公开(公告)号：US11438027B2

公开(公告)日：2022-09-06

申请号：US17029357

申请日：2020-09-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Lin Chen ,  Meiling Zhang ,  Qin Li ,  Wei Jiang ,  Jia Yan ,  Shaomin Zhang

IPC: H01Q1/24 ,  H01Q21/22 ,  H04B3/52 ,  H04B3/56 ,  H01Q21/00 ,  H04B7/15

Abstract: A base station antenna and a base station including the base station antenna are provided. A base station antenna includes a transceiver array configured to output M signals, wherein M is an integer greater than 1; an antenna array including N antenna units, wherein N is an integer greater than M; a first-level signal allocating network configured to allocate first power to the M signals, and output P signals, wherein P is an integer greater than M; a signal synthesizing network including multiple signal synthesizers, wherein each of the multiple signal synthesizers utilizes two signals of the P signals to synthesize two output signals; and a second-level signal allocating network configured to allocate second power to signals output by the multiple signal synthesizers, and output N signals to the N antenna units.

公开(公告)号：US09721902B2

公开(公告)日：2017-08-01

申请号：US14836301

申请日：2015-08-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Wei Jiang ,  Yiwei Ma ,  Jinpei Ju ,  Hongmei Hu ,  Qin Gong

IPC: H03F1/30 ,  H03F3/19 ,  H01L23/552 ,  H01L23/057 ,  H01L23/36 ,  H01L23/66 ,  H01L23/00

CPC classification number: H01L23/552 ,  H01L23/057 ,  H01L23/36 ,  H01L23/66 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L2223/6611 ,  H01L2223/6644 ,  H01L2224/291 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48195 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/1421 ,  H01L2924/15153 ,  H01L2924/16152 ,  H01L2924/16153 ,  H01L2924/16251 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: The present disclosure relates to a radio frequency (RF) unit of a base station, and more particularly, to a method of manufacturing an RF power amplifier module, an RF power amplifier module, an RF module, and a base station. The RF power amplifier module includes at least a power device, a power circuit board, a heat-dissipation substrate, and input/output ports. A power device die of the power device and the power circuit board are mounted on the heat-dissipation substrate. The power device die is connected to the power circuit board through packaging lead wires. In one exemplary embodiment, a heat-dissipation effect and manufacturing efficiency of the RF power amplifier module are improved and a cost of the RF power amplifier module is reduced.

公开(公告)号：US20210091821A1

公开(公告)日：2021-03-25

申请号：US17029357

申请日：2020-09-23

Applicant: Samsung Electronics CO., Ltd.

Inventor： Lin CHEN ,  Meiling Zhang ,  Qin Li ,  Wei Jiang ,  Jia Yan ,  Shaomin Zhang

IPC: H04B3/52 ,  H04B3/56 ,  H01Q21/22 ,  H01Q1/24

Abstract: A base station antenna and a base station including the base station antenna are provided. A base station antenna includes a transceiver array configured to output M signals, wherein M is an integer greater than 1; an antenna array including N antenna units, wherein N is an integer greater than M; a first-level signal allocating network configured to allocate first power to the M signals, and output P signals, wherein P is an integer greater than M; a signal synthesizing network including multiple signal synthesizers, wherein each of the multiple signal synthesizers utilizes two signals of the P signals to synthesize two output signals; and a second-level signal allocating network configured to allocate second power to signals output by the multiple signal synthesizers, and output N signals to the N antenna units.