公开(公告)号：US20240162184A1

公开(公告)日：2024-05-16

申请号：US18337113

申请日：2023-06-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sang-Sick Park ,  Un-Byoung Kang ,  Min Soo Kim ,  Seon Gyo Kim

IPC: H01L23/00 ,  H01L25/065 ,  H10B80/00

CPC classification number: H01L24/33 ,  H01L24/05 ,  H01L24/06 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L25/0657 ,  H10B80/00 ,  H01L2224/05568 ,  H01L2224/0557 ,  H01L2224/06181 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13118 ,  H01L2224/1312 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/17181 ,  H01L2224/2919 ,  H01L2224/3003 ,  H01L2224/30505 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/3303 ,  H01L2224/33181 ,  H01L2224/73104 ,  H01L2224/73253 ,  H01L2224/81191 ,  H01L2224/83193 ,  H01L2224/83201 ,  H01L2224/83856 ,  H01L2224/9211 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2225/06572 ,  H01L2924/0665 ,  H01L2924/067 ,  H01L2924/07025 ,  H01L2924/1432 ,  H01L2924/1433 ,  H01L2924/1436 ,  H01L2924/1437 ,  H01L2924/1441 ,  H01L2924/1443

Abstract: A semiconductor package includes a first structure, a first semiconductor chip on the first structure, a first conductive pad on the first structure between the first structure and the first semiconductor chip, a second conductive pad on a lower surface of the first semiconductor chip and vertically overlapping the first conductive pad, a bump connecting the first conductive pad and the second conductive pad, a first adhesive layer surrounding at least a part of side walls of the bump and side walls of the first conductive pad, and a second adhesive layer surrounding at least a part of the side walls of the bump and side walls of the second conductive pad, the second adhesive layer including a material different from the first adhesive layer, wherein a horizontal width of the first adhesive layer is smaller than a horizontal width of the second adhesive layer.

公开(公告)号：US11901339B2

公开(公告)日：2024-02-13

申请号：US17664565

申请日：2022-05-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sang-Sick Park ,  Min Soo Kim

IPC: H01L25/065

CPC classification number: H01L25/0657 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06582

Abstract: A semiconductor package includes a base substrate having a first semiconductor substrate, and a first protective layer covering a top side thereof. A first semiconductor chip is on the first protective layer. A first fillet layer fills a space between the first protective layer and the first semiconductor chip. A first side surface of the base substrate extends in a first direction, and second and third side surfaces extend in a second direction. The base substrate includes two corner regions and a side region between the corner regions. A first protective layer in the side region includes a first side trench which overlaps the first semiconductor chip. A part of the first fillet layer fills the first side trench.

公开(公告)号：US10760950B2

公开(公告)日：2020-09-01

申请号：US14168626

申请日：2014-01-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Min Soo Kim ,  Do Hyung Kim ,  Chang Yong Son ,  Kang Eun Lee ,  Shi Hwa Lee

IPC: G01H17/00 ,  A61B8/08 ,  A61B8/00

Abstract: An apparatus for processing data including a data compressor configured to compress ultrasonic data, and store the compressed ultrasonic data in a memory; and a data decompressor configured to read the stored ultrasonic data from the memory, decompress the read ultrasonic data, and transfer the decompressed ultrasonic data to a processor configured to perform beamforming.

公开(公告)号：US10598425B2

公开(公告)日：2020-03-24

申请号：US15917431

申请日：2018-03-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jin Seung Choi ,  Min Soo Kim ,  Sung Jin Park

IPC: F25D25/00 ,  F25D25/02 ,  A47B51/00 ,  A47B88/90 ,  A47B88/46 ,  F25D25/04 ,  A47B88/423

Abstract: Disclosed herein is a lifting apparatus and refrigerator having the same, by which a driving motor to generate driving force to vertically move a basket may be miniaturized and the load of the driving motor may be reduced. A refrigerator includes a main body, a storeroom formed inside the main body with an open front, a drawer slidingly coupled with the main body to open or close the storeroom and provided at a lower side thereof with a basket having storage space, and a lifting apparatus moving the basket vertically, wherein the lifting apparatus includes a driving motor, a driving shaft rotated by the driving motor, a lifting unit moving the basket vertically by means of rotational force of the driving shaft, and a coil spring coupled to the driving shaft and transferring energy in a direction in which the driving shaft is rotated to reduce a load of the driving motor, when the driving shaft is rotated to move the basket upward.

公开(公告)号：US10256658B2

公开(公告)日：2019-04-09

申请号：US15187083

申请日：2016-06-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyang Soo Hyun ,  Joo Han Kim ,  Jin Man Kim ,  Joo Hoon Lee ,  Chan Hun Yun ,  Kyu Jin Kwak ,  Min Soo Kim ,  Chul Hyung Yang ,  Ji Woo Lee

IPC: H02J7/00 ,  H02J7/02 ,  H02J50/90 ,  H04B5/00 ,  H02J50/10 ,  H02J50/12

Abstract: A method for operating an electronic device is provided. The method includes monitoring a noise level of a noise signal received via a panel while wireless power is transmitted and/or received at a first power level via at least a conductive pattern, and generating a signal for changing the first power level corresponding to at least a part of an input to at least a part of the panel.

公开(公告)号：US09964344B2

公开(公告)日：2018-05-08

申请号：US14312961

申请日：2014-06-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jin Han Kim ,  Il Ju Mun ,  Woo Hyek Choi ,  Young Dae Ko ,  Keon Kuk ,  Min Soo Kim

IPC: F25B21/00

CPC classification number: F25B21/00 ,  F25B2321/002 ,  F25B2321/0021 ,  F25B2321/0023 ,  Y02B30/66

Abstract: A magnetic cooling apparatus including a plurality of magnetic regenerators including a plurality of magnetocaloric materials to emit heat when magnetized and to absorb heat when demagnetized. The magnetic regenerators are rotatably disposed on a circumference having a predetermined radius, at least one coil is disposed on the circumference and coupled to the magnetic regenerators, and a plurality of permanent magnets is provided inside and outside the circumference to generate a magnetic field to magnetize or demagnetize the magnetic regenerators. The at least one coil interacts with the magnetic field generated by the permanent magnets to rotate the magnetic regenerators. The coil interacting with the magnetic field to magnetize or demagnetize the magnetic regenerators is coupled to the magnetic regenerators such that the magnetic regenerators reciprocate or rotate, thereby minimizing a size of the magnetic cooling apparatus, relative to the use of a motor. In addition, a member to switch a channel of a heat transfer fluid directly performs heat transfer between the heat transfer fluid and an external fluid, thereby minimizing heat loss.

公开(公告)号：US11612314B2

公开(公告)日：2023-03-28

申请号：US16759463

申请日：2018-10-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyung Jong Shin ,  Min Soo Kim ,  Chun Ryu ,  Eun Jun Park ,  Chang Ho Ha ,  Sangchul Yoon ,  Haksu Kyung

IPC: A61B3/107 ,  G16H30/40 ,  A61B3/00 ,  A61B3/14 ,  A61B5/02

Abstract: Disclosed are an electronic device and a method for determining a degree of conjunctival hyperemia using the same. The electronic device includes a camera and a processor configured to acquire an image including an eye captured by the camera, identify one or more blood vessels included in the image, and determine a degree of conjunctival hyperemia based on sizes of the identified one or more blood vessels.

公开(公告)号：US11153498B2

公开(公告)日：2021-10-19

申请号：US16473124

申请日：2017-12-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Byeong Chan Park ,  Min Soo Kim ,  In Koo Kang ,  Jong Hoon Won ,  Kwang Tai Kim ,  Dong Hyun Yeom ,  Ki Huk Lee

IPC: H04N5/225 ,  H04N5/235 ,  H04N5/369 ,  H04N5/14 ,  H04N5/232

Abstract: An electronic device includes an image sensor including a first pixel subset with a first sensitivity and a second pixel subset having with a second sensitivity, and a processor to process image data generated through the image sensor. The processor obtains image data through each of the first pixel subset and the second pixel subset, select at least one sub-image data based at least on the attribute information of the first sub-image data and the second sub-image data of the image data, and obtain focus information corresponding to the external subject using the selected sub-image data.

公开(公告)号：US11003753B2

公开(公告)日：2021-05-11

申请号：US16229294

申请日：2018-12-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Eun Young Oh ,  Min Soo Kim ,  Jong Moo Lee ,  Jin Wan An

IPC: G06F21/00 ,  G06F21/32 ,  G06K9/00 ,  G06F3/0488

Abstract: According to certain embodiments, an electronic device comprises a housing comprising a front surface and a rear surface oriented in a direction opposite to the front surface, a touchscreen display exposed through at least a portion of the front surface, a fingerprint sensor arranged between the touchscreen display and the rear surface underlapping a region of the touchscreen display when viewed from above the front surface, at least one processor operatively connected to the touchscreen display and the fingerprint sensor, and a memory operatively connected to the at least one processor, wherein the memory stores instructions for causing the at least one processor, when executed, to perform operations comprising displaying a user interface comprising an object on the touchscreen display, receiving a gesture input for dragging the object toward the region, the gesture input inputted through the touchscreen display, identifying whether a finger providing the gesture input is a predetermined finger registered for authentication through the fingerprint sensor, and activating the fingerprint sensor based at least in part on the identification.

公开(公告)号：US10533697B2

公开(公告)日：2020-01-14

申请号：US15769687

申请日：2016-10-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Myung Seob Song ,  Dae Hwan Kim ,  Min Soo Kim ,  Jin Seung Choi

IPC: F25D23/06 ,  F16L59/065

Abstract: Disclosed is a refrigerator including an ultrathin wall type insulating wall having a reduced thickness while maintaining insulating performance, so as to increase the capacity of a storage chamber. A vacuum insulating material is disposed inside the insulating wall so as to ensure the insulating performance of the insulating wall, and a foam material, in the portion in which the vacuum insulating material is not disposed, is disposed to be thicker than a foam material in the portion in which the vacuum insulating wall is disposed, such that the insulating wall, which maintains insulating performance while maintaining the insulating wall having an overall ultrathin shape, can be formed. Furthermore, auxiliary vacuum insulating materials are additionally disposed in the insulating wall corner regions in which the vacuum insulating material is not disposed, such that the ultrathin wall-type insulating wall is formed while maintaining the overall insulating performance of the refrigerator, thereby reducing the total thickness of the insulating wall so as to increase the capacity of the storage chamber, and enabling a slim design of the refrigerator such that the aesthetics of the refrigerator can be improved.