ELECTRONIC DEVICE HAVING DISPLAY
    7.
    发明申请

    公开(公告)号:US20220020321A1

    公开(公告)日:2022-01-20

    申请号:US17492012

    申请日:2021-10-01

    Abstract: An example device includes a housing including a first surface facing a first direction and a second surface facing a second direction; a transparent cover formed on at least a portion of the first surface of the housing; a display disposed between the transparent cover and the second surface; a sensor disposed between the display and the second surface; and a control circuit, electrically connected to the sensor, for controlling the sensor, wherein the display can include: a first region including a plurality of pixels capable of displaying color; and a second region aligned on at least a portion of the sensor such that light acquired from the outside of the electronic device passes through the sensor.

    ELECTRONIC DEVICE HAVING COMBINED BUTTON
    9.
    发明申请

    公开(公告)号:US20180157411A1

    公开(公告)日:2018-06-07

    申请号:US15827332

    申请日:2017-11-30

    Abstract: An electronic device may include a housing including a first surface facing a first direction and a second surface facing a second direction, the first direction being opposite that of the second direction, the first surface including a first opening and a second opening; a touch screen display being disposed and visible through the first opening; a mechanical button located at least in part of the second opening and movable in response to a pressure applied thereto; a processor located inside the housing and electrically coupled to the display and the mechanical button; and a memory located inside the housing and electrically coupled to the processor, wherein the memory stores a plurality of instructions that cause, upon execution, the processor to: display a screen on at least a portion of the touch screen display; display a virtual button comprising a graphical user interface (GUI) on a specific region of the screen adjacent to the mechanical button such that the GUI visually extends the mechanical button.

    METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

    公开(公告)号:US20250132198A1

    公开(公告)日:2025-04-24

    申请号:US18669981

    申请日:2024-05-21

    Abstract: A method of manufacturing a semiconductor device, the method includes forming interconnection lines buried in a first interlayer insulating layer, the interconnection lines having exposed upper surfaces, selectively forming a preliminary low dielectric constant layer including a polymer containing silicon (Si) or an oligomer containing silicon (Si) on an upper surface of the first interlayer insulating layer, forming a low dielectric constant layer by performing ultraviolet (UV) and ozone (O3) treatments on the preliminary low dielectric constant layer, forming an etch stop layer on the low dielectric constant layer, forming a second interlayer insulating layer on the etch stop layer, and forming a via connected to at least one of the interconnection lines by removing a portion of the second interlayer insulating layer and depositing a conductive material. The via has a shape bent along an upper surface and a side surface of the low dielectric constant layer.

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