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公开(公告)号:US20180285104A1
公开(公告)日:2018-10-04
申请号:US15717989
申请日:2017-09-28
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Hyun Pil KIM , Hyun Woo SIM , Seong Woo AHN
CPC classification number: G06F9/3001 , G06F1/3287 , G06F9/30101
Abstract: A semiconductor device including a first processor having a first register, the first processor configured to perform region of interest (ROI) calculations using the first register; and a second processor having a second register, the second processor configured to perform arithmetic calculations using the second register. The first register is shared with the second processor, and the second register is shared with the first processor.
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公开(公告)号:US20210216312A1
公开(公告)日:2021-07-15
申请号:US17216323
申请日:2021-03-29
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Hyun Pil KIM , Hyun Woo SIM , Seong Woo AHN
IPC: G06F9/30 , G06F1/3287 , G06T1/20
Abstract: A semiconductor device including a first processor having a first register, the first processor configured to perform region of interest (ROI) calculations using the first register; and a second processor having a second register, the second processor configured to perform arithmetic calculations using the second register. The first register is shared with the second processor, and the second register is shared with the first processor.
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公开(公告)号:US20190018672A9
公开(公告)日:2019-01-17
申请号:US15717989
申请日:2017-09-28
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Hyun Pil KIM , Hyun Woo SIM , Seong Woo AHN
Abstract: A semiconductor device including a first processor having a first register, the first processor configured to perform region of interest (ROI) calculations using the first register; and a second processor having a second register, the second processor configured to perform arithmetic calculations using the second register. The first register is shared with the second processor, and the second register is shared with the first processor.
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公开(公告)号:US20170149942A1
公开(公告)日:2017-05-25
申请号:US15357368
申请日:2016-11-21
Applicant: Samsung Electronics Co., Ltd.
Inventor: Gi Hoon LEE , Hyun Woo SIM
CPC classification number: H04M1/03 , H04B1/3888 , H04M1/026 , H04M1/0277 , H04R1/023 , H04R1/086 , H04R2499/11
Abstract: An electronic device and a method of manufacturing the electronic device is provided. The electronic device includes a housing, a structure that is formed on a surface of the housing and comprises a first pattern having a first at least one through-hole, a first speaker that is arranged in an interior of the housing to be adjacent to a first portion of the first pattern and is configured to output a sound, and a first microphone that is arranged in the interior of the housing to be adjacent to a second portion of the first pattern and is configured to receive a sound.
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公开(公告)号:US20170083479A1
公开(公告)日:2017-03-23
申请号:US15272994
申请日:2016-09-22
Applicant: Samsung Electronics Co., Ltd.
Inventor: Seong Woo AHN , Hyung Jong KIM , Hyun Woo SIM , Hun Kee KIM
IPC: G06F17/14
CPC classification number: H04L27/00 , G06F7/00 , G06F7/49957 , H04L27/0002
Abstract: A digital signal processor is provided. The digital signal processor includes an execution circuit configured to receive a first data including first bits expressed in a signed magnitude method and a second data including second bits expressed in the signed magnitude method, and a control logic circuit configured to output a control signal that determines a type of operation on the first data and the second data based on a command signal, wherein the execution circuit is further configured to perform an operation on the first data and the second data according to a determined type of operation and generate a result of the operation.
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公开(公告)号:US20230236832A1
公开(公告)日:2023-07-27
申请号:US18129119
申请日:2023-03-31
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Hyun Pil KIM , Hyun Woo SIM , Seong Woo AHN
IPC: G06F9/30 , G06F1/3287 , G06T1/20
CPC classification number: G06F9/3001 , G06F1/3287 , G06F9/30101 , G06T1/20
Abstract: A semiconductor device including a first processor having a first register, the first processor configured to perform region of interest (ROI) calculations using the first register; and a second processor having a second register, the second processor configured to perform arithmetic calculations using the second register. The first register is shared with the second processor, and the second register is shared with the first processor.
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公开(公告)号:US20190303149A1
公开(公告)日:2019-10-03
申请号:US16447041
申请日:2019-06-20
Applicant: Samsung Electronics Co., Ltd.
Inventor: Hyun Pil KIM , Hyun Woo SIM , Seong Woo AHN
Abstract: A sequence alignment method that may be performed by a vector processor is may include loading a sequence that is an instance of vector data including a plurality of elements, dividing the sequence into two groups, aligning respective elements of the groups to generate a sequence of sorted elements according to a single instruction multiple data mode, and iteratively performing an alignment operation based on a determination that each group in the sequence of sorted elements includes more than one element of the plurality of elements. Each iteration may include dividing each group to form new groups and aligning respective elements of each pair of adjacent new groups to generate a new sequence of sorted elements. The new sequence of a current iteration of the alignment operation may be transmitted as a data output, based on a determination that each new group does not include more than one element.
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公开(公告)号:US20180341487A1
公开(公告)日:2018-11-29
申请号:US15802844
申请日:2017-11-03
Applicant: Samsung Electronics Co., Ltd.
Inventor: Hyun Pil KIM , Hyun Woo SIM , Seong Woo AHN
CPC classification number: G06F9/30036 , G06F9/3001 , G06F9/30021 , G06F9/30032 , G06F9/3816 , G06F9/3887
Abstract: A sequence alignment method that may be performed by a vector processor is may include loading a sequence that is an instance of vector data including a plurality of elements, dividing the sequence into two groups, aligning respective elements of the groups to generate a sequence of sorted elements according to a single instruction multiple data mode, and iteratively performing an alignment operation based on a determination that each group in the sequence of sorted elements includes more than one element of the plurality of elements. Each iteration may include dividing each group to form new groups and aligning respective elements of each pair of adjacent new groups to generate a new sequence of sorted elements. The new sequence of a current iteration of the alignment operation may be transmitted as a data output, based on a determination that each new group does not include more than one element.
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公开(公告)号:US20180300128A1
公开(公告)日:2018-10-18
申请号:US15905979
申请日:2018-02-27
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Hyun Pil KIM , Hyun Woo SIM , Seong Woo AHN
CPC classification number: G06F9/3001 , G06F1/3287 , G06F9/30101 , G06T1/20
Abstract: A semiconductor device including a first processor having a first register, the first processor configured to perform region of interest (ROI) calculations using the first register; and a second processor having a second register, the second processor configured to perform arithmetic calculations using the second register. The first register is shared with the second processor, and the second register is shared with the first processor.
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公开(公告)号:US20170048990A1
公开(公告)日:2017-02-16
申请号:US15233489
申请日:2016-08-10
Applicant: Samsung Electronics Co., Ltd.
Inventor: Hyun Woo SIM , Yong Hwa KIM
CPC classification number: H05K1/147 , G06F1/1626 , G06F1/1637 , G06F1/1656 , H04M1/026 , H04M1/0274 , H05K2201/056 , H05K2201/09063 , H05K2201/10121 , H05K2201/10128 , H05K2203/0228
Abstract: An electronic device is provided. The electronic device includes a display substrate and a connector connected to one side of the display substrate and having a dummy pattern. A cutting part is formed in the display substrate and the connector, and the cutting part is formed adjacent to the dummy pattern.
Abstract translation: 提供电子设备。 电子装置包括显示基板和连接到显示基板的一侧并具有虚拟图案的连接器。 在显示基板和连接器中形成切割部分,并且切割部分与伪图形相邻地形成。
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