes, a plurality of source/drain regions arranged on sidewalls of the gate structures, and a device isolation layer extending in a vertical direction, wherein the plurality of gate structures include a first gate structure in which a source/drain region is arranged on one sidewall and the device isolation layer is arranged on the other sidewall, and a second gate structure in which source/drain regions are arranged on both sidewalls, wherein the plurality of gate electrodes of the first gate structure include a main gate electrode positioned at the uppermost end and a plurality of sub-gate electrodes, and an internal spacer is between the device isolation layer and the plurality of sub-gate electrodes.
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公开(公告)号:US11257925B2
公开(公告)日:2022-02-22
申请号:US16836138
申请日:2020-03-31
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Changwoo Noh , Munhyeon Kim , Hansu Oh , Sungman Whang , Dongwon Kim
IPC: H01L29/66 , H01L29/78 , H01L29/786 , H01L29/423 , H01L29/165 , H01L21/311
Abstract: Semiconductor devices and methods of fabricating the same are provided. The method includes forming on a substrate an active pattern that protrudes from the substrate and extends in one direction; forming on the active pattern a sacrificial gate structure that extends in a direction intersecting the active pattern; forming on a side surface of the sacrificial gate structure a first spacer including a first portion at a lower level than a top surface of the active pattern and a second portion on the first portion, and reducing a thickness of the second portion of the first spacer.
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公开(公告)号:US20240405073A1
公开(公告)日:2024-12-05
申请号:US18538290
申请日:2023-12-13
Applicant: Samsung Electronics Co., Ltd.
Inventor: Hyumin Yoo , Myung Gil Kang , Dongwon Kim , Jongsu Kim , Changwoo Noh , Beomjin Park , Soojin Jeong , Woosuk Choi
IPC: H01L29/08 , H01L29/06 , H01L29/423 , H01L29/66 , H01L29/775
Abstract: A semiconductor device is provided including an active pattern disposed on a substrate, a source/drain pattern on the active pattern, a channel pattern configured to electrically connect the source/drain patterns and including stacked semiconductor patterns spaced apart from each other in a first direction perpendicular to an upper surface of the substrate, a gate pattern configured to cross between the source/drain patterns in a second direction parallel to the upper surface of the substrate, on the channel pattern, and to have a main gate portion and sub-gate portions, and inner gate spacers between the sub-gate portions and the source/drain pattern. A first distance between adjacent source/drain patterns along a given one of the sub-gate portions in the second direction is greater than a second distance between adjacent source/drain patterns passing through the semiconductor patterns in the second direction.
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公开(公告)号:US20190198636A1
公开(公告)日:2019-06-27
申请号:US16015852
申请日:2018-06-22
Applicant: Samsung Electronics Co., Ltd
Inventor: Changwoo Noh , Munhyeon Kim , Hansu Oh , Sungman Whang , Dongwon Kim
IPC: H01L29/66 , H01L29/78 , H01L21/311
CPC classification number: H01L29/6656 , H01L21/31144 , H01L29/66545 , H01L29/66795 , H01L29/7851
Abstract: Semiconductor devices and methods of fabricating the same are provided. The method includes forming on a substrate an active pattern that protrudes from the substrate and extends in one direction; forming on the active pattern a sacrificial gate structure that extends in a direction intersecting the active pattern; forming on a side surface of the sacrificial gate structure a first spacer including a first portion at a lower level than a top surface of the active pattern and a second portion on the first portion, and reducing a thickness of the second portion of the first spacer.
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