MEASURING APPARATUS FOR VACUUM CHAMBER AND MEASURING SYSTEM INCLUDING THE SAME

    公开(公告)号:US20200333716A1

    公开(公告)日:2020-10-22

    申请号:US16655973

    申请日:2019-10-17

    Abstract: A measuring apparatus for a vacuum chamber capable of accurately measuring physical properties or quantities in the vacuum chamber in an exposure process in real time, and a measuring system including the measuring apparatus are described herein. The measuring apparatus includes: a body having a shape of an exposure mask used in an exposure process; and a measuring element in an interior of the body or on a first surface of the body. When the measuring apparatus is positioned in a vacuum chamber during the exposure process, the measuring apparatus is configured to measure physical properties in the vacuum chamber using the measuring element. The body or the measuring element is configured to withstand a vacuum in the vacuum chamber including resisting or preventing physical deformation of the body or the measuring element due to the vacuum.

    Semiconductor substrate treatment system

    公开(公告)号:US11908713B2

    公开(公告)日:2024-02-20

    申请号:US16926956

    申请日:2020-07-13

    CPC classification number: H01L21/67184 H01L21/67196 H01L21/67742

    Abstract: A semiconductor substrate treatment system includes: a chamber having an internal space defined by a first surface and a second surface of the chamber opposing each other, and a third surface of the chamber connected the first surface and the second surface; a transfer device in a central region of the internal space for transferring a semiconductor substrate; an ionizing device including first and second discharge devices on the second surface for emitting ions having a first polarity and a second polarity, respectively, to charge particles in the internal space with the first and second polarities, and a third discharge device disposed above the transfer device, and configured to emit ions having the first and second polarities together; and first and second dust collecting assemblies on the third surface, facing each other, and configured to collect charged particles by generating electric fields having different polarities.

    Substrate processing apparatus
    3.
    发明授权

    公开(公告)号:US12235287B2

    公开(公告)日:2025-02-25

    申请号:US17930819

    申请日:2022-09-09

    Abstract: A substrate processing apparatus includes: a chamber configured to perform a wet process and having an internal space, a chuck in the internal spaced and being configured for loading a semiconductor substrate thereon, a probe having an end above the chuck and including an electro-optical crystal and a reflective mirror on one surface of the electro-optical crystal, a measuring unit connected to the probe and configured to provide reference light to the probe, and to detect a polarization component of reflected light reflected from the one end of the probe by the reference light, and a controller configured to calculate an amount of electrostatic charge on a surface of the semiconductor substrate from the polarization component.

    SUBSTRATE PROCESSING APPARATUS
    4.
    发明公开

    公开(公告)号:US20230168278A1

    公开(公告)日:2023-06-01

    申请号:US17930819

    申请日:2022-09-09

    CPC classification number: G01R1/071 H01L21/6833 G02B27/283

    Abstract: A substrate processing apparatus includes: a chamber configured to perform a wet process and having an internal space, a chuck in the internal spaced and being configured for loading a semiconductor substrate thereon, a probe having an end above the chuck and including an electro-optical crystal and a reflective mirror on one surface of the electro-optical crystal, a measuring unit connected to the probe and configured to provide reference light to the probe, and to detect a polarization component of reflected light reflected from the one end of the probe by the reference light, and a controller configured to calculate an amount of electrostatic charge on a surface of the semiconductor substrate from the polarization component.

    Measuring apparatus for vacuum chamber and measuring system including the same

    公开(公告)号:US11169449B2

    公开(公告)日:2021-11-09

    申请号:US16655973

    申请日:2019-10-17

    Abstract: A measuring apparatus for a vacuum chamber capable of accurately measuring physical properties or quantities in the vacuum chamber in an exposure process in real time, and a measuring system including the measuring apparatus are described herein. The measuring apparatus includes: a body having a shape of an exposure mask used in an exposure process; and a measuring element in an interior of the body or on a first surface of the body. When the measuring apparatus is positioned in a vacuum chamber during the exposure process, the measuring apparatus is configured to measure physical properties in the vacuum chamber using the measuring element. The body or the measuring element is configured to withstand a vacuum in the vacuum chamber including resisting or preventing physical deformation of the body or the measuring element due to the vacuum.

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