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公开(公告)号：US11764087B2
公开(公告)日：2023-09-19
申请号：US16898965
申请日：2020-06-11
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Chaemook Lim , Yeongrack Son , Ohhyuk Kwon , Dongouk Kim , Youngbum Kim , Woohee Kim , Dongjoon Lee , Kwanghyeon Jeong
IPC: H01L21/67 , H01L21/263 , H01L21/02
CPC classification number: H01L21/67248 , H01L21/02255 , H01L21/2636
Abstract: A process apparatus includes a heating module and a supporter disposed below the heating module. A process space is provided between the heating module and the supporter. The heating module includes a housing, at least one heating lamp disposed in the housing, at least one temperature sensor disposed in the housing, and a blocking plate disposed under the housing. The blocking plate spatially separates the at least one heating lamp from the process space, and the blocking plate includes at least one window spatially connecting the at least one temperature sensor to the process space.
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公开(公告)号：US10718891B2
公开(公告)日：2020-07-21
申请号：US15870291
申请日：2018-01-12
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Sunghoon Lee , Joonyong Park , Dongouk Kim , Jihyun Bae , Bongsu Shin , Dongsik Shim , Jaeseung Chung
Abstract: An input coupler includes: a plurality of semi-reflectors located along an optical path along which a light incident from a light source travels, each of the plurality of semi-reflectors comprising a reflective surface that is inclined with respect to the optical path and configured to reflect a first portion of the light and transmit a second portion of the light; and a plurality of optical path changing members configured to change an optical path of the light transmitted through the plurality of semi-reflectors, wherein the plurality of semi-reflectors and the plurality of optical path changing members are arranged such that the light passing through at least one of the plurality of semi-reflectors and emitted in one direction has a linear beam distribution.
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公开(公告)号：US10007124B2
公开(公告)日：2018-06-26
申请号：US14838507
申请日：2015-08-28
Applicant: Samsung Electronics Co., Ltd.
Inventor： Joonyong Park , Dongouk Kim , Jihyun Bae , Bongsu Shin , Jong G. Ok , Ilsun Yoon , Sunghoon Lee , Jaeseung Chung , Sukgyu Hahm
IPC: H01L21/311 , H01L21/3065 , G02B27/62 , G02B5/30 , G02F1/1333
CPC classification number: G02B27/62 , G02B5/3058 , G02F1/13336 , G02F2001/133548 , H01L23/544 , H01L2223/54426
Abstract: A master wafer includes: a plurality of unit wafers each including a pattern disposed thereon; a coupling surface defined on each of the unit wafers; and a coupling part which couples adjacent unit wafers among the plurality of unit wafers on which the coupling surface is defined, to each other.
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公开(公告)号：US20160023400A1
公开(公告)日：2016-01-28
申请号：US14733172
申请日：2015-06-08
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jaeseung Chung , Dongouk Kim , Joonyong Park , Jihyun Bae , Bongsu Shin , Jong G. Ok , Ilsun Yoon , Sunghoon Lee , Sukgyu Hahm
IPC: B29C59/16
CPC classification number: G03F7/0002
Abstract: A method of transferring a reverse pattern using an imprint process includes: preparing a master mold, where a first pattern is defined on a surface of the master mold; coating an imprint resin on the master mold to cover the first pattern; pressing the imprint resin toward the master mold using a stamp member; curing the imprint resin to form a second pattern between the master mold and the stamp member, where the second pattern has a reverse shape to a shape of the first pattern; detaching the stamp member from the master mold to separate the second pattern from the master mold; and transferring the second pattern onto a transfer substrate.
Abstract translation: 使用压印处理传送反向图案的方法包括：准备主模具，其中第一图案被限定在主模具的表面上; 在母模上涂覆压印树脂以覆盖第一图案; 使用印模部件将压印树脂压向母模; 固化压印树脂以在主模和印模构件之间形成第二图案，其中第二图案具有与第一图案的形状相反的形状; 将印模部件从主模上拆下，将第二图案与主模分离; 并将第二图案转印到转印衬底上。
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5.发明申请公开(公告)号：US20150323721A1
公开(公告)日：2015-11-12
申请号：US14541652
申请日：2014-11-14
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jaeseung Chung , Dongouk Kim , Joonyong Park , Jihyun Bae , Bongsu Shin , Sunghoon Lee , Sukgyu Hahm
IPC: G02B5/30 , G02F1/1335
CPC classification number: G02B5/3058 , G02F1/133528 , G02F2001/133548
Abstract: A wire grid polarizer includes a substrate, a first layer and a second layer disposed on the first layer, in which a first region and a second region are defined in the first layer, the first layer includes: a first wire grid including a plurality of first wires and disposed in the first region, where the first wires are spaced apart from each other, and no wire grid is disposed in the second region; and a first protection layer which covers the first wire grid, a third region and a fourth region are defined in the second layer, and the second layer includes a second wire grid including a plurality of second wires and disposed in the third region, where the second wires are spaced apart from each other, and no wire grid is disposed in the fourth region.
Abstract translation: 线栅偏振器包括基板，设置在第一层上的第一层和第二层，其中在第一层中限定第一区域和第二区域，第一层包括：第一线栅，包括多个 第一电线并且设置在第一区域中，其中第一电线彼此间隔开，并且在第二区域中不设置线栅; 并且覆盖第一线栅的第一保护层，第三区域和第四区域被限定在第二层中，并且第二层包括包括多个第二线并且设置在第三区域中的第二线栅格， 第二线彼此间隔开，并且在第四区域中不设置线栅。
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Patent Agency Ranking
公开(公告)号：US10928573B2
公开(公告)日：2021-02-23
申请号：US16858129
申请日：2020-04-24
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Sunghoon Lee , Joonyong Park , Dongouk Kim , Jihyun Bae , Bongsu Shin , Dongsik Shim , Jaeseung Chung
IPC: G02B5/30 , G03F7/00 , B28D5/02 , G02F1/1335
Abstract: A method for manufacturing a pattern structure includes preparing a wafer that has a plurality of fine patterns, generating a first trench by processing the wafer from a first surface to a first depth, and generating a second trench connected to the first trench by processing the wafer from a second surface which is opposite to the first surface to a second depth, thereby cutting the wafer.
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公开(公告)号：US10754171B2
公开(公告)日：2020-08-25
申请号：US15655327
申请日：2017-07-20
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jihyun Bae , Joonyong Park , Youngju Jeong , Bongsu Shin , Dongouk Kim , Dongsik Shim , Sunghoon Lee , Jaeseung Chung
Abstract: A method of correcting optical characteristics of a back light unit (BLU) for a three-dimensional (3D) display apparatus includes: obtaining first optical characteristics of a reference image; obtaining a corrected image by applying an initial correction value, which is determined based on the first optical characteristics, to the reference image; obtaining second optical characteristics of the corrected image; determining whether the second optical characteristics match reference optical characteristics; outputting the corrected image based on determining that the second optical characteristics match the reference optical characteristics, and obtaining a new corrected image and repeating, for the new corrected image, the obtaining the second optical characteristics and the determining whether the second optical characteristics match the reference optical characteristics, based on determining that the second optical characteristics of the corrected image do not match the reference optical characteristics.
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公开(公告)号：US10191198B2
公开(公告)日：2019-01-29
申请号：US15351950
申请日：2016-11-15
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Seogwoo Hong , Dongsik Shim , Dongouk Kim , Hyunjoon Kim , Joonyong Park , Jihyun Bae , Bongsu Shin , Sunghoon Lee , Jaeseung Chung
Abstract: A display apparatus including a directional backlight unit and a method of assembling the display apparatus are disclosed. The display apparatus includes an auxiliary structure coupled to an input coupler and a switch panel module.
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公开(公告)号：US10185218B2
公开(公告)日：2019-01-22
申请号：US14733172
申请日：2015-06-08
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jaeseung Chung , Dongouk Kim , Joonyong Park , Jihyun Bae , Bongsu Shin , Jong G. Ok , Ilsun Yoon , Sunghoon Lee , Sukgyu Hahm
IPC: G03F7/00
Abstract: A method of transferring a reverse pattern using an imprint process includes: preparing a master mold, where a first pattern is defined on a surface of the master mold; coating an imprint resin on the master mold to cover the first pattern; pressing the imprint resin toward the master mold using a stamp member; curing the imprint resin to form a second pattern between the master mold and the stamp member, where the second pattern has a reverse shape to a shape of the first pattern; detaching the stamp member from the master mold to separate the second pattern from the master mold; and transferring the second pattern onto a transfer substrate.
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公开(公告)号：US09759856B2
公开(公告)日：2017-09-12
申请号：US15154343
申请日：2016-05-13
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Taesung Jung , Dongouk Kim , Joonyong Park , Jihyun Bae , Bongsu Shin , Sunghoon Lee , Jaeseung Chung , Alexander V. Morozov
CPC classification number: G02B6/0068 , G02B6/0036 , G02B6/0058 , G02B6/0065 , G02B27/2214
Abstract: A curved backlight unit is provided. The backlight unit includes a curved light guide plate having a curvature, a first light source configured to provide a first illumination light to a first surface of the curved light guide plate, an array of a plurality of different grating elements disposed on a second surface of the curved light guide plate and configured to allow the first illumination light to exit the curved light guide plate from the second surface, and a second light source configured to provide a second illumination light to a third surface facing the second surface of the curved light guide plate. The curved light guide plate includes a first area configured to allow the second illumination light to exist at a first intensity and a second area configured to allow the second illumination light to exist at a second intensity that is less than the first intensity.
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