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公开(公告)号：US20230408574A1
公开(公告)日：2023-12-21
申请号：US18240957
申请日：2023-08-31
发明人： Meehyun Lim , Sungyeol Kim , Hyungjung Yong , Jinyeong Yun
IPC分类号： G01R31/28 , H01L25/065 , H01L23/00
CPC分类号： G01R31/2803 , H01L25/0657 , H01L24/14 , G01R31/2815
摘要： A test method for a semiconductor device includes determining a contact failure between a first semiconductor chip and a second semiconductor chip during assembly of a semiconductor package including the first semiconductor chip and the second semiconductor chip, using a test circuit embedded in the first semiconductor chip, and after the assembly of the semiconductor package, determining whether the semiconductor package is defective by using the test circuit.
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公开(公告)号：US20240055243A1
公开(公告)日：2024-02-15
申请号：US18124954
申请日：2023-03-22
发明人： Taekjin Kim , Meehyun Lim , Sungyeol Kim , Junbum Park , Sungyoung Yoon , Jinyeong Yun , Jungchul Lee , Sungyong Lim , Sunghwi Cho
IPC分类号： H01J37/32 , H01L21/67 , H01L21/683
CPC分类号： H01J37/32972 , H01L21/67253 , H01L21/67069 , H01L21/6833 , H01J2237/24495
摘要： A semiconductor equipment monitoring apparatus including a wafer-type sensor inside a process chamber and configured to sense a plasma state inside the process chamber; a light detector and analyzer configured to detect and analyze light sensed by the wafer-type sensor; and a light coupler between the wafer-type sensor and the light detector and analyzer and configured to transmit the light sensed by the wafer-type sensor to the light detector and analyzer. The wafer-type sensor includes a plurality of sensors each comprising a passive element.
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3.发明公开公开(公告)号：US20230194591A1
公开(公告)日：2023-06-22
申请号：US17975202
申请日：2022-10-27
发明人： Jinyeong Yun , Meehyun Lim , Sungjin Kim , Masahiko Yamabe , Sungyeol Kim , Sungyong Lim , Sunghwi Cho
IPC分类号： G01R29/12 , H01L21/687 , H01L21/683 , H01L21/66
CPC分类号： G01R29/12 , H01L21/6833 , H01L21/68742 , H01L22/12
摘要： An electric field measuring apparatus includes an electrostatic chuck with a through hole and holding a wafer, a lift pin picking up the wafer, a driver vertically moving the lift pin along the through hole, a probe in the lift pin and having a refractive index changed by an electric field of the wafer, the probe including an electro-optical crystal, an optical waveguide forming at least one internal path of light having a polarization characteristic changed by the changed refractive index between the probe and the wafer, and a control module controlling the lift pin and the driver. The lift pin moves to first and second positions. The control module calculates a strength of the electric field of the wafer, using electric field data measured using the probe at each of the first and second positions.
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公开(公告)号：US20230168278A1
公开(公告)日：2023-06-01
申请号：US17930819
申请日：2022-09-09
发明人： Daesung Jung , Myeongock Ko , Meehyun Lim
IPC分类号： G01R1/07 , H01L21/683 , G02B27/28
CPC分类号： G01R1/071 , H01L21/6833 , G02B27/283
摘要： A substrate processing apparatus includes: a chamber configured to perform a wet process and having an internal space, a chuck in the internal spaced and being configured for loading a semiconductor substrate thereon, a probe having an end above the chuck and including an electro-optical crystal and a reflective mirror on one surface of the electro-optical crystal, a measuring unit connected to the probe and configured to provide reference light to the probe, and to detect a polarization component of reflected light reflected from the one end of the probe by the reference light, and a controller configured to calculate an amount of electrostatic charge on a surface of the semiconductor substrate from the polarization component.
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公开(公告)号：US12105132B2
公开(公告)日：2024-10-01
申请号：US17975202
申请日：2022-10-27
发明人： Jinyeong Yun , Meehyun Lim , Sungjin Kim , Masahiko Yamabe , Sungyeol Kim , Sungyong Lim , Sunghwi Cho
IPC分类号： G01R29/12 , H01L21/66 , H01L21/683 , H01L21/687
CPC分类号： G01R29/12 , H01L21/6833 , H01L21/68742 , H01L22/12
摘要： An electric field measuring apparatus includes an electrostatic chuck with a through hole and holding a wafer, a lift pin picking up the wafer, a driver vertically moving the lift pin along the through hole, a probe in the lift pin and having a refractive index changed by an electric field of the wafer, the probe including an electro-optical crystal, an optical waveguide forming at least one internal path of light having a polarization characteristic changed by the changed refractive index between the probe and the wafer, and a control module controlling the lift pin and the driver. The lift pin moves to first and second positions. The control module calculates a strength of the electric field of the wafer, using electric field data measured using the probe at each of the first and second positions.
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公开(公告)号：US11782085B2
公开(公告)日：2023-10-10
申请号：US16924971
申请日：2020-07-09
发明人： Meehyun Lim , Sungyeol Kim , Hyungjung Yong , Jinyeong Yun
IPC分类号： G01R31/28 , H01L23/00 , H01L25/065
CPC分类号： G01R31/2803 , G01R31/2815 , H01L24/14 , H01L25/0657
摘要： A test method for a semiconductor device includes determining a contact failure between a first semiconductor chip and a second semiconductor chip during assembly of a semiconductor package including the first semiconductor chip and the second semiconductor chip, using a test circuit embedded in the first semiconductor chip, and after the assembly of the semiconductor package, determining whether the semiconductor package is defective by using the test circuit.
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公开(公告)号：US20210156904A1
公开(公告)日：2021-05-27
申请号：US16924971
申请日：2020-07-09
发明人： Meehyun Lim , Sungyeol Kim , Hyungjung Yong , Jinyeong Yun
IPC分类号： G01R31/28 , H01L23/00 , H01L25/065
摘要： A test method for a semiconductor device includes determining a contact failure between a first semiconductor chip and a second semiconductor chip during assembly of a semiconductor package including the first semiconductor chip and the second semiconductor chip, using a test circuit embedded in the first semiconductor chip, and after the assembly of the semiconductor package, determining whether the semiconductor package is defective by using the test circuit.
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