公开(公告)号：US20150115452A1

公开(公告)日：2015-04-30

申请号：US14311708

申请日：2014-06-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jeong-Won YOON ,  Baik-woo LEE ,  Seong-woon BOOH ,  Chang-mo JEONG

IPC: H01L23/00 ,  B23K1/00

CPC classification number: H01L24/29 ,  B23K1/0016 ,  B23K20/023 ,  B23K20/16 ,  B23K20/233 ,  B23K35/0244 ,  B23K35/025 ,  B23K2101/42 ,  H01L24/32 ,  H01L24/33 ,  H01L24/83 ,  H01L24/95 ,  H01L24/97 ,  H01L2224/04026 ,  H01L2224/05568 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/2732 ,  H01L2224/29083 ,  H01L2224/29139 ,  H01L2224/293 ,  H01L2224/29339 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/32503 ,  H01L2224/32507 ,  H01L2224/33181 ,  H01L2224/83091 ,  H01L2224/83097 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/8382 ,  H01L2224/83825 ,  H01L2224/8383 ,  H01L2224/8384 ,  H01L2224/83905 ,  H01L2224/97 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15787 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2224/83

Abstract: Semiconductor device packages and methods of manufacturing the semiconductor device packages are provided. A semiconductor device package may include a bonding layer between a substrate and a semiconductor chip, and the bonding layer may include an intermetallic compound. The intermetallic compound may be a compound of metal and solder material. The intermetallic compound may include Ag3Sn. A method of manufacturing the semiconductor device package may include forming a bonding layer, which bonds a semiconductor chip to a substrate, by using a mixed paste including metal particles and a solder material. The bonding layer may be formed by forming an intermetallic compound, which is formed by heating the mixed paste to react the metal particles with the solder material.

Abstract translation: 提供半导体器件封装和制造半导体器件封装的方法。 半导体器件封装可以包括在衬底和半导体芯片之间的结合层，并且结合层可以包括金属间化合物。 金属间化合物可以是金属和焊料材料的化合物。 金属间化合物可以包括Ag 3 Sn。 制造半导体器件封装的方法可以包括通过使用包括金属颗粒和焊料材料的混合膏形成将半导体芯片与基板结合的接合层。 接合层可以通过形成金属间化合物而形成，该金属间化合物是通过加热混合的糊料使金属颗粒与焊料材料反应形成的。