公开(公告)号：US20230408574A1

公开(公告)日：2023-12-21

申请号：US18240957

申请日：2023-08-31

Applicant: Samsung Electronics Co., Ltd.

Inventor： Meehyun Lim ,  Sungyeol Kim ,  Hyungjung Yong ,  Jinyeong Yun

IPC: G01R31/28 ,  H01L25/065 ,  H01L23/00

CPC classification number: G01R31/2803 ,  H01L25/0657 ,  H01L24/14 ,  G01R31/2815

Abstract: A test method for a semiconductor device includes determining a contact failure between a first semiconductor chip and a second semiconductor chip during assembly of a semiconductor package including the first semiconductor chip and the second semiconductor chip, using a test circuit embedded in the first semiconductor chip, and after the assembly of the semiconductor package, determining whether the semiconductor package is defective by using the test circuit.

公开(公告)号：US20230194591A1

公开(公告)日：2023-06-22

申请号：US17975202

申请日：2022-10-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jinyeong Yun ,  Meehyun Lim ,  Sungjin Kim ,  Masahiko Yamabe ,  Sungyeol Kim ,  Sungyong Lim ,  Sunghwi Cho

IPC: G01R29/12 ,  H01L21/687 ,  H01L21/683 ,  H01L21/66

CPC classification number: G01R29/12 ,  H01L21/6833 ,  H01L21/68742 ,  H01L22/12

Abstract: An electric field measuring apparatus includes an electrostatic chuck with a through hole and holding a wafer, a lift pin picking up the wafer, a driver vertically moving the lift pin along the through hole, a probe in the lift pin and having a refractive index changed by an electric field of the wafer, the probe including an electro-optical crystal, an optical waveguide forming at least one internal path of light having a polarization characteristic changed by the changed refractive index between the probe and the wafer, and a control module controlling the lift pin and the driver. The lift pin moves to first and second positions. The control module calculates a strength of the electric field of the wafer, using electric field data measured using the probe at each of the first and second positions.

公开(公告)号：US20250004028A1

公开(公告)日：2025-01-02

申请号：US18884376

申请日：2024-09-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jinyeong Yun ,  Meehyun Lim ,  Sungjin Kim ,  Masahiko Yamabe ,  Sungyeol Kim ,  Sungyong Lim ,  Sunghwi Cho

IPC: G01R29/12 ,  H01L21/66 ,  H01L21/683 ,  H01L21/687

Abstract: An electric field measuring apparatus includes an electrostatic chuck with a through hole and holding a wafer, a lift pin picking up the wafer, a driver vertically moving the lift pin along the through hole, a probe in the lift pin and having a refractive index changed by an electric field of the wafer, the probe including an electro-optical crystal, an optical waveguide forming at least one internal path of light having a polarization characteristic changed by the changed refractive index between the probe and the wafer, and a control module controlling the lift pin and the driver. The lift pin moves to first and second positions. The control module calculates a strength of the electric field of the wafer, using electric field data measured using the probe at each of the first and second positions.

公开(公告)号：US20240055243A1

公开(公告)日：2024-02-15

申请号：US18124954

申请日：2023-03-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Taekjin Kim ,  Meehyun Lim ,  Sungyeol Kim ,  Junbum Park ,  Sungyoung Yoon ,  Jinyeong Yun ,  Jungchul Lee ,  Sungyong Lim ,  Sunghwi Cho

IPC: H01J37/32 ,  H01L21/67 ,  H01L21/683

CPC classification number: H01J37/32972 ,  H01L21/67253 ,  H01L21/67069 ,  H01L21/6833 ,  H01J2237/24495

Abstract: A semiconductor equipment monitoring apparatus including a wafer-type sensor inside a process chamber and configured to sense a plasma state inside the process chamber; a light detector and analyzer configured to detect and analyze light sensed by the wafer-type sensor; and a light coupler between the wafer-type sensor and the light detector and analyzer and configured to transmit the light sensed by the wafer-type sensor to the light detector and analyzer. The wafer-type sensor includes a plurality of sensors each comprising a passive element.

公开(公告)号：US12235287B2

公开(公告)日：2025-02-25

申请号：US17930819

申请日：2022-09-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Daesung Jung ,  Myeongock Ko ,  Meehyun Lim

IPC: G01R1/07 ,  G01R1/04 ,  G01R1/067 ,  G01R1/073 ,  G01R31/20 ,  G01R31/28 ,  G02B27/28 ,  H01L21/683

Abstract: A substrate processing apparatus includes: a chamber configured to perform a wet process and having an internal space, a chuck in the internal spaced and being configured for loading a semiconductor substrate thereon, a probe having an end above the chuck and including an electro-optical crystal and a reflective mirror on one surface of the electro-optical crystal, a measuring unit connected to the probe and configured to provide reference light to the probe, and to detect a polarization component of reflected light reflected from the one end of the probe by the reference light, and a controller configured to calculate an amount of electrostatic charge on a surface of the semiconductor substrate from the polarization component.

公开(公告)号：US20230168278A1

公开(公告)日：2023-06-01

申请号：US17930819

申请日：2022-09-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Daesung Jung ,  Myeongock Ko ,  Meehyun Lim

IPC: G01R1/07 ,  H01L21/683 ,  G02B27/28

CPC classification number: G01R1/071 ,  H01L21/6833 ,  G02B27/283

Abstract: A substrate processing apparatus includes: a chamber configured to perform a wet process and having an internal space, a chuck in the internal spaced and being configured for loading a semiconductor substrate thereon, a probe having an end above the chuck and including an electro-optical crystal and a reflective mirror on one surface of the electro-optical crystal, a measuring unit connected to the probe and configured to provide reference light to the probe, and to detect a polarization component of reflected light reflected from the one end of the probe by the reference light, and a controller configured to calculate an amount of electrostatic charge on a surface of the semiconductor substrate from the polarization component.

公开(公告)号：US12170233B2

公开(公告)日：2024-12-17

申请号：US17394471

申请日：2021-08-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Meehyun Lim ,  Sung-Yeol Kim ,  Sunghyup Kim ,  Hyung-Jung Yong ,  Hosun Yoo

IPC: H01J1/00 ,  G01N21/25 ,  G01N21/27 ,  G01N21/3504 ,  G01N21/3586 ,  H01J37/32 ,  H01L21/66 ,  H01L21/683

Abstract: A plasma treatment apparatus includes a light generator that generates light, a chamber that receives the light generated from the light generator, an optical element provided between the light generator and the chamber, a light detector that detects the light reflected in the chamber, and a controller connected to the light generator and the light detector. The chamber includes an electrostatic chuck provided in a lower portion of the chamber, an edge ring provided around the electrostatic chuck, an outer wall for sealing an inner space of the chamber, and a gas supply that injects a process gas into the chamber. The optical element branches the generated light to irradiate branched light to different regions of the chamber.

公开(公告)号：US12105132B2

公开(公告)日：2024-10-01

申请号：US17975202

申请日：2022-10-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jinyeong Yun ,  Meehyun Lim ,  Sungjin Kim ,  Masahiko Yamabe ,  Sungyeol Kim ,  Sungyong Lim ,  Sunghwi Cho

IPC: G01R29/12 ,  H01L21/66 ,  H01L21/683 ,  H01L21/687

CPC classification number: G01R29/12 ,  H01L21/6833 ,  H01L21/68742 ,  H01L22/12

Abstract: An electric field measuring apparatus includes an electrostatic chuck with a through hole and holding a wafer, a lift pin picking up the wafer, a driver vertically moving the lift pin along the through hole, a probe in the lift pin and having a refractive index changed by an electric field of the wafer, the probe including an electro-optical crystal, an optical waveguide forming at least one internal path of light having a polarization characteristic changed by the changed refractive index between the probe and the wafer, and a control module controlling the lift pin and the driver. The lift pin moves to first and second positions. The control module calculates a strength of the electric field of the wafer, using electric field data measured using the probe at each of the first and second positions.

公开(公告)号：US11782085B2

公开(公告)日：2023-10-10

申请号：US16924971

申请日：2020-07-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Meehyun Lim ,  Sungyeol Kim ,  Hyungjung Yong ,  Jinyeong Yun

IPC: G01R31/28 ,  H01L23/00 ,  H01L25/065

CPC classification number: G01R31/2803 ,  G01R31/2815 ,  H01L24/14 ,  H01L25/0657

Abstract: A test method for a semiconductor device includes determining a contact failure between a first semiconductor chip and a second semiconductor chip during assembly of a semiconductor package including the first semiconductor chip and the second semiconductor chip, using a test circuit embedded in the first semiconductor chip, and after the assembly of the semiconductor package, determining whether the semiconductor package is defective by using the test circuit.

公开(公告)号：US20210156904A1

公开(公告)日：2021-05-27

申请号：US16924971

申请日：2020-07-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Meehyun Lim ,  Sungyeol Kim ,  Hyungjung Yong ,  Jinyeong Yun

IPC: G01R31/28 ,  H01L23/00 ,  H01L25/065

Abstract: A test method for a semiconductor device includes determining a contact failure between a first semiconductor chip and a second semiconductor chip during assembly of a semiconductor package including the first semiconductor chip and the second semiconductor chip, using a test circuit embedded in the first semiconductor chip, and after the assembly of the semiconductor package, determining whether the semiconductor package is defective by using the test circuit.