公开(公告)号：US20150364432A1

公开(公告)日：2015-12-17

申请号：US14702662

申请日：2015-05-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyun-soo CHUNG ,  Tae-je CHO ,  Jung-seok AHN ,  In-young LEE

IPC: H01L23/00 ,  H01L23/29 ,  H01L23/48 ,  H01L21/78 ,  H01L21/304 ,  H01L23/31 ,  H01L25/00 ,  H01L21/56 ,  H01L25/065 ,  H01L21/768 ,  H01L21/48 ,  H01L23/495 ,  H01L21/683

CPC classification number: H01L23/562 ,  H01L21/304 ,  H01L21/4803 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/76898 ,  H01L21/78 ,  H01L23/3114 ,  H01L23/481 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/97 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012

Abstract: Embodiments of the inventive aspect include a method of manufacturing a semiconductor package including a plurality of stacked semiconductor chips in which edges of a semiconductor wafer substrate may be prevented from being damaged or cracked when the semiconductor package is manufactured at a wafer level, while a diameter of a molding element is greater than a diameter of the semiconductor wafer substrate. The molding element may cover a surface of the wafer substrate and the plurality of stacked semiconductor chips. Embodiments may include a wafer level semiconductor package including a circular substrate having a first diameter, a circular passivation layer attached to the circular substrate, the passivation layer having the first diameter, and a circular molding element covering surfaces of the plurality of semiconductor chips, and covering an active area of the substrate. The circular molding element may have a second diameter that is greater than the first diameter.

Abstract translation: 本发明的实施例包括一种制造半导体封装的方法，该半导体封装包括多个层叠半导体芯片，其中半导体封装在晶片级制造时可以防止半导体晶片衬底的边缘损坏或破裂，而直径 的模制元件大于半导体晶片衬底的直径。 成型元件可以覆盖晶片基板的表面和多个堆叠的半导体芯片。 实施例可以包括晶片级半导体封装，其包括具有第一直径的圆形衬底，附着到圆形衬底的圆形钝化层，具有第一直径的钝化层和覆盖多个半导体芯片的表面的圆形模制元件，以及 覆盖基板的有效区域。 圆形模制元件可以具有大于第一直径的第二直径。

公开(公告)号：US20150295302A1

公开(公告)日：2015-10-15

申请号：US14518064

申请日：2014-10-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： In-young LEE ,  Hwan-myung NOH ,  Byung-gil JEON

IPC: H01Q1/22 ,  G06K19/077 ,  H01Q7/00

CPC classification number: H01Q1/2266 ,  G06F1/1698 ,  G06K7/10336 ,  H01Q7/00

Abstract: An electronic device with an antenna, e.g., for near field communication (NFC) is disclosed. The electronic device includes a display, a fixing frame fixing the display and including a bezel area at a periphery of the display, and a communication module disposed at the bezel area. The communication module includes a circuit board, which has an antenna radiator and a communication circuit disposed thereon. The communication module performs wireless communication with an external apparatus via the communication circuit and antenna radiator.

Abstract translation: 公开了一种具有天线的电子设备，例如用于近场通信（NFC）。 电子设备包括显示器，固定显示器的固定框架，并且在显示器的周围包括边框区域，以及布置在边框区域的通信模块。 通信模块包括具有天线辐射器和设置在其上的通信电路的电路板。 通信模块经由通信电路和天线辐射器与外部设备进行无线通信。

公开(公告)号：US20150223691A1

公开(公告)日：2015-08-13

申请号：US14618290

申请日：2015-02-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Byung-hun CHOI ,  Do-yoon KIM ,  In-young LEE ,  Jae-geol CHO

IPC: A61B5/00

CPC classification number: A61B5/0015 ,  A61B5/0006 ,  A61B5/0008 ,  G06F19/3418

Abstract: A peripheral device for providing a health information message to a host device includes a health data obtainer configured to obtain health data; a message generator configured to determine a type of the health data, a private message identification (ID) corresponding to the type of the health data, and an ID of the peripheral device, and generate the health information message to include the private message ID, the ID of the peripheral device, and the health data; and a message provider configured to transmit the health information message to the host device, the private message ID being configured to be interpreted differently according to the ID of the peripheral device.

Abstract translation: 用于向主机设备提供健康信息消息的外围设备包括被配置为获得健康数据的健康数据获取器; 消息生成器，被配置为确定健康数据的类型，对应于健康数据的类型的私人消息标识（ID）和外围设备的ID，并且生成健康信息消息以包括私人消息ID， 外围设备的ID和健康数据; 以及消息提供器，被配置为将所述健康信息消息发送到所述主机设备，所述专用消息ID被配置为根据所述外围设备的ID被不同地解释。

公开(公告)号：US20140218250A1

公开(公告)日：2014-08-07

申请号：US14083920

申请日：2013-11-19

Applicant: Samsung Electronics Co., Ltd

Inventor： Tae-young KIM ,  Chee-hwan YANG ,  In-young LEE ,  Sang-hoon CHOI

IPC: H01Q13/10

CPC classification number: H01Q13/106 ,  H01Q1/243 ,  H01Q5/364 ,  H01Q13/10

Abstract: An electronic apparatus includes a metallic case including an antenna pattern formed on an area of the metallic case where two sides surfaces of the case meet, the antenna pattern forming a slit antenna including a slit connecting one side of the antenna pattern to an open area of the metallic case, and a circuit board configured to process signals received at the antenna pattern.

Abstract translation: 一种电子设备，包括：金属壳体，包括形成在金属壳体的与壳体的两个侧面相交的区域上的天线图案，天线图案形成狭缝天线，其包括将天线图案的一侧连接到开口区域的狭缝 金属外壳和配置成处理以天线图案接收的信号的电路板。

公开(公告)号：US20140132468A1

公开(公告)日：2014-05-15

申请号：US13928524

申请日：2013-06-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Tae-young KIM ,  Chee-hwan YANG ,  In-young LEE ,  Sang-hoon CHOI

IPC: H01Q9/28

CPC classification number: H01Q9/285 ,  H01Q1/2266 ,  H01Q1/48 ,  H01Q5/371 ,  H01Q9/26

Abstract: A dipole antenna module and an electronic apparatus include an antenna element, a power feeder formed at an end of the antenna element and connected to a circuit board to process an antenna signal through a cable, and a ground part to ground a ground of the cable such that the ground part keeps a preset gap from the antenna element and is grounded to a conductor of the circuit board.

Abstract translation: 偶极天线模块和电子设备包括天线元件，形成在天线元件的端部并且连接到电路板以通过电缆处理天线信号的电力馈送器，以及用于将电缆的接地接地的接地部分 使得接地部分保持与天线元件的预设间隙并且接地到电路板的导体。